双面Reflow 改单面Reflow

,Click to edit Master title style,Click to edit Master text styles,Second level,Third level,Fourth level,Fifth level,*,Global Operations-China Engineering,Click to edit Master title style,Click to edit Master text styles,Second level,Third level,Fourth level,Fifth level,*,Global Operations-China Engineering,Design.Build.Ship.Service.,Global Operations-China Engineering,Global Operations-China Engineering,World-Wide Global Operations Engineering Best Practice Conf-Call,Eng-BP-Concall-030:,Single Reflow Soldering Process Development for Dell Fleming Project,Tonny Tong,Nov 20,2008,Topics,Team Member,Products Overview,Current Process Flow,Single Reflow Process Flow,Qualification Run,Summary,Team Members,Team Member List,Department,Name,Contact,E-mail address,AME,Steven Yang,159 1633 2645,Steven Y,AME,Deepak Nagar,137 0264 3497,Deepak.N,AME,Tonny Tong,131 3813 0731,Tonny.T,PE,Brian Huang,138 2300 3292,Brian H,PE,Juky Liang,134 1770 7192,Juky.L,PE,Shawn Xiao,159 9266 8319,Shawn.X,Program,Jim luo,138 2303 8858,Jim.L,Program,Desiree Cheung,138 2413 6762,Desiree.Cheung ,MBU,Jack Tang,138 2419 6139,Jack.Tang ,EE,Akron Lee,136 9773 6196,Akron L,QA,Noah Yu,159 8977 6211,Noah.Y,A dedicated team lead by AME comprising active members from PE,EE,QA,MBU were formed to work for single reflow process development.,Product Overview,Product information,Customer :Dell,Products :Mother board,Build model :OEM,PCB size :266.7mm x 269.2mm x 1.55mm,Surface finish:OSP,Parts number:1500,Components :CPU,socket,0402,DIMM,PCIE,Process flow :SMT+SI+W/S,Process Challenges,OSP finish and PTH hole fill,High volume and cost control,Dell mother board,Product overview,Different model,Dell Fleming MT,Dell Fleming DT,Dell Fleming SFF,PCB size:267*269*1.6mm,PCB size:243*267*1.6mm,PCB size:203*265*1.6mm,All Dell mother board total have approx 30-40pcs chip components on bottom side.,Bottom side of mother board,There are total 30-40pcs chip components on bottom side,the biggest comp is 0805 capacitor,0603 capacitor,0805 capacitor,Components at Bottom Side,Current Double Reflow Process Flow,DEK Printer,HS-50-1,JT Reflow Oven,DEK Printer,Top side,HS-60-2,HF3,AOI,JT Reflow oven,Wave solder,HS-60-1,Bottom side,Single Reflow Process flow,DEK Printer,HS-50-1,JT Reflow Oven,DEK Printer,Top side,HS-60-2,HF3,AOI,JT Reflow oven,Wave solder,N2 using,HS-60-1,Bottom side,Cancel bottom side reflow,Flip machine instead,Flip machine,Benefit,Single reflow process helps on solder joint reliability due to less thermal impact and IMC growth comparing double reflow process,Benefit hole fill due to less OSP performance degrading,Minimized process control station,Minimized manual handling,Cost saving to 60KUSD per line per year,Single Reflow Process flow,Cost saving calculation,Special station,Special handling challenge,Add a flip machine,Add support block for P/P(pending),Cost saving,Cancel bottom side reflow,(300KRMB/60Month)=5000RMB/day,Cancel pallet of bottom side,(30pcs*1000rmb)=30kRMB,Saving manpower(2person/per line),1500*2=3000RMB/Month,Saving electrical power,(15kw*24h*30*0.72rmb=7800RMB/Month),Saving nitrogen,(18000RMB/Month),Cost saving:Reflow depreciation expenses 5000/Month+manpower 3000/Month+electrical power 7800/Month+nitrogen saving 18000/Month=33800RMB/Month,Total save 33800RMB/line if the new process conduct successfully.,Cost saving,Feasibility Assessment-Solder Paste Tacky Force,Tamura TLF 204 parameter,JIS-Z-3284(1994)test standard,JIS-Z-3284 test,Solder paste tacky force/per mm,Tacky force from the solder paste spec is 1.5N(approx 150g).,The test area=3.14*(5.1/2)=19.94mm.,Per mm paste tacky force=150/19.94=7.52g/mm,2,2,2,2,2,5.1mm,6.5mm,Solder paste,Paste height 0.2mm,Test probe,1.5N,Feasibility Assessment-Solder Paste Tacky Force,W,T,L,BW,B,Solder Metal,Barrier,External Electrodes,Inner Electrodes,Dimensions(mm)inches,EIA style L W,Tmax,.,BWmin,Bmin,.,0201 0.600.03 0.300.03 0.33 0.10 0.20,.02.002 .01.002 .013 .004 .008,0402 1.000.05 0.500.05 0.55 0.15 0.30,.04.002 .02.002 .022 .006 .012,0603 1.600.10 0.800.10 0.90 0.15 0.40,.06.004 .03.004 .035 .006 .016,0805 2.000.20 1.250.25 1.45 0.20 0.70,.08.008 .05.008 .057 .008 .028,1206 3.200.30 1.600.20 1.80 0.30 1.50,.12.012 .06.008 .071 .012 .059,1210 3.200.30 2.500.20 2.00 0.30 1.60,.12.012 .10.008 .079 .012 .063,1808 4.600.30 2.000.20 2.20 0.30 2.00,.18.012 .08.008 .087 .012 .079,1812 4.600.30 3.200.30 2.60 0.30 2.00,.18.012 .12.012 .102 .012 .079,2220 5.700.40 5.000.40 3.00 0.30 2.00,.22.016 .20.016 .118 .012 .079,Feasibility Assessment,-,Components Size,Feasibility Assessment,-Comp Tacky Force Calculation,1.25mm,0.2mm,Through the calculation,it obviously shows that tacky force from solder paste is highly safe to prevent SMD components falling from transportation and flip during assembly.,components tacky force calculation,Primary conclusion,0805 capacitor electrodes size,paste tacky force,0805 capacitor tacky force,0805 capacitor weight,1206 capacitor weight,1206 transistor,0.2*1.25*2=0.5mm,150/19.94=7