pcb专业英语80282

按一下以編輯母片標題樣式,按一下以編輯母片本文樣式,第二層,第三層,第四層,第五層,*,*,Process Module,說明,:,A.,下料,(,Cut Lamination),a-1,裁板,(,Sheets Cutting),a-2,原物料發料,(,Panel)(Shear material to Size),B.,鑽孔,(,Drilling),b-1,內鑽,(,Inner Layer Drilling ),b-2,一次孔,(,Outer Layer Drilling ),b-3,二次孔,(2,nd Drilling),b-4,(,Laser Drilling )(Laser Ablation ),b-5,盲,(,埋,) (,Blind & Buried Hole Drilling),C.,乾膜製程,(,Photo Process(D/F),c-1,前處理,(,Pretreatment),c-2,壓,膜,(,Dry Film Lamination),c-3,曝,光,(,Exposure),c-4,顯,影,(,Developing),c-5,蝕銅,(,Etching),c-6,去膜,(,Stripping),c-7,初檢,(,Touch-up),c-8,化學前處理,化學研磨,(,Chemical Milling ),c-9,選擇性浸金壓膜,(,Selective Gold Dry Film Lamination),c-10,顯 影,(,Developing ),c-11,去膜,(,Stripping ),D.,壓,合,Lamination,d-1,黑,化,(,Black Oxide Treatment),d-2,微,蝕,(,Microetching),Developing , Etching & Stripping ( DES ),1,d-3,鉚釘組合,(,eyelet ),d-4,疊板,(,Lay up),d-5,壓,合,(,Lamination),d-6,後處理,(,Post Treatment),d-7,黑氧化,(,Black Oxide Removal ),d-8,銑靶 (,spot face),d-9,去溢膠,(,resin flush removal),E.,減銅,(,Copper Reduction),e-1,薄化銅,(,Copper Reduction),F.,電鍍,(,Horizontal Electrolytic Plating),f-1,水平電鍍 (,Horizontal Electro-Plating) (Panel Plating),f-2,錫鉛電鍍,(,Tin-Lead Plating ) (Pattern Plating),f-3,低於,1,mil ( Less than 1 mil Thickness ),f-4,高於,1,mil ( More than 1 mil Thickness),f-5,砂帶研磨,(,Belt Sanding),f-6,剝錫鉛,(,Tin-Lead Stripping),f-7,微切片,(,Microsection),G.,塞孔,(,Plug Hole),g-1,印刷,(,Ink Print ),g-2,預烤,(,Precure),g-3,表面刷磨,(,Scrub),g-4,後烘烤,(,Postcure),H.,防焊,(,綠漆,): (,Solder Mask),h-1 C,面印刷,(,Printing Top Side),h-2 S,面印刷,(,Printing Bottom Side),h-3,靜電噴塗,(,Spray Coating),h-4,前處理,(,Pretreatment),h-5,預烤,(,Precure),h-6,曝光,(,Exposure),h-7,顯影,(,Develop),h-8,後烘烤,(,Postcure),2,h-9 UV,烘烤,(,UV Cure),h-10,文字印刷,(,Printing of Legend ),h-11,噴砂,(,Pumice)(Wet Blasting),h-12,印可剝離防焊,(,Peelable Solder Mask),I .,鍍金,Gold plating,i-1,金手指鍍鎳金,(,Gold Finger ),i-2,電鍍軟金,(,Soft Ni/Au Plating),i-3,浸鎳金,(,Immersion Ni/Au) (Electroless Ni/Au),J.,噴錫,(,Hot Air Solder Leveling),j-1,水平噴錫,(,Horizontal Hot Air Solder Leveling),j-2,垂直噴錫,(,Vertical Hot Air Solder Leveling),j-3,超級焊錫,(,Super Solder ),j-4.,印焊錫突點,(,Solder Bump),K.,成型,(,Profile)(Form),k-1,撈型,(,N/C Routing ) (Milling),k-2,模具沖,(,Punch),k-3,板面清洗烘烤,(,Cleaning & Backing),k-4 V,型槽,(,V-Cut)(V-Scoring),k-5,金手指斜邊,(,Beveling of G/F),L.,短斷路測試,(,Electrical Testing) (Continuity & Insulation Testing),l-1 AOI,光學檢查,(,AOI Inspection),l-2 VRS,目檢,(,Verified & Repaired),l-3,汎用型治具測試,(,Universal Tester),l-4,專用治具測試,(,Dedicated Tester),l-5,飛針測試,(,Flying Probe),M.,終檢,(,Final Visual Inspection),m-1,壓板翹,(,Warpage Remove),m-2 X-OUT,印刷,(,X-Out Marking),m-3,包裝,及出貨,(,Packing & shipping),3,m-4,目檢,(,Visual Inspection),m-5,清洗,及烘烤,(,Final Clean & Baking),m-6,護銅劑 (,ENTEK Cu-106A)(OSP),m-7,離子殘餘量測試,(,Ionic Contamination Test )(Cleanliness Test),m-8,冷熱衝擊試驗,(,Thermal cycling Testing),m-9,焊錫性試驗,(,Solderability Testing ),N.,雷射鑽孔,(,Laser Ablation),N-1,雷射鑽,Tooling,孔,(,Laser ablation Tooling Hole),N-2,雷射曝光對位孔,(,Laser Ablation Registration Hole),N-3,雷射,Mask,製作,(,Laser Mask),N-4,雷射鑽孔,(,Laser Ablation),N-5 AOI,檢查及,VRS,( AOI Inspection & Verified & Repaired),N-6 Blaser AOI (after Desmear and Microetching),N-7,除膠渣,(,Desmear,),N-8,微蝕,(,Microetching,),4,A/W (artwork),底片,Ablation,燒溶,(,laser),切除,abrade,粗化,abrasion resistance,耐磨性,absorption absorption,ACC ( accept ),允收,accelerated corrosion test,加速腐蝕,accelerated test,加速試驗,acceleration,速化反應,accelerator,加速劑,acceptable,允收,activator,活化液,active work in process,實際在製品,adhesion,附著力,adhesive method,黏著法,air inclusion,氣泡,air knife,風刀,amorphous change,不定形的改變,amount,總量,amyl nitrite,硝基戊烷,analyzer,分析儀,anneal,回火,annular ring,環狀墊圈,;,孔環,anode slime (sludge),陽極泥,anodizing,陽極處理,AOI ( automatic optical inspection ),自動光學檢測,applicable documents,引用之文件,AQL sampling,允收水準抽樣,aqueous photoresist,液態光阻,aspect ratio,縱橫比,(,厚寬比,),As received,到貨時,5,back lighting,背光,back-up,墊板,banked work in process,預留在製品,base material,基材,baseline performance,基準績效,batch,批,beta backscattering,貝他射線照射法,beveling,切斜邊,;,斜邊,biaxial deformation,二方向之變形,black-oxide,黑化,blank controller,空白對照組,6,blank panel,空板,blanking,挖空,blip,彈開,blister,氣泡,;,起泡,blistering,氣泡,blow hole,吹孔,board-thickness error,板厚錯誤,bonding plies,黏結層,bow ; bowing,板彎,break out,從平環內破出,bridging,搭橋,;,橋接,BTO (Build To Order),接單生產,burning,燒焦,burr,毛邊,(,毛頭,),camcorder,一體型攝錄放機,carbide,碳化物,carlson pin,定位梢,carrier,載運劑,catalyzing,催化,catholic sputtering,陰極濺射法,caul plate,隔板,;,鋼板,calibration system requirements,校驗系統之各種要求,center beam method,中心光束法,central projection,集中式投射線,certification,認證,chamfer,倒角,(,金手指,),chamfering,切斜邊,;,倒角,characteristic impedance,特性阻抗,charge transfer overpotential,電量傳遞過電壓,chase,網框,checkboard,棋盤,chelator,蟹和劑,chemical bond,化學鍵,chemical vapor deposition,化學蒸著鍍,circumferential void,圓周性之孔破,clad metal,包夾金屬,clean room,無塵室,clearance,間隙,coat,鍍外表,coating error,防焊覆蓋錯誤,7,coefficient of thermal expansion (CTE),熱澎脹系數,cold solder joint,冷焊點,cold-weld,金屬粉末冷焊,color,顏色,color error,顏色錯誤,compensation,補償,competitive performance,競爭力績效,complex salt,錯化物,complexor,錯化物,component hole,零件孔,component side,零件面,concentric,同心,conformance,密貼性,consumer products,消費性產品,contact resistance,接觸電阻,continuous performance,連續發揮效能,contract service,協力廠,controlled split,均裂式,conventional flow,亂流方式,conventional tensile test,傳統張力測試法,conversion coating,轉化層,convex,突出,coordinate list,資料清單,copper claded laminates (CCL),銅箔基板,copper exposure,線路露銅,copper mirror,鏡銅,copper pad,銅箔圓配,copper residue (copper splash),銅渣,corrosion rate numbering,腐蝕速率計數系統,corrosion resistance,抗蝕性,coulombs