PCB专业术语名词解释A50

Click to edit Master title style,Click to edit Master text styles,Second level,Third level,Fourth level,Fifth level,*,线路板专业名词解释,Title,印制电路：,printed circuit,印制线路：,printed wiring,印制板：,printed board,印制板电路：,printed circuit board(,pcb,),印制线路板：,printed wiring board(,pwb,),印制元件：,printed component,印制接点：,printed contact,印制板装配：,printed board assembly,板：,board,第一篇：常用术语,10.,单面印制板：,single-sided printed board(,ssb,),11.,双面印制板：,double-sided printed board(,dsb,),12.,多层印制线路板：,mulitlayer,printed wiring board13.,刚性印制板：,rigid printed board14.,刚性单面印制板：,rigid single-sided printed board 15.,刚性双面印制板：,rigid double-sided printed board17.,刚性多层印制板：,rigid,multilayer,printed board,18,.MI:Manufacture Instruction(制作指示),19,.ECN:Engineering Change Notice,(工程更改通知),20,.MOR：Marketing Order Release,OC :Order Confirmation(定单),21,.IPC-The Institute for Interconnecting,and packaging Electronic Circuits,(美国电子电路互连与封装协会),22.,UL,:Underwrites Laboratories(,美国保险商实 验所),23.,ISO,-International Standards Organization,国际标准化组织,24.,On hold and Release,:,暂停和释放,25.,SPEC,:specification,客户规格书,26.,WIP,:Work in process,正在生产线上生产的 产品,27.,Gerber file,:,软件包,28.,Master A/W,:,客户原装菲林,29.,Net list,:,客户提供的表明开短路的文件,30.,HMLV,:High Mixed Low Volume,多批少量,31.,TCN：Temporary Change notice,临时更改通知,32,.ENIG:Electroless Nickel/Immersion Gold,(IPC-4552),33,.OSP:Organic Surface protection,34,.,I,T,:,I,mmersion,Tin,35.,IS:Immersion Silver,36.,HAL:Hot air leveling,第二篇：有关材料,1.,Copper-clad Laminate,:,覆铜箔基材,2.,Prepreg,:,聚酯胶片,3.,FR-4(Flame Retardant-4),:,一种用玻璃布和环氧樹脂制造有阻燃性能的材料,4.,Solder mask,:,阻焊剂,5.,Peelable,solder mask,:,蓝胶,7.,Dry film,:,干膜,6.,Carbon Ink,:,碳油,8.,RCC,:Resin Coated Copper(,不含玻璃布),9.基材：,base material,10.,层压板：,laminate,11.,覆金属箔基材：,metal-clad bade material,12,、,覆铜箔层压板：,copper-clad laminate(,ccl,),13,、,单面覆铜箔层压板：,single-sided copper-clad laminate,14,、,双面覆铜箔层压板：,double-sided copper-clad laminate,15,、,复合层压板：,composite laminate,16,、,薄层压板：,thin laminate,17,、,金属芯覆铜箔层压板：,metal core copper-clad laminate,18,、,金属基覆铜层压板：,metal base copper-clad laminate,第三篇：有关工序,PTH,1.,PTH:,(Plated through hole),电镀孔,A.,Via hole,:,通路孔。,作用：,B.,IC hole,:,插件孔。,作用：,仅作为导通用（不作插件或焊接），如测试点和一般导通孔。,用于插件或焊接，也可导通内外层。,2.,NPTH：,作用：,一般是作为装配零件的定位孔或工具孔。,NPTH,(,Non-plated through hole),非电镀孔,3.,SMT/SMD,Surface Mounting Technology:,表面贴覆技术,SMT Pad:,SMT,指在线路板表面帖覆焊接元件的,Pad，,包括,QFP(Quad flat pad)，2-Roll,等。,这些也是,SMT pad,4.,BGA/CSP:,BGA-Ball Grid Array,CSP-Chip Scale package,要求：,一般,BGA,区域,VIA,孔要求塞孔,说明：,它们都是一种封装技术。在,PCB,上都表现为一 VIA孔联了一个焊接PAD。