introductionofLEDpackagematerials

单击此处编辑母版标题样式,单击此处编辑母版文本样式,第二级,第三级,第四级,第五级,*,Huitian technology:,Encapsulant, DA paste for LED,Dr. Zhjian Pan,panzhijian,Apr 2013,Introduction for LED adhesive (encapsulant, DA paste),Silicone tech. vs. non-silicone tech.,How to improve the long-term lumen,Mechanism of yellowing issue,Low adhesion for silicone,CTQs collection,Outline:,Encapsulant (NRI),Encapsulant (HRI),Die Attach paste,(non-conductive),Huitians product,EN 5351,EN 5351-LV,EN 5351-CER,EN 5352,EN 5352-LH,DA 9500,Application,Encapsulant,SMD, HB LED, COB, molding, multi-chip, insertion mount,Encapsulant,SMD, COB, molding, multi-chip,DA Paste for sapphire LED, SMD, HB LED, COB, molding, multi-chip,Advantage,Lumen enhance:,13%,Lumen enhance:,13%,Lumen enhance in reliability test:,15%,1. LED adhesive (encapsulant, DA paste),D/A paste,encapsulant,Huitians technology makes your LED more bright, and long life!,Silicone Gel,Encapsulant (epoxy),Scattering reinforced material,Huitians product,EN 5270F,EN 6222,5351-SRM,5352-SRM,Application,Lens filled materials,Encapsulant,SMD, COB, molding, multi-chip,SMD, HB LED, COB, molding, multi-chip,Advantage,Good toughness, high reliability,Gas barrier, yellowing resistance,Rough surface, scattering the light,1. LED adhesive (encapsulant, DA paste),Huitians technology makes your LED more bright, and long life!,Application,Key performance,EN 5351,SMT, COB (Al), molding,High reliability for different package,EN 5351-LV,SMT, COB (AL, Ceramic),Low viscosity, good processability for small package.,EN 5351-CER,COB (Ceramics),High reliability on COB (ceramic), high adhesion on ceramics.,EN 5352,SMT,Good gas-barrier performance,EN 5352-LH,SMT, COB,High reliability for different package,DA 9500,Sapphire LED,High adhesion at high temperature,1. LED adhesive,推荐应用,特点,EN 5351,SMT, COB (,铝基板,),模塑成型,通用型，各种封装形式均具有高可靠性。,EN 5351-LV,SMT, COB (,铝基板，陶瓷基板,),低粘度型，适用于高速点胶，推荐用于小尺寸的,SMT,封装。,EN 5351-CER,COB (Ceramics),在陶瓷基板上优异粘接性，以及高可靠性。,EN 5352,SMT,高折苯基有机硅，优异的阻隔性能。,EN 5352-LH,SMT, COB,低硬度高折有机硅，在各种封装中具有高可靠性。,DA 9500,蓝宝石芯片,优异的高温粘接性，减少打线掉晶率。,1.,应用介绍,EN 5351,EN 5351-LV,EN5351-CER,EN 5352,EN 5352-LH,DA 9500,General description,Two part, refractive index (1.41), silicone encapsulant,Two part, refractive index(1.52), silicone encapsulant,One-part, silicone DA paste,Application,LED encapsulant, e.g. SMD, HB LED, COB, molding, multi-chip, insertion mount,LED encapsulant, e.g. SMD, COB, molding, multi-chip,Die Attach paste for sapphire LED, e.g. SMD, HB LED, COB, molding, multi-chip,，直插式,Appearance,Before cure: colorless, transparent, viscous liquid,After cure: colorless, transparent, solid or elastomer,Before cure: colorless, transparent, viscous liquid,After cure: colorless, transparent, solid or elastomer,Before cure: colorless, transparent, viscous liquid,After cure: colorless, transparent, solid,Curing process,Preferred: in air, 80 60mins, 150 120mins.,Optional: in air, 150 for 180mins.,Preferred: in air, 80 60mins, 150 120mins.,Optional: in air, 150 for 180mins.,Preferred: in air, 150 60mins, 170 for 60mins.,Optional: in air, 150 for 60mins.,1. Advantage of EN 5351 (NRI):,methyl type, NRI (1.41), and no yellowing issue,tailored modulus & hardness for different package,good gas barrier performance & high cross-linking,high reliability,Key performance,Testing,criteria,Initial transmittance,UV-Vis spectroscopy, 1mm thickness, 400nm,95%,Transmittance in heat-aging,UV-Vis spectroscopy, 1mm thickness, 400nm, 175, 1000hrs,95%,Transmittance in UV-aging,UV-Vis spectroscopy, 1mm thickness, 400nm, UV aging, 1000hrs,95%,Refractive index,Abbe Refractometer,1.40(25,),Anti-crack, no delamination, CTE,1. red-ink