law,庫倫定律,countersink,喇叭孔,coupon,試樣,coupon location,試樣點,covering power,遮蓋力,CPU,中央處理器,crack,破裂,;,裂痕,crazing,裂痕,;,白斑,cross linking,交聯聚合,8,cross talk,呼應作用,crosslinking,交聯,crystal collection,結晶收集,curing,聚合體,current efficiency,電流效率,cut-outs,挖空,cutting,裁板,cyanide,氰化物,cycles of learning,學習循環,cycle-time reduction,交期縮短,date code,週期,deburring,去毛頭,dedicated,專用型,degradation,退變,delamination,分層,dent / pin hole,凹陷,/,針孔,department of defense,國防部,designation,字碼簡示法,de-smear,除膠渣,developing,顯影,dewetting,縮錫,dewetting time,縮錫時間,dimension error,外形尺寸錯誤,dielectric constant,介質常數,difficulty,困難度,difunctional,雙功能,dimension,尺寸,dimension stability,尺寸安定性,dimensional stability,尺度安定性,dimension and tolerance,尺寸與公差,dirty hole,孔內異物,discolor hole,孔黑,;,孔灰,;,氧化,discoloration,變色,disposable eyelet method,消耗性鉚釘法,distortion factor,尺寸變形函數,double side,雙面板,9,downtime,停機時間,drill,鑽孔,drill bit,鑽頭,drill facet,鑽尖切萷面,drill pointer pointer,drilled blank board,已鑽孔之裸板,drilling,鑽孔,dry film,乾膜,ductility,延展性,economy of scale,經濟規模,edge spacing,板邊空地,edge-board contact ( gold finger ),金手指,efficiency,能量效率,electric test,電測,electrical testing,電測,;,測試,electrochemical machine ECM,電化學加工法,electrochemical reactor,電化學反應器,electroforming,電鑄,electroless plate,化學銅,electroless-deposition,無電鍍,electropolishing,電解拋光,electrorefining,電解精鍊,electrowinning,電解萃取,elliptical set,橢圓形,embrittlement,脆性,entitlement performance,可達成績效,entrapment,電鍍夾雜物,epoxy,環氧樹酯,equipotential,電位線,error data file,異常情形,etch rate,蝕銅速率,etchant,蝕刻液,Etch-back,回蝕,evaluation program,評估用程式,exposure,曝光,external pin method,外部插梢法,eyelet hole,鉚釘孔,Eyeleting,鉚眼,fabric,網布,failure,故障,10,fast response,快速回應,fault,瑕庛,;,缺陷,fiber exposure,纖維顯露,fiber protrusion,纖維突出,fiducial mark,光學點,基準記號,filler,填充料,film,底片,filtration,過濾,finished board,成品,fixing,固著,fixture,電測夾具,(,治具,),flaking off,粹離,flammability rating,燃性等級,flare,喇叭形孔,flat cable,併排電纜,feedback loop,回饋循環,first-in-first-out (FIFO),先進先出,flexible manufacturing system (FMS),彈性製造系統,flux,助焊劑,foil distortion,銅層變形,fold,空泡,foreign include,異物,foreign material,基材內異物,free radical chain polymerization,自由基連鎖聚合,fully additive,加成法,fully annealed type,徹底回火軔化之類形,function,函數,fundamental and basic,基本,fungus resistance,抗黴性,funnel flange,喇叭形摺翼,galvanized,加法尼化製程,gap,鑽尖分開,gauge length,有效長度,gel time,膠化時間,general resist ink,一般阻劑油墨,general,通論,general industrial,一般性,(,電子,),工業級,geometrical leveling,幾何平整,glass transition temperature (Tg),玻璃態轉換溫度,11,Gold,金,gold finger,金手指,gold plating,鍍金,golden board,標準板,gouges,刷磨凹溝,gouging,挖破,grain boundary,金屬晶體之四邊,green,綠色,grip,夾頭,ground plane,接地層,ground plane clearance,接地空環,hackers,駭客,HAL ( hot air leveling ),噴錫,haloing,白邊,;,白圈,hardener,硬化劑,hardness,硬度,hepa filter,空氣濾清器,high performance industrial,高性能,(,電子,),工業級,high reliability,高可靠度,high resolution,高解析度,high