塑封基础知识培训课件

单击此处编辑母版标题样式,单击此处编辑母版文本样式,第二级,第三级,第四级,第五级,*,*,*,塑封基础知识培训,塑封基础知识培训,1,樹 脂,Resin,填充料,Filler,硬化劑,Curing agent,添加劑,Additive,混 合,Pre-mixing,加熱混練,Kneading,冷 卻,Cooling,粉 碎,Crushing,混 合,Blending,錠粒成型,Tableting,秤量包裝,Weigh,Package,EME,Product,1-EME,的原材料和生产过程,樹 脂填充料 硬化劑 添加劑 混 合 加熱,2,1.1-Raw Material Support for EME In CCP(,蓝色为,CCP,自产）,PHENOLIC NOVOLAC RESIN,线性酚醛树脂,PHENOL,苯酚,EME,Epichlorohydrin,环氧氯丙烷（表氯醇）,Bisphnol A,双酚,A,BROMINATED EPOXY,溴化环氧树脂,FILLER,填充剂,ADDITIVE,添加剂,OTHERS,其它,EPOXY CRESOL NOVOLAC RESIN,邻甲酚醛环氧树脂,1.1-Raw Material Support for E,3,环氧树脂,填充剂,添加剂,粉碎、混合、搅拌,塑封料,塑封料生产流程,环氧树脂填充剂添加剂粉碎、混合、搅拌塑封料塑封料生产流程,4,2-EME,固化（交联）过程,2.1-,树脂体系,2-EME固化（交联）过程2.1-树脂体系,5,塑封基础知识培训课件,6,2.2-EME,固化（交联）程度行为曲线,2.2-EME固化（交联）程度行为曲线,7,3-,在充填过程中，,EME,黏度行为曲线,Viscosity behavior during filling,at 175,C,Time,Hot hardness,预热,成型,后固化,3-在充填过程中，EME黏度行为曲线 Viscos,8,EME,系列胶化时间,&,螺旋流动长度,v.s.,模温,EME Series Gel Time&Spiral Flow v.s.Molding Temperature,EME系列胶化时间&螺旋流动长度v.s.模温,9,4-,成型,Molding,冷冻保存,(10,),Cold Storage(10,),回温,Stabilizing,(2,0,-30,50-70%RH),成型,Molding,再保存,(,必要,时,),Re-Storage,在成型车间,原封不动,.,需回温,16-24,小时,.(,温度平衡,),Keep the package sealed.Thaw16-24 hours in molding room condition,*,需重新包装好,*回温后,72,小时内用完,Seal up package as before it was opened.,*不要用手直接,碰触黑胶,.*,72,小时内使用完毕,Dont touch compound with your bare hand.,4.1.,黑胶准备,Compound Preparation,4-成型 Molding冷冻保存(10)回温 Stabi,10,Storage Life VS Temp.,EME,存储寿命随着存储温度的提高显著短缩。,Storage Life VS Temp.EME存储寿命随着,11,成型,条,件,Molding Conditions,成型条件 Molding Conditions,12,a.,锭粒预热,Preheating of Pellet,预热前的准备,Preparation for stable preheating,*,回温充分，赶走湿气,Stabilization of compound temperature and humidity,*,预热时间,Preheat time,：,2040sec.(,根据预热设备调整,Depending on pre-heater),*,精确的设定,Precise adjustment of,：,滚筒间的距离,Distance between rollers,电极间的距离,/,水平度,Distance/horizontal level of electrode,如何测量预热温度,How to measure the preheat temp.,*,确认锭粒表面温度优于确认锭粒内部温度,Check the surface temp.of pellets rather than inside of pellets,此法之优点,A,dvantages of this method,：,预热后可快速的进行测量,Quick checking right after heating,不会受黑胶本身的影响,Not affected by the heat from compound itself,可以快速、个别地测量锭粒温度,Can check the temp.pellet to pellet individually,a.锭粒预热Preheating of Pellet 预热,13,b.,残留饼厚度,/,锭重,C,ull Thickness/Pellet Weight,通过获得合适的残留饼厚度确认锭粒重量是否合适,ADJUST PELLET WEIGHT TO GET PROPER CULL THICKNESS,理想的厚度,IDEAL THICKNESS,太厚,TOO THICK,黑胶的浪费，,cull,固化不完全,(COMPOUND LOSS,UNCURED CULL),太薄,TOO THIN,(,不完全充填,INCOMPLETE FILL),转进方向,Transfer direction,b.