test after thermal cycle & thermal shock,2. Do not break the wire in reliability test,Pass,Gas barrier property,H,2,O: 23 g/m,2,*d,Phosphor sedimentation,Pass,Viscosity,Brookfield, CP51, 5rpm,5000cp,5351-LV:3000cp,Work-life,Viscosity increase 30%,8hrs,Shelf life,6 months,1. Advantage of EN 5352 (HRI):,phenyl type, NRI (1.52), and high initial-lumen,good gas barrier performance,high reliability,Key performance,Testing,criteria,Initial transmittance,UV-Vis spectroscopy, 1mm thickness, 400nm,90%(450nm),Transmittance in heat-aging,UV-Vis spectroscopy, 1mm thickness, 400nm, 175, 1000hrs,80%(450nm),Transmittance in UV-aging,UV-Vis spectroscopy, 1mm thickness, 400nm, UV aging, 1000hrs,80%(450nm),Refractive index,Abbe Refractometer,1.51(25,),Anti-crack, no delamination, CTE,1. red-ink test after thermal cycle & thermal shock,2. Do not break the wire in reliability test,pass,Gas barrier property,H,2,O: 6 g/m,2,*d,Phosphor sedimentation,Pass,Viscosity,Brookfield, CP51, 5rpm,4000cp, T.I. 0.82,Work-life,Viscosity increase 30%,8hrs,Shelf-life,6months,1. Advantage of DA 9500:,high Lumen & high transmittance in any aging test,excellent adhesion & formulation,high thermal conductivity, low lumen drop,high reliability,Key performances,Testing,criteria,Initial transmittance,UV-Vis spectroscopy, 1mm thickness, 400nm,95%,Transmittance in heat-aging,UV-Vis spectroscopy, 1mm thickness, 400nm, 175, 1000hrs,95%,Transmittance in UV-aging,UV-Vis spectroscopy, 1mm thickness, 400nm, UV aging, 1000hrs,95%,adhesion,Alglass:,AlPC:,AlPET:,3Mpa,1.5Mpa,1.5Mpa,viscosity,Brookfield, CP51, 5rpm,40006000cp, T.I. 0.82,Work-life,Viscosity increase 30%,24hrs,Shelf-life,12months,Key performance,Testing,EN 5351,EN 5352,DA 9500,Initial transmittance,UV-Vis spectroscopy, 1mm thickness, 400nm,95%,90%(450nm),95%,Transmittance in heat-aging,UV-Vis spectroscopy, 1mm thickness, 400nm, 175, 1000hrs,95%,80%(450nm),95%,Transmittance in UV-aging,UV-Vis spectroscopy, 1mm thickness, 400nm, UV aging, 1000hrs,95%,80%(450nm),95%,Refractive index,Abbe Refractometer,1.41,1.52,NA,Anti-crack, no delamination, CTE,1. red-ink test after thermal cycle & thermal shock,2. Do not break the wire in reliability test,Pass,pass,NA,Gas barrier property,23 g/m2*d,6 g/m2*d,NA,hardness,Shore D,40,NA,65,Phosphor sedimentation,Pass,pass,NA,adhesion,NA,NA,Alglass: 3Mpa,AlPC: 1.5Mpa,AlPET: 1.5Mpa,Viscosity,Brookfield, CP51, 5rpm,5000cp,4000cp, T.I. 0.82,40006000cp, T.I. 0.82,Work-life,Viscosity increase 30%,8hrs,8hrs,24hrs,Shelf life,6months,6months,12months,Non-silicone tech.,Silicone tech.,advantage,Excellent adhesion strength,High reliability in harsh conditions,High modulus & hardness,good gas barrier, no black issue on LF,No contamination for wire-bonding issue,moderate CTE,Transparent, colorless, stable, no yellowing in any aging test,Lumen decay comes from the chips aging, leadframe corrosion, phosphor aging,Dis,-,advantage,Yellowing in harsh aging test,L,umen decay comes from the materials yellowing,Weak adhesion, delamination,Worst reliability,Low gas barrier, black issue sometimes,Soft, low modulus, low hardness,Serious contamination, harmful for wire-bonding,High CTE,2. Silicone vs. non-silicone,The lumen decay of LED comes from:,1. The material yellowing (DA paste, encapsulant).,2. The chip works at high T, so the chip get worse quickly,3. The phosphor works at high T, so it get worse quickly,4. The leadframe corrosion can cause low reflection,Conclusion:,1. The yellowing issue of materials can make the lumen drop.,2. For HB LED (300mA), the thermal conductivity is key for the lumen decay and devices worklife. Over 80% heat gets through