temperature elongation (HTE),高溫延展性銅箔,high temperature epoxy (HTE),高溫樹酯,hit,擊,hole counter,數孔機,hole diameter,孔徑,hole diameter error,孔徑錯誤,hole location,孔位,hole number,孔數,hole wall quality,孔壁品質,hook,外弧,hot dip,熱浸法,hull cell,哈氏槽,hybrid,混成積體電路,hydrogen bonding,氫鍵,hydrolysis,水解,hydrometallurgy,濕法冶金法,image analysis system,影像分析系統,image transfer,影像轉移,immersion gold,浸金,(,化鎳金,),12,immersion plating,浸鍍法,impedance,阻抗,infrared reflow,紅外線重熔,inhibitor,熱聚合抑制劑,injection mold,射模,ink,油墨,innerlayer & outlayer,內外層,insulation resistance,絕緣電阻,intended position,應該在的位置,intensifier,增強器,intensity,強度,inter molecular exchange,交互改變,interconnection,互相連通,ionic contaminants,離子性污染物,ionic contamination testing,離子污染試驗,IPA,異丙醇,5,I : inspiration,(,啟蒙),identification,確認計劃目標,implementation,改善方案,information,數據,internalization,制度化,invisible inventory,無形的庫存,knife edges,刀緣,Knoop,努普,(,硬度單位,),kraft paper,牛皮紙,laminar flow,層流,laminate,基層板,laminating,壓合,lamination,壓合,laminator,壓膜機,land,焊墊,lay back,刃角磨損,lay up,組合疊板,layout,佈線,;,佈局,lead screw,牽引螺絲,leakage,漏電,learning curve,學習曲線,legend,文字標記,leveling,平整,13,levelling additive,平整劑,levelling power,平整力,life support,維繫生命,limiting current,極限電流,line space,線距,line width,線寬,linear variable differential transformer(LVDL),線性可變差動轉換器,liquid,液狀,(,態,),liquid crystal resins,液晶樹脂,liquid photoimageable solder resist ink,液態感光防焊油墨,liquid photoresist ink,液態光阻劑油墨,lot size,批量,lower carrier,底部承載板,mechanical plating,機祴鍍法,machine scrub,刷磨清潔法,macrothrowing power,巨分佈力,margin,鑽頭刃帶,market share,市場佔有率,marking error,文字錯誤,masked leveling,儰裝平整,mass lamination,大型壓板,mass transfer,質量傳送效應,mass transfer overpotential,質量傳遞過電壓,mass transportation,質傳,master drawing,主圖,;,藍圖,material use factor,材料使用率,mealing,泡點,;,白點,memory,記憶裝置,meniscograph solderability measurement,新月型焊錫效果,microetch,微蝕,microetching,微蝕,microfocus,微焦距,microfocus system,微焦距系統,microprofile,微表面,microsectioning,微切片法,microthrowing power,微分佈力,migration,遷移,mini-tensile tester,迷你拉力測試儀,mis hole location,孔位錯誤,14,misregistration,焊錫面與零件面對位偏差,misregsitration,對不準,moisture and insulation resistance test,濕氣與絕緣電阻試驗,molded circuit board (MCB),模製電路板,monoethanal amine,單乙醇氨,monohydrate state,水化物,monomer,單分子膜,;,單體,mouse bite,鋸齒,;,蝕刻缺口,msec,毫秒,muffle furnace,高溫焚火爐,multichip,超大,IC,型,(多晶片模組),mylar,保護膜,nail head,釘頭,NC drill,數位鑽孔機,negative etchback,反回蝕,negative film,負片,negative rake angle,負摳耙角,network,迴路,;,網路,neutralization,中和,nick,缺口,nickel,鎳,nodule,銅瘤,;,瘤粒,no flow resin,不流,樹脂,noise,雜訊,nominal,標示,nominal dimension,標定長度,nominal gel time,標示膠性時間,nominal resin content,標示膠含量,nominal resin flow,標示膠流量,nominal scaled flow thickness,標示比例流量厚度,OA equip,辦公室自動化設備,obsolescence factor,報廢因素,OEM,原設備製造商,offset-list,補償數據清單,ohmmeter,歐姆計,open,斷路,open circuits,斷路,open short