pcb板制作工艺流程介绍课件

单击此处编辑母版标题样式,单击此处编辑母版文本样式,第二级,第三级,第四级,第五级,学习改变命运,知识创造未来,学习成就理想知识创造未来,16 十一月 2024,pcb板制作工艺流程介绍,25 九月 2023pcb板制作工艺流程介绍,1,Pre-engineering,Pattern imaging,Etching,Laminating,Drilling,Cu plating,Hole plugging,Pattern imaging,Lamination,Laser Ablation,Mechanical drilling,Pattern imaging,Cu plating,Solder Mask,Surface Finished,Routing,Visual inspection,Electric test,Shipping,pcb板制作工艺流程介绍,Pre-engineeringPattern imaging,2,Pre-engineering,Pattern imaging,Etching,Laminating,Drilling,pcb板制作工艺流程介绍,Pre-engineeringPattern imaging,3,Desmear,Cu plating,Hole plugging,Cu plating,Belt Sanding,pcb板制作工艺流程介绍,DesmearCu platingHole plugging,4,Lamination,Laser Ablation,Mechanical drilling,Cu plating,Pattern imaging,pcb板制作工艺流程介绍,LaminationLaser AblationMechan,5,Solder Mask,Gold plating,Routing,Electrical test,Pattern imaging,pcb板制作工艺流程介绍,Solder MaskGold platingRouting,6,Hole counter,Shipping,Visual inspection,pcb板制作工艺流程介绍,Hole counterShippingVisual ins,7,*Raw material(Thin Core,Copper,Prepreg.),Raw Material,:FR-4(Difuntional,Tetrafuntional),Supplier,:EMC,Nan-Ya,Sheet size,:36,”,*48,”,40,”,*48,”,42,”,*48,Core Thickness,:0.003,”,0.004,”,0.005,”,0.006,”,0.008,”,0.010,”,0.012,”,0.015,”,0.021,”,0.031,”,0.039,”,0.047,”,Copper Foil,:1/3 oz,1/2 oz,1.0 oz,2 oz,Prepreg type,:1080,2113,2116,1506,7628,7630,pcb板制作工艺流程介绍,*Raw material(Thin Core,Copp,8,1.內層基板(THIN CORE),Laminate,Copper Foil,裁板,(Panel Size),COPPER FOIL,Epoxy Glass,pcb板制作工艺流程介绍,1.內層基板(THIN CORE)LaminateCopp,9,Photo Resist,2.內層線路製作(壓膜)(Dry Film Resist Coat),Etch Photoresist(D/F),pcb板制作工艺流程介绍,Photo Resist2.內層線路製作(壓膜)(Dry,10,Photo Resist,3.內層線路製作(曝光)(Expose),A/W,Artwork,(底片),Artwork,(底片),After Expose,Before Expose,pcb板制作工艺流程介绍,Photo Resist3.內層線路製作(曝光)(Expo,11,4.內層線路製作(顯影)(Develop),Photo Resist,pcb板制作工艺流程介绍,4.內層線路製作(顯影)(Develop)Photo Re,12,5.內層線路製作(蝕刻)(Etch),Photo Resist,pcb板制作工艺流程介绍,5.內層線路製作(蝕刻)(Etch)Photo Resis,13,6.內層線路製作(去膜)(Strip Resist),pcb板制作工艺流程介绍,6.內層線路製作(去膜)(Strip Resist)pcb,14,7.黑氧化(Oxide Coating),pcb板制作工艺流程介绍,7.黑氧化(Oxide Coating)pcb板制作工艺,15,8.疊板(Lay-up),LAYER 2,LAYER 3,LAYER 4,LAYER 5,LAYER 1,LAYER 6,Layer 1,Layer 2,Layer 3,Layer 4,Copper Foil,Copper Foil,Inner Layer,Prepreg(膠片),Prepreg(膠片),pcb板制作工艺流程介绍,8.疊板(Lay-up)LAYER 2LAYER 3LA,16,9.壓合(Lamination),pcb板制作工艺流程介绍,9.壓合(Lamination)pcb板制作工艺流程介绍,17,典型之多層板疊板及壓合結構,.,.,.,COPPER FOIL 0.5 OZ,Thin Core,FR-4,prepreg,COMP,S0LD.,prepreg,Thin Core,FR-4,prepreg,COPPER FOIL 0.5 OZ,疊合用之鋼板,疊合用之鋼板,10-12層疊合,壓合機之熱板,壓合機之熱板,COPPER FOIL 0.5 OZ,Thin Core,FR-4,prepreg,COMP,S0LD.,prepreg,Thin Core,FR-4,prepreg,COPPER FOIL 0.5 OZ,疊合用之鋼板,疊合用之鋼板,pcb板制作工艺流程介绍,典型之多層板疊板及壓合結構.COPPER FOIL 0.5,18,墊木板,鋁板,10.