1_MT6253 SMT应用简介(2)

Page Title: 32 pt Arial,Please use the following font and colors for your presentation.,It is strongly recommended to use Arial for all areas of content.,The following colors are recommended for various areas.,Titles, subtitles and content: bold black.,Support text: black, gray, blue and orange.,Third level,Fourth level,Fifth level,*,Internal Use,Internal Use,Copyright MediaTek,Inc.,All rights reserved,.,Page Title: 32 pt Arial,Please use the following font and colors for your presentation.,It is strongly recommended to use Arial for all areas of content.,The following colors are recommended for various areas.,Titles, subtitles and content: bold black.,Support text: black, gray, blue and orange.,Third level,Fourth level,Fifth level,MT6253(aQFN),SMT &,Application Introduction,2010/01,Prepared,by:,Zhong Xin,Approved by: Rio Chiang,E-mail:,内容,MT6253,介绍,What is,aQFN,aQFN,s,Advantage,vs,TFBGA & QFN,客户量产问题集,解决方法：,PCB,设计,解决方法：钢网设计,MT6253,(,aQFN,) Task Force Team,Appendix,1,2,MT6253,介绍,Mediatek,将于,2009,年,Q4,推出首款,GSM/GPRS,单芯片方案,MT6253,MT6253,集成了数字基频,(DBB),，模拟基频,(ABB),，电源管理,(PM),，射频收发器,(RF),。支持手机相机，高速,USB,，及,D,类音频功放,MT6253,=MT6225+MT6318+MT6139,MT6253,采用了,新一代封装技术,(,aQFN,),MT62,53N,0930,-,BFAL,DSPK54-04-1G2-52,MT6253,正印,2,3,What is aQFN,aQFN,means Advanced QFN,Features,Low,Cost,Profile, and,L,ight weight,Excellent,T,hermal / Electrical,P,erformance,Excellent Anti-drop-&-twist capability,High I/O count up to 400,Leadless & multi-row package,Free-form I/O design,Power / Ground ring,Fine lead pitch 0.4mm,GND,aQFN,QFN,TFBGA,0.6-0.85,0.85-1,1-1.2,PKG height (mm),3,BT-RESIN,PAD (Cu),Solder Ball,(SAC305),Solder Mask,IMC layer,Au/Ni/SAC305,aQFN,TFBGA,4,aQFN,s Advantages vs,TFBGA & QFN,Package Structure,aQFN (MT6253),TFBGA (MT622,5,MT6318,),QFN (MT6139),Cost,Medium,High,Low,Thermal,Excellent,Medium,Excellent,Electrical,Excellent (Lead-frame),Medium (Substrate),Excellent,Anti-drop-&- twist,Excellent,Medium,Excellent,PKG profile,Low,High,Medium,Wire bond-ability,Good,Good,Medium,0.4mm Pitch,Yes,Yes,Yes,SMT,ability,Medium (,Few experience,),Good (Solder ball),Good (Single-row),Rework,Method,1.,Pre-solder,(Fresh),2.,Good SOP & Good Yield,Re-ball (Mature),Solder Iron (Mature),4,+,5,客户量产问题集,5,截至,3/12,，,18,客户已经,MP,共生产,802K.,平均良率,99.3%,6,PCB Layout suggestion for E-pad area:,推荐与,IC,接地焊盘相同,尺寸,(,即封装库,1,：,1,的,面积,比例,),制作,E-Pad.,PCB Layout suggestion for Signal Pad,：,推荐制作,直径,为,0.27mm,的圆形,焊盘,(,按封装库,1:1,制作,),，精度控制在,+/-0.02mm,禁止在,PCB,表层使用铺铜设计,.,为保证接地性能，,RF GND,间建议做成网格状走线或将,GND,Pad,连通到内层的,GND,平面,.,表层走线线宽尽量控制在,0.2mm,以内。