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,IC,封 裝 簡 介,內 容,現有的,IC,封裝型式 (,Package Type),介紹,製造流程 (,Process Flow),介紹,材料組成 (,BOM),介紹,封裝形式的定義,DIP : Dual In-line Package,SOP : Small Outline Package,SOJ : Small Outline J-lead Package,SSOP : Shrink SOP,TSOP : Thin SOP (inc. type I & II),QFP : Quad Flat Package,LQFP : Low profile QFP,BGA : Ball Grid Array,DIP : Dual In-line Package,腳數: 28,現有的,IC,封裝型式 (,Package Type),現有的,IC,封裝型式 (,Package Type),SOP : Small Outline Package,腳數: 8/18/32/44,現有的,IC,封裝型式 (,Package Type),SOJ : Small J-lead Package,腳數: 24/42,現有的,IC,封裝型式 (,Package Type),SSOP : Shrink Small Outline Package,腳數: 48,現有的,IC,封裝型式 (,Package Type),TSOP-I : Thin SOP type-I,腳數: 28/32/48,現有的,IC,封裝型式 (,Package Type),TSOP-II : Thin SOP type-II,腳數: 40/44/50/54/66/86,現有的,IC,封裝型式 (,Package Type),QFP : Quad Flat Package,腳數: 100/128/160/208,現有的,IC,封裝型式 (,Package Type),LQFP : Low profile QFP,腳數: 48/64/100/128/176/208/216,現有的,IC,封裝型式 (,Package Type),BGA : Ball Grid Array,尺寸: 27,x27/ 35x35,製造流程(,Process Flow),介紹-前段,製造流程(,Process Flow),介紹-後段,進 料 檢 驗,IQC (Incoming Quality Control),晶片,黏 片,Wafer Mount (WM),晶粒,切 割,Wafer Saw (WS),導線架,(花 架),晶粒,銀膠,黏 粒,Die Bond (DB),頭髮,金線,銲 線,Wire Bond (WB),壓 模,Molding (M/D),切腳前,切 腳,De-junk & Trim (DT),電 鍍,Plating ( PL),油墨(,ink),雷射(,laser),蓋 印,Marking,成,型,及 切 單,Forming &,Singulation,(F/S),1.花架 (,Lead frame),2.,銀膠,(,Epoxy),3.,金線,(,Gold wire),4.,膠餅,(,Compound),*5.,黃膠,(,Polyimide,),*6.,散熱片,(,Heat Sink),*,前四項為四大主料.,材料組成(,BOM)Bill Of Material,花 架,(導線架),Lead frame (L/F),常用種類(,type):,1.,銅材(,Cu): C7025, A-194, E-64T,2.,鐵材,(,Fe): A-42,銀 膠,Epoxy,常用種類(,type):,1.,Ablebond,8360 for QFP / SOIC,2.,Ablebond,8355F for TSOP & LQFP,3.,Ablebond,8340 for TSOP & LQFP,4.Hitachi EN4065D for TSOP & LQFP,5.,Ablebond,8515 for insulator(,絕緣,),成份: 99.99%,Au,常用線 徑:,1. 1.3,mil for bond pitch 90um,以上,.,2. 1.2,mil for bond pitch 80um,以上.,3. 1.0,mil for bond pitch 70 79um.,4. 0.9mil for bond pitch 69um,以下.,金 線,Gold Wire,主要成份,:,1.填充料,Filler (SiO,2,) :,約,70%,2.合成,樹脂,Resin : 25 29%,常用型號:,1.,EME 6300/ 6600 for QFP & SOIC,2. EME 7351LS/ KMC 260 for TSOP,3. EME 7320AR for LQFP,膠 餅,Compound,後段,(8)壓模,Mold,(9),烘烤,PMC,(10)去緯,DT,(11)電鍍,Plating,(12)油墨蓋印,Ink Marking,(13)烘烤,Ink Cure,(14)切腳成型,Trim Form,(15)包裝,PACK,Lead Frame Assembly Process,前段,(1)晶片檢驗,Wafer Incoming,(2)晶片粘片,UV Tape Mount,(3)晶片切割,Saw,(4)UV,照射,UV irradiation,(5)粘晶粒,Die Bond,(6)烘烤,Epoxy Cure,(7)銲線,Wire Bond,Wafer Incoming,UV irradiation,Wafer Mount,Saw,PMC,DT,Mold,Die Bond,Plating,Wire Bond,Epoxy Cure,Trim Form,Ink Cure,Ink Marking,PACK,Lead Frame Assembly Process Flow Chart,晶片粘片,(UV) Wafer Mount,晶片切割,Saw,UV,照射,UV irradiation,粘晶粒,Die Bond,烘烤,Epoxy Cure,銲線,Wire Bond,壓模,Mold,烘烤,PMC,去緯,DT,電鍍,Plating,油墨蓋印,Ink Marking,烘烤,Ink Cure,切腳成型,Trim Form,包裝,PACK,Taping,Epoxy Cure,UV Irradiation,Saw,Detaping,Wafer Clean,UV Tape Mount,Grinding,Substrate Pre-Bake,Clean,Wire Bond,Die Bond,Mold,SBBP,Marking,PMC,BGA Assembly Process Flow Chart,ReFlow,Pack&Test,Saw,Singulation,Flux Clean,Wafer Incoming,Taping,上膠帶,Grinding,晶圓研磨,Detaping,去膠帶,晶圓電漿清潔,Wafer Clean,UV Tape Mount,晶片黏貼(,UV,膠帶),Saw,晶片切割,UV Irradiation,紫外線照射,Substrate Pre-bake,底座預烘烤,Die Bond,晶片上片,Epoxy Cure,銀膠烘烤,Clean,電漿清洗,Wire Bond,焊線,Mold,壓模,PMC,成型烘烤,Marking,Laser,蓋印,SBBP,植球,ReFlow,迴焊,Flux Clean,清洗,Saw,Singulation,切割成顆粒狀,Pack , ASECL Test,包裝與測試,Shipment,送交客戶,測試製程介紹,測試定義 :,測,試製程是對於,IC,封裝完成的產品,,,以保証出廠,IC,功能,的完整性,並對已測試的產品依其,功能作分類,(即分,Bin),,作為,IC,不同等級產品的評價依據;,最後並對產品作,外觀檢驗及包裝,作業(,Packing),,,及,出貨的運送作業,(,Shipping)。,功能,測試及,分類,1.上線備料,2.,功能,測試 -,溫度循環,測試 ( ,40 ,+125, ),測試系統 (,Tester),數位影像產品 繪圖晶片組產品,記憶體產品 PC晶片組產品,汽車電子元件 資訊家電產品,分類機(,Handler),BGA,QFP,功能,測試及,分類,包裝類別,QFN,PLCC,PDIP,SOP,3.,外觀檢驗及包裝,(,Packing),印碼掃描(,Mark Scan),捲帶包裝 (,Tape/Reel),外觀檢驗及包裝,4.,出貨的運送作業 (,Shipping),
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