testing,斷短路測試,15,opening,開口,original art work (A/W),原稿底片,Others,其它,outgrowth,增出,over design,牛刀殺雞,overlap,鑽尖重疊,overlay entry,蓋板,overpotential,過電壓,oxidation,氧化,oxide treatment,黑化處理,oxided cytochrome,氧化性之細包色素,oxygen evolution,氧氣發生反應,packed bed,充填床式,pad,錫墊;圓配,pad copper exposurepad,露銅,panel,小型板面;母板,panel plating,一次銅電鍍,parasitic,寄生的,part no.,料號,pattern plating,二次銅電鍍,PCB ( print circuit board ),印刷電路板,pcs,片,peel strength,抗撕強度,peeling off,剝離(剝落),performance specification,性能規範,permittivity,透電率,perspectives on experience,經驗透視,PET,聚酯,photodiode detector,發光二極體偵測器,photo initiator,感光啟始劑,photoresist,光阻,phototool,光具(指工作底片),piece,子板面,pinceton applied research,腐蝕測定儀,pink ring,粉紅圈,pit,凹點,16,pitch,腳距,planar,平面,plating,電鍍,plating exposure,下鍍層露出,plug gauge,插規,plug hole,孔塞,PNL (panel),排板,polar-polar interaction,極性之間的吸力,polyester,聚酯類,polyglycols,聚乙二醇,polyimide,聚亞醯氨,poor bevelling,磨邊加工引起突起,剝離,poor drill,孔形不良,poor HAL,噴錫不良,poor marking,字體不良,poor pad,錫墊不良,poor printed,印刷偏差,poor solderability,焊錫性不良,poor touch-up,補線不良,position control system,位置控制系統,positive rake angle,正摳耙角,power curve model,幕次曲線模式,practice,工藝慣例,preferred,良好,premature tearing,提前撕裂,prepolymer,預聚合物,prepreg,膠片,pre-process ( front-end),製前,press,壓床,press cycle,壓合週期,primary current distribution,一次電流分佈,primary,主要,product lifetimes,生命週期,product process,製程,promoter,促進劑,protocal,初步資料,prussic acid,普魯士酸,PTF-based process,厚膜糊法,17,PTH (plating though hole),導通孔,pull away,拉開,pumice,浮石粉,pumice scrub,噴砂清潔法,pyrometallurgy,火燒法冶鍊,QC ( quality control),品管,QFP (quad flat pack ),扁方型封裝體,qualification inspection,資格審查檢驗,qualification testing,資格檢定,quality classification,品質等級,quantitative,計量式測試,rack,掛架,radiometer,能量劑,rake angle,摳耙角,RAM Random Access Memory,隨機存取記憶體,real time,關鍵時刻,recessed trace process,凹槽線路法,recovery tank,回收槽,reduction,還原,re-eninforcement,強化,refraction,折光率,reinforcement style,補強材料的型式,register mark,對位用標記,registration hole,對位孔,registration pattern,長方形銅地,REJ ( reject ),退貨,;,拒收,rejectable,拒收,release agent,脫模劑,relief angle,浮離角,remark,備註,repair,修理,resin content,樹脂含量(膠含量),resin flow,膠流量,resin flow percentage,樹脂流量之百分率,resin recession,樹脂下陷,resin smear,膠渣,resist strippers,剝乾膜劑,18,resistor network,排列電阻,resolution,解像度,return on assets,資產報酬率,reversibility,可逆性,rework,重工,rosin,天然松香,rotating cylinder,旋轉圓柱形,roughtness,孔壁粗糙,;,粗慥,routing,切外形,成型,routing bit,銑刀,runout,偏轉,S/L on hole,孔內沾文字,S/M ( solder mask ), S/L,防焊文字,S/M (solder mask),防焊,S/M error,防焊種類錯誤,S/M on hole,孔內綠漆,salt spray test,鹽水噴霧試驗,sampling size,抽樣數,scope,範圍,scored,刻痕,scoring,樞槽,;,刮線,scrap,廢框,scratches,刮傷,screen printing,網版印刷,scum,透明殘膜,sealing,封孔處理,secondary,次要,semi-additive,半加成法,sensitize,敏化,sensitizer,敏化液,separator,鋼隔板,sequential lamination,漸成式壓法,serrated edges,毛邊,shatter,破碎,19,short,短路,shunt,分路,silane