,BGA/CSP,BGA Pad,Line,Via Hole,5.,Fiducial,mark:,作用：,装配时作为对位的标记,说明：,它是非焊接用的焊盘，通常为圆形或方形，有金属窗和绿油窗。,Fiducial,mark,6.,Dummy pattern(thief pattern)：,作用：,使整块板的线路分布更均匀，从而提高图电质量和减少板的曲度和扭度,。,要求：,通常以不影响线路为标准，,一般为又有三种：,圆形/方形-命名为“,Dummy”,网状-命名为“网状,Dummy”,铜皮-命名为“铜皮”,Dummy,7.无孔测试,Pad：,Text Pad/Breaking Tab,此类,Pad,仅供装配完后作为测试点，不装配零件。,不包括,SMT PAD,BGA PAD,Fiducial,mark pad.,8.,Breaking Tab：,印制板上无电气性能，在制作过程中用于加工具孔、定位孔或,Dummy,等的部分。与线路板主体部分相连处有折断孔或,V-Cut。,Breaking Tab,V-Cut,9.,Thermal,：,作用：,它使在焊接时因截面过分散热而产生虚焊的可能性减少。,(,heat shield）,热隔离盘 （,大面积导电图形上，元件周 围被蚀刻掉的部分）,Thermal/Clearance,10.,Clearance：,无铜,空间（通常指铜皮上为孔开的无铜区域）,11.,S/M Bridge：,作用：,防止焊接时,Pad,间被焊锡短路。,阻焊桥（装配,Pad,间的阻焊条）,S/M bridge,S/M Bridge,Solder mask in these areas,S/M bridge,12.,Gold finger：,金手指,说明：,电镀金耐磨。,一般金指的,S/M OPENING,均为整体开窗。,13.,Key slot：,键槽,作用：,使印制板（金手指）只能插入与之配合的连接器 中，防止插入其他连接器中的槽口。,要求：,一般公差要求较紧。,14.,Beveling：,金指斜边,Gold finger/Key slot/Beveling,15.,VIP：,要求：,一般为,S,面塞孔，,C,面作为,SMT PAD。,16.,VOP：,(,Via In Pad)Via,孔位于,SMT Pad,上。,说明：,(,Via On Pad)Via,孔先被树脂塞满，其表面（一面或两面）经过打磨、沉铜、板电镀等工序后，要求作为装配,Pad。,VIP/VOP,S,面塞孔,SMT Pad,Via hole,树脂塞孔,SMT Pad,Blind/Buried hole,17.,Blind/Buried hole：,盲,/,埋孔,盲孔：从一个表面开始，在内层结束，未贯穿整板的孔。,埋孔：不经过两外表面，只在某些内层中贯穿的孔。,盲孔,埋孔,19,.LDI,High Density Interconnection :,高密度互联,-特点：直接用激光在干膜上曝光，不必用菲林，能保证完成线宽更细。,18,.HDI,Laser Direct Image-,镭射直接曝光,-特点：一般线宽/线间小于3,mil/3mil,导通孔小于8,mil,microvia,一般,要求用激光钻孔。,20.,Heat sink:,Side face,Bottom Side,Top Side,PCB,Pallet,大铜块,Prepreg,PCB+,Prepreg,+Pallet,Aspect ratio,21.,Aspect Ratio：,纵横比（板厚孔径比）-影响电镀和喷锡,说明：,一般采用板厚最大值与最小孔径之比。,d,H,D,Aspect Ratio=d/H,22.,AGP:,显卡,主显示芯片,AGP,23.,Mother board:,内存插孔,PCI,插槽,CPU,插座,AGP,插槽,主(机)板,Motherboard,24,.,Memory bank:,Memory bank,内存条,内存芯片组,第四篇：检查与测试,欧盟,RoHS,&WEEE,指令对无铅,PCB,要求,无铅,PCB,必须满足欧盟,RoHS,（Restriction of the use of certain Hazardous Substances in electrical and electronic equipment）2002/95/EC,指令 和电子信息产品生产污染防治管理办法的规定，从2006年7月开始禁用六种物质,（铅、镉、六价铬、水银、,PBB（,多溴化联苯）、,PBDE（,多溴联苯醚）。其中,PCB,板主要检测项目包括：,PCB,基材、阻焊、丝印、铜皮等。,If this specification conflicts with any other documents the following order of precedence shall apply:,a),Purchase order,b),Printed wiring board drawings and drill and trim documentation,c),This specification,d),Documents referred to in this speciation.,Supplier shall use applicable fabrication panel coupon as defined in IPC-2221.Micro-sections coupon,and solder samples shall be provided with each shipment for validation requirement.,1.,Maximum 3 repair operations are allowed on each board and the number of repaired PCBS cannot exceed the 10 percent of the entire lot population.,2.,Unless