wirebonding详细学习资料.ppt

WIREBONDPROCESSINTRODUCTION,CONTENTS,ASSEMBLYFLOWOFPLASTICICWireBond原理M/CIntroductionWireBondProcessMaterialSPECCalculatorDEFECT,封裝簡介,晶片Die,金線GoldWire,導線架Leadfram,WaferGrinding,DieBonding,WaferSaw,toaster,WireBonding,DieSurfaceCoating,Molding,LaserMark,SolderBallPlacement,Singulation,Packing,封裝流程,DejunkTRIM,SolderPlating,SolderPlating,DejunkTRIM,TRIM/FORMING,BGA,SURFACEMOUNTPKG,THROUGHHOLEPKG,WireBond原理,pad,lead,Goldwire,BallBond(1stBond),WedgeBond(2ndBond),Al,B.PRINCIPLE,銲接條件,HARDWELDINGPressure(Force)Amplify或著一個Die上出現不同Pad大小那就是以兩個Pad中心距離為BPP,但是一般我們要取一個Die上最小的BPP,BondPadPitch,BondPadOpen,BondPadOpen,BallSize,BallThickness,BallSizeBallSize=y;Area=(y/2)x/(y/2)=zg/mil,C,Ballbond,Testspecimen,Specimenclamp,Shearingram,Wire,Bondshoulder,Interfacialcontactballbondweldarea,Bondingpad,h,(A)Unsheared,C,L,C,Ballbond,C,L,Testspecimen,Specimenclamp,Bondingpad,Fullballattachedtowire-exceptforregionsofintermetallicvoiding,Ballseparatedatbondingpad-Ballinterface-residualintermetallic(andsometimesportionofunalloyedballandmetal)onpadinbondinteractionarea,(D)Ballbond-bondingpadinterfaceseparation(typicalAutoAl),C,Testspecimen,Specimenclamp,Shearingram,Wire,Minorfragmentofballattachedtowire,Bondingpad,C,L,Ballshearedtoohigh(offline,etc.)onlyaportionofshoulderandballtopremoved,Interfacialcontactballbondweldarea,(B)Wire(balltopand/orside)shear,C,Ballbond,C,L,Testspecimen,Specimenclamp,Bondingpad,Majorportionofballattachedtowire,Interfacialcontact-ballbondweldareaintact,(C)Belowcenterlineshear,ballshearedthrough(typicallyAutoAu),C,Ballbond,C,L,Testspecimen,Specimenclamp,Bondingpad,Padmetallizationseparatesfromunderlyingsurface,Residualpadonballball-padinterfaceremainsintact,(E)Bondpadlifts,Testspecimen,Specimenclamp,C,Ballbond,C,L,Bondingpad,Bondingpadlifts,takingportionofunderlyingsubstratematerialwithit,(F)Cratering,Residualpadandsubstrateattachedtoball,ball-padinterfaceremainsintact,ShearFailureModes,CraterTest,Calculate(I),UPTime=,(TotalActualProductionTimesTotalRepairTime),TotalActualProductionTime,DOWNTIMERATE=,TotalRepairTime,TotalActualProductionTimes,TotalOperatorActualRepairTime,TotalOperatorRepairFrequencyStoppages,TotalActualProductionTimesTotalOperatorRepairTime,TotalOperatorRepairFrequencyStoppages,TotalTechnicalActualRepairTimes,TotalTechnicalRepairFrequencyStoppages,MTTS(MEANTIMETOSTOP)=,MTBS(MEANTIMEBETWEENSTOP)=,MTTA(MEANTIMETOASSISTANCE)=,Calculate(II),MTBA(MeanTimeBetweenAssistance)=,TotalActualProductionTimesTotalTechnicanRepairTimes,TotalTechnicalRepairFrequencyStoppages,MTBF(MeanTimeBetweenFailure)=,TotalActualProductionTimesTotalTechnicianRepairTime,TotalChangePartsRepairFrequencyStoppage,規格寬度,製程寬度,規格上限-規格下限,6(公差),(上限or下限)-平均值,三個公差,CP(製程能力指標)=,CPK=,=,Quality,正常品MaterialProblem1stBondissue(Peeling,BallLift,OffCenter)2ndBondissue(滑針，縫點脫，shorttail)LoopingFail(wiresnakewire，sweepwireloopbasebent),正常品,MaterialProblem,WithBall,Wire,PadSize,MissingBall,WireBroken,BondingBallInspection,BallDetection,BallSize,PadCenter,BallCenter,BallPlacement(X,Y),BallOffPad,BondingBallInspection(cont.),BallMeasurement,Peeling,1stBondFail(I),BallLift,1stBondFail(II),BallLift,NeckCrack,1stBondFail(III),OffCenter,1stBondFail(IV),OffCenterBall,1stBondFail(V),SmashBall,SmashBall,WithWeld,Wire,CapillaryMark,MissingWeld,WireBroken,Lead,BondingWeldInspection,WeldDetection,2ndBondFail(I),滑針,2ndBondFail(II),縫點脫落,LoopingFail(WireShortI),WireSweep,LoopingFail(WireShortII),LoopBaseBend,LoopingFail(WireShortIII),ExcessiveLoop,WireShort,THEEND,