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MEMS Microphone 产品简介 1. 体积小 . 2. 便于 SMT安装 . 3. 耐高温 ,稳定性好 . 4. 灵活的设计应用 . 5. 兼容数字化发展 . 6. 自动化程度高 . 7. 适合大批量生产 . MEMS Microphone MEMS Microphone Presentation MEMS Microphone 产品简介 MEMS麦克风是由 MEMS微电容传感器、微集成转换电路 (放大器 )、声腔及 RF抗噪电路组成。 MEMS微电容极头部分包含 接收声音的硅振膜和硅背极 ,硅振膜可直接将接收到的音频信号 经 MEMS微电容传感器传输给微集成电路 ,微集成电路可将高阻 的音频电信号转换并放大成低阻的音频电信号 ,同时经 RF抗噪电 路滤波 ,输出与手机前置电路相匹配的电信号 .完成“声 -电”转 换 . MEMS Microphone 工作原理 MEMS Microphone 产品简介 V out Silicon Back Plate Silicon diaphragm GND RF Filter MEMS Microphone Module Structure V supply MEMS Acoustic Sensor ASIC MEMS Microphone 产品简介 MEMS Wafer MEMS Die MEMS Microphone Wafer & MEMS Die MEMS Microphone 产品简介 MEMS Microphone Profile Acoustic port hole L W H 4 2 1 3 PIN# FUNCTION 1.OUTPUT, 2.NO CONNECTION 3.GROUND, 4.POWER MEMS Microphone 产品简介 序号 名称 1 Cover 2 Housing 3 Wire bonding 4 PC Board 5 Capacitor 10pF 6 Capacitor 33pF 7 ASIC 8 MEMS Die MEMS Microphone Structure MEMS Microphone 产品简介 Specification MEMS Microphone Frequency range 100-10,000Hz Sensitivity (0dB=1V/Pa 1k Hz) -42dB+/-3dB Output impedance 58dB RF-filtering capacitance 10pF, 33pF, both or none Change in sensitivity(电压特性 ) 1dB across voltage range Standard operating temperature -40 to + 100 Current consumption 0.25mA Supply voltage ratings 1.5V to 3.6V Performance Comparison MEMS Microphone 产品简介 Recommended Interface Circuit AAC MEMS Microphone Term3. Term2. Term4 Term1 - + Vref External Gain=-R1/R2 (Set by customer) + R2 R1 MEMS Microphone 产品简介 Solder Reflow Profile Maximum solder profile: Do not exceed profile listed in this table Stage Temperature Profile Time (Maximum) Pro-head 170180 120sec. Solder Melt Above 230 100sec. Peak 260 Maximum 30sec. Incoming Inspection Wafer Sawing Wafer Expand SMT/glueing Packaging/Cutting Testing / Marking / Taping Shipping Inspection Packing Wafer Fabrication Packaging Wafer Foundry Pick up and place MEMS Wire Bonding Reliability Test Wafer Testing Wafer Inspection Production Process MEMS Microphone MEMS Microphone 产品简介 Cellular Phone(CDMA, GSM, PCS), Camcorder Phone, MP3 Phone, PDA Phone etc. Camcorder, Digital Camera etc. Ear Phone MIC for Headsets, MP3, Bluetooth, etc. Notebook Computer, Desk-Top Computer Video Door Phone etc. Cordless Phone MEMS Wafer Fab. MEMS Packaging Application of Product MEMS Microphone 产品简介 MEMS Mic MEMS Mic Application of Product MEMS Microphone List of Products P/N Figure Dimensions mm Sensitivity dB (V s=2.0V) SM0102 3.76(W)x6.15(L)x1.45(H) -42+/-4 * SM0103 3.76(W)x4.72(L)x1.45(H) -42+/-4 * SM0104 3.76(W)x4.72(L)x1.45(H) -38+/-4
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