,Pad,与,Pad,之间,留,有阻焊桥,.,解决方法,:PCB,设计,X,E-Pad,表层不铺铜,表层铺铜,6,7,Stencil Opening suggestion for E-pad area:,推荐钢网开口面积,为,PCB E-Pad,面积的,30%,40%.,推荐钢网开口边缘距离,PCB,焊盘边缘,0.2mm,以上,.,建议将钢网开口区域分割成为边长小于,2mm,的大小相等方块,.,Stencil Opening suggestion for Signal Pad,：,推荐采用,0.1mm,厚的钢网,.,推荐,Signal Pad,开口边长（直径）在,0.27mm0.28mm,之间,.,建议将其外形制作成方形,倒角或,圆形,.,解决方法：钢网设计,E-Pad,MT6253,Thickness,Opening,E-Pad,0.1mm,30%-40% Area,Signal Pad,0.1mm,0.2,7, 0.2,8,方形或圆形,7,8,MT6253,(aQFN) Task Force Team:,PCB Design / Stencil Guide,aQFN Reliability Introduction,aQFN SMT 试产体验方案,8,(,p,age A-1&2),(,p,age A-3&6),(,p,age A-7),9,Copyright MediaTek,Inc.,All rights reserved,.,Appendix,PCB Pad Design Guideline for aQFN,Land,Terminal,Land,Land,Copper,Solder,Thickness,Opening,0.8mm,0.4mm,Square,Squre,0.43mm,0.53mm,0.12mm,0.48mm,0.8mm,0.4mm,Circle,Circle,0.43mm,0.53mm,0.12mm,0.48mm,0.65mm,0.35mm,Square,Squre,0.375mm,0.475mm,0.12mm,0.4mm,0.65mm,0.35mm,Circle,Circle,0.375mm,0.475mm,0.12mm,0.4mm,0.5mm,0.3mm,Square,Squre,0.325mm,0.425mm,0.1mm,0.38mm,0.5mm,0.3mm,Circle,Circle,0.325mm,0.425mm,0.1mm,0.38mm,0.5mm,0.25mm,Square,Squre,0.275mm,0.375mm,0.1mm,0.33mm,0.5mm,0.25mm,Circle,Circle,0.275mm,0.375mm,0.1mm,0.33mm,0.475mm,0.27mm,Circle,Circle,0.27mm,0.3mm,0.1mm,0.27mm,0.4mm,0.2mm,Square,Squre,0.225mm,0.3mm,0.1mm,0.225mm,0.4mm,0.2mm,Circle,Circle,0.225mm,0.3mm,0.1mm,0.225mm,aQFN Package,PCB Pad Design,Stencil,A-1,11,Stencil,A,perture,D,esign rule,MT6253 PKG,PCB Land Pad Design,Stencil,Land Pitch,Terminal size,Land Shape,Land Shape,Copper Pad,Solder Mask,Thickness,Terminal,Opening,0.475,0.27,Circle,Circle,0.27,(,note1,),0.3,0(,note2,),0.1,0.23 0.27,GND,Opening,Thermal pad,Square,Opening,Matrix,Gap,7X7,0.5,(,note3,),8X8,0.25,0.33,GND,Unit: mm,Note:,1.,Pad,尺寸与,PCB,板厂制作能力决定,，此为推荐值，钢网开口尺寸与此值强相关,2.,由,PCB,板厂制作能力决定,，此为推荐值,3.,请在方框周边倒,R=0.075mm,的圆角,A-2,12,Moisture Sensibility Level Test,A-3,13,Board Level- Drop Test-1,A-4,14,Board Level- Drop Test-2,A-5,15,Package Wrapage - Twist,A-6,16,客户体验方案,Dummy IC,POD,Proposal & Flow:,1.,客户成立,TFT,小组, M,SZ,SA,与,CS,工程师将协同运作,2.,MTK,提供,1K,Dummy IC,与,100,片,Daisy PCB,并请,客户安排两次,SMT,体验试产,.,3.,每次试产前,MSZ,工程师会与,TFT study,与制定相关,参数后生产,如有必要两次试产中间,会邀请台湾封装,厂与相关技术人员至工厂作技术指导与,De-bug. .,MT6253,Daisy Chain,Daisy PCB,A-7,17,