残留饼厚度/锭重 Cull Thickness/Pe,14,c.,转进压力,TRANSFER PRESSURE,正确的判断表压和实际转进压力之间的关系,ACCURATE ADJUSTMENT IS REQUIRED GAUGE PRESSURE VS ACTUAL PRESSURE,注意,NOTE,实际的转进压力需要周期性地用压力计校正,ACTUAL PRESSURE SHOULD BE CHECKED PERIODICALLY WITH DILLON GAUGE (FORCE GAUGE),转进头和转进筒需要周期性地进行更换,PLUNGER HEAD AND TRANSFER POT SHOULD BE REPLACED PERIODICALLY.(PREVENT PRESSURE LOSS),c.转进压力TRANSFER PRESSURE 正确的判,15,转进压力,Transfer Pressure,表压和实际的转进压力,Ga,u,ge pressure v.s.Actual pressure,Pr x Sr=Pp x Sp,Sr=(Dr/2)2,Sp=(Dp/2)2,Dr:Diameter of Ram,Dp:Diameter of Plunger,Pp:actual pressure to PKG.,Pr:oil pressure shown on Gage with unit kg/cm2,(Also all Ram pressure(=Pr x Sr)is shown on the same gage with unit ton),Die surface area doesnt relate in ideal.,But complexed runner and cavity structure will make pressure loss.,转进压力Transfer Pressure 表压和实际的转,16,d.,转进速度,/,时间,T,RANSFER SPEED/TIME,转进速度是通过转进距离除于转进时间得到的,TR.SPEED IS CALCULATED WITH TR.DISTANCE AND TR.TIME,TR.SPEED(CM/SEC)=,TR.DISTANCE(L),L=,=r2hn/R2,2r:,锭粒直径,PELLET DIAMETER,h:,锭粒高度,PELLET HEIGHT,n:,锭粒的颗数,NO.OF PELLETS,2R:,转进筒直径,POT DIAMETER,锭粒的直径应该要和转进筒的直径相近,PELLET DIAMETER SHOULD BE CLOSE TO POT DIAMETER,EXAMPLE 2R=50mm 2r=48mm,d.转进速度/时间TRANSFER SPEED/TIME 转,17,e.,后固化,POST MOLD CURE,烘箱,OVEN,为了加热的均匀性，烘箱必需是通过热风扇加热,OVEN WITH INSIDE HEATING FAN IS DESIRABLE FOR,UNIFORM HEATING,固化温度和时间,CURE TEMP.AND TIME,后固化时间要在烘箱达到合适的温度后开始计时,CURE TIME SHOULD BE COUNTED AFTER REACHING PROPER,TEMP.LEVEL,e.后固化POST MOLD CURE烘箱OVEN,18,后固化后各个主要参数的比较,Post Mold Cure Comparison,后固化后各个主要参数的比较Post Mold Cure Co,19,5,-,EME,成型常见问题及其对策,充填不良,(Incomplete Fill),气孔,(Voids),麻点,(,Pin Hole,),溢料（,Resin Bleed,）,流痕,(Flow,mark),黏模,(Stick),开裂,(Crack),冲线,(Wire sweep),5-EME 成型常见问题及其对策充填不良(Incomple,20,5-1,EMC,封装成型不良相关因素,5-1 EMC封装成型不良相关因素,21,充填不良,(Incomplete Fill),充填不良(Incomplete Fill),22,充填不良,(,趋向性）,充填不良,(,随机性）,充填不良(趋向性）充填不良(随机性）,23,气孔,（,Void,）,气孔（Void）,24,外部气孔（,air,vent,侧）,外部气孔（,gate,侧）,内部气孔,外部气孔（air vent侧）外部气孔（gate侧）内部气孔,25,麻点,在封装成形后,封装体的表面有时会出现大量微细小孔,而且位置都比较集中,看卜去是一片麻点。这些缺陷往往会伴随其他缺陷同时出现,比如充填不良、气孔等。这种缺陷产生的原因主要是料饼在预热的过程中受热不均匀,各部位的温差较大,注入模腔后引起固化反应不一致,以至于形成麻点缺陷。,麻点在封装成形后,封装体的表面有时会出现大量微细小孔,而且位,26,锭粒无间隙,预热不均,锭粒有间隙,(,均匀摆放,),预热均匀,麻点,锭粒无间隙,预热不均锭粒有间隙(均匀摆放),预热均匀麻点,27,溢料(Resin,bleed/Flash),溢料(Resin bleed/Flash),28,溢,料,溢料,29,流痕,(Flow Mark),流痕(Flow Mark),30,黏,模,黏 模,31,黏,模,黏 模,32,开裂,开裂,33,开裂,开裂,34,冲,线,(wire,sweep),冲线(wire sweep),35,塑封基础知识培训课件,36,塑封基础知识培训课件,37,结语,塑封成形的不良种类很多，在不同的封装形式上有不同的表现形式，发生的几率和位置也有很大的差异，产生的原因也比较复杂，并且互相牵连，互相影响，所以应该在分别研究的基础上，综合考虑，制定出相应的解决方法与对策。,结语 塑封成形的不良种类很多，在不同的封装形式上有不,38,