the paste and LF. So the thermal conductivity of DA paste is key for the worklife of chips.,DA paste with high thermal can decrease the junction T effectively, and prolong the worklife of device, and then prohibit the lumen decay in harsh conditions.,3. Gas barrier property,3. How to improve the long-term lumen:,Colorless :,Frequency,Wave length,4. Mechanism of yellowing issue:,The wheel of complementary color,Frequency,Wave length,Colorless :,Frequency,Wave length,Colorless :,Frequency,Wave length,4. Yellowing issue: polymer degradation,Ref: http:/www.Specialchem4adhesives.Com,Ref:,黄玮等，核技术，,2002, Vol 25, 65-70,Ref: Hideki Abe, Macromol. Biosci. 2006, Vol 6, 469486,Ref: Xavier colin,c. R. Chimie, 2006, Vol,9,13801395,Ref: Su hua ding et al, construction and building materials, 2006, Vol 20, 878-881,Ref: Ibnelwaleed a. Hussein, polymer degradation and stability, 2007, Vol 92, 2026-2032,Ref: T.O. Kumnayaka et al, korea-australia rheology journal, 2010, Vol. 22, 173-177,Root cause:,conjugated double-bond,Tertial H & rearrangement action,branch chain or side functional group,Un-terminated end group,Donor group (N, S, P),4. Yellowing issue: root cause and conclusion,Conclusion:,All materials (epoxy, acrylate, PI, polyolefin, polyester) would decompose slowly under the heat, stress, UV exposure. The component with double bond is generated more and more. Then, the appearance also changes from the colorless to yellow to dark black.,The silicone would also decompose and it thermal-stability is worse than PI. But, the decomposed silicone only has the single bond, and it is colorless for ever.,Examples:,5. Low adhesion for silicone,Silicone structure,Low adhesion:,without any polar groups, without chemical bonds on the surface,A (silicone),B (silicone),HuiTian DA,epoxy,80*80mil Si die, Ag LF, room temperature,3Kg,4Kg,4.5Kg,1012Kg,120*120mil Si die, Ag LF, 160,2Kg,3.5Kg,2.5Kg,3.7Kg,5. How to enhance the adhesion,Why does DA9500 achieve the good mechanical performance?,High branch structure can improve the hardness.,The more cross-link reaction can improve the adhesion more.,6. CTQs collection: Encapsulant,items,priority,method,criteria,Initial transmittance,90%?,Transmittance in heat-aging,90%?,Transmittance in UV-aging,90%?,Anti-crack,Gas barrier property,hardness,Shore A, Shore D?,tacky,Phosphor sedimentation,viscosity,25005000cp,Mixing process,Work-life,RT,8hrs?,Curing process,Temperature? time?,The encapsulant is two-part adhesive.,Benchmark:,6. CTQs collection: Die Attach paste,items,priority,method,criteria,Initial transmittance,90%?,Transmittance in heat-aging,90%?,Transmittance in UV-aging,90%?,Adhesion,Substrate? Temperature?,Viscosity,4000cp10000cp, T.I. 13,processability,Curing process,Temperature? Time?,DA paste is one-part adhesive.,Benchmark:,7. Free topic:,What is the key performance for encapsulant? Refractive index or gas-barrier property?,If the refractive index transfers from 1.4 to 1.5 for encapsulant, how much is the improvement for lumen?,The encapsulant with epoxy+anhydride can achieve high RI & excellent gas-barrier property, but a little yellowing issue. What is the comments?,What is the promising technology for chip substrate? Sapphire? SiC? GaN?,How much is the lumen improvement for flip chip?,7. Free topic:,Why does the lumen go up for silicone encapsulant for initial heat-aging test?,Does the phosphor cause the lumen drop? How much?,Low transmittance for OE6370, why is it so popular?,What is application for silicone gel,？,Why do you need the sample with low hardness?,If the work-life is extended into 12 or 24hrs, is it attractive for LED application?,Any Questions?,