鑽孔(Drilling),pcb板制作工艺流程介绍,墊木板鋁板10.鑽孔(Drilling)pcb板制作工艺,19,11.電鍍Desmear&Copper Deposition,pcb板制作工艺流程介绍,11.電鍍Desmear&Copper Deposit,20,12.塞孔(Hole Plugging),13.去溢膠(Belt Sanding),pcb板制作工艺流程介绍,12.塞孔(Hole Plugging)13.去溢膠(,21,14.減銅(Copper Reduction)Option,15.去溢膠(Belt Sanding)Option,pcb板制作工艺流程介绍,14.減銅(Copper Reduction)Op,22,16.外層壓膜 Dry Film Lamination(Outer layer),Photo Resist,pcb板制作工艺流程介绍,16.外層壓膜 Dry Film Lamination(,23,17.外層曝光 Expose,UV光源,pcb板制作工艺流程介绍,17.外層曝光 ExposeUV光源pcb板制作工艺流程介,24,18.After Exposed,pcb板制作工艺流程介绍,18.After Exposedpcb板制作工艺流程介绍,25,19.外層顯影 Develop,pcb板制作工艺流程介绍,19.外層顯影 Developpcb板制作工艺流程介绍,26,20.蝕刻 Etch,pcb板制作工艺流程介绍,20.蝕刻 Etchpcb板制作工艺流程介绍,27,20.去乾膜 Strip Resist,pcb板制作工艺流程介绍,20.去乾膜 Strip Resistpcb板制作工艺流程,28,21.壓合(Build-up Layer Lamination),RCC,(,R,esin,C,oated,C,opper foil),pcb板制作工艺流程介绍,21.壓合(Build-up Layer Laminati,29,21.護形層製作(壓膜)(Conformal Mask),Dry Film,(乾膜),Dry Film,(乾膜),pcb板制作工艺流程介绍,21.護形層製作(壓膜)(Conformal Mask,30,Artwork,(底片),Artwork,(底片),22.護形層製作(曝光)(Conformal Mask),Before Exposure,After Exposure,pcb板制作工艺流程介绍,ArtworkArtwork22.護形層製作(曝光)(,31,23.護形層製作(顯像)(Conformal Mask),pcb板制作工艺流程介绍,23.護形層製作(顯像)(Conformal Mask)p,32,24.護形層製作(蝕銅)(Conformal Mask),pcb板制作工艺流程介绍,24.護形層製作(蝕銅)(Conformal Mas,33,25.護形層製作(去膜)(Conformal Mask),pcb板制作工艺流程介绍,25.護形層製作(去膜)(Conformal Mask)p,34,26.雷射鑽孔(Laser Ablation)及機械鑽孔,pcb板制作工艺流程介绍,26.雷射鑽孔(Laser Ablation)及機械鑽,35,Mechanical Drill,(P.T.H.),Laser Microvia,(Blind Via),27.機械鑽孔(Mechanical Drill),pcb板制作工艺流程介绍,Mechanical DrillLaser Microvia,36,28.電鍍(Desmear&Copper Deposition),pcb板制作工艺流程介绍,28.電鍍(Desmear&Copper Deposi,37,29.外層線路製作(Pattern imaging),壓膜,(D/F Lamination),pcb板制作工艺流程介绍,29.外層線路製作(Pattern imaging)壓膜,38,曝光,(Exposure),顯像,(D/F Developing),pcb板制作工艺流程介绍,曝光(Exposure)顯像(D/F Developing),39,蝕銅,(Etching),去膜,(D/F Stripping),pcb板制作工艺流程介绍,蝕銅(Etching)去膜(D/F Stripping),40,30.防焊(綠漆)製作(Solder Mask),pcb板制作工艺流程介绍,30.防焊(綠漆)製作(Solder Mask)pcb板,41,WWEI,94V-0,R105,31.S/M 顯像(S/M Developing),32.印文字(Legend Printing),pcb板制作工艺流程介绍,WWEIR10531.S/M 顯像(S/M Develo,42,33.浸金(噴錫)製作(Electroless Ni/Au,HAL),WWEI,94V-0,R105,pcb板制作工艺流程介绍,33.浸金(噴錫)製作(Electroless Ni/,43,WWEI,94V-0,R105,Dedicate or universal Tester,Flying Probe Tester,34.成型(Profile),35.測試(Electrical Testing),pcb板制作工艺流程介绍,WWEIR105Dedicate or universal,44,WWEI,94V-0,R105,WWEI,94V-0,R105,36.終檢(Final Inspection),37.O.S.P.(entek plus Cu_106A.),Option,pcb板制作工艺流程介绍,WWEIR105WWEIR10536.終檢(Final,45,LASER BLIND&BURIED V