treatment,矽烷處理,silicone coupling agent,矽烷偶合劑,silk screen,文字印刷,simulator,模擬器,single axis,單軸,sizing,底片之伸縮補償,skip,漏印,skip printing,跳印,;,漏印,sliver,絲條,slot,開槽,slotting,開槽,SMD ( surface mount device ),表面黏著元件,smear,膠渣,SMT ( surface mount technology ),表面黏著技術,sodium carbonate monohydrate,結晶水碳酸鈉,soft tooling,軟性工具,solder,焊錫,;,錫鉛,solder bridge,錫橋,solder bump,錫突,solder float,漂錫,solder mask adhesion,綠漆附著力,solder on G/F,金手指沾錫,solder on trace,線路沾錫,solder plug,錫塞,solder side,焊錫面,solderability,焊錫性,solid carbide,實質碳化物,spacing,間距,spacing nonenough,間距不足,SPC ( Statistical Process Control ),統計生管,specification,規範,special considerations,特別考慮,spin coating,旋轉塗佈,spindle,鑽軸,spiral contractometer,螺旋收縮儀,spot face,銑靶,spray coating,噴塗,20,Squeegee,刮刀,stacking structure,疊板結構,stamping,沖壓,standard hydraulic lamination,標準液壓法,standardizing,標準化,starvation,缺膠,step tablet,格片數,stock option,認股選擇權,strain,應度,strength,強度,stressmeter,應力計,subtractive,減除法,surface convex,表面突起,surface examination,表面檢查,surface insulation resistance (SIR),表面絕緣電阻,surface mount,表面黏著方式,surface roughness,表面粗慥度,surges,突波,switch circuit,開關線路,tab,金手指,tack free,不黏,taped hole gauge,錐形孔規,target hole,靶孔,task force,任務編組,tensile strength,抗拉強度,tensile stress,張性應力,tent,浮蓋,terms and definitions,術語與定義,termination load,抗匹配負載,test circuit,測試線路,test method,試驗方法,test point,測試點,thermal shock,熱震盪試驗,thermal stress,熱應力試驗,thermistor,熱電感應式,thermo cycling,熱循環試驗,theoretical cycle time,理論性週期時間,21,thickness,厚度,time to market,上市時機,thickness distribution,厚度分佈,thief,補助陰極,thin core,薄基板,;,內層板,throwing power,分佈力,tolerance,公差,;,容差,tooling hole,工具孔,torque load,扭力拒之負載,total quality program,全面的品質計劃,toughness,堅度,trace error,線路錯誤,trace nick & pin hole,線路缺口及針孔,trace peeling,線路剝離,trace pin-hole,線路針孔,trace surface roughness,線路表面粗糙,tarnish and oxide resist,抗污抗氧化劑,transmittance,透光度,trim line,裁切線,true levelling,真平整,true position,真正位置的孔,;,真位,twist,板翹,type,種類,umbra,本影,undercut,側蝕,uneven coating,噴錫厚鍍不平整,universal,萬用型,universal tensile tester,萬用拉力試驗機,universal tester,汎用型測試機,upper carrier,頂部承載鋼,uptime,稼動時間,vacuum deposition,真空蒸鍍法,vacuum hydraulic lamination,真空液壓法,vaporizer,氣化室,V-cut V,形槽,vertical microsection,垂直微切片,22,via hole,導通孔,visible inventory,有形的庫存,vision inspection,目視檢查,Void,孔破,void in hole,孔壁上的破洞,void in PTH hole,孔破,walkman,隨身聽,warehouse,倉庫,warp,板彎,warp , warpage,板彎,water absorption,吸水性,wear resistance,耐磨度,weave exposure,纖紋顯露,weave texture,織紋隱現,wedge angle,契尖角,week,週,wet chemistry,濕式化學製程,wet film,濕膜,wet lamination,濕膜壓膜法,wet process,濕製程,wetting,沾錫,wetting balance,沾錫平衡法,wicking,滲銅,;,滲入,;,燈蕊效應,width,寬度,width reduce,線細,width-to-thickness ratio,寬度與厚度的比值,window,操作範圍,work-in-process,在製品,work order,工單,working film,工作片,working master,工作母片,year,年,yellow,金黃色,yield,良率,23,