珠海精毅电路有限公司简介

,Click to edit Master text styles,Second level,Third level,Fourth level,Fifth level,Click to edit Master title style,珠海精毅电路有限公司,ZhuhaiCamtechCircuitsCO.,Ltd,公司简介,Company profile,內容提要,组织架构图,2,产品结构,4,概述,3,1,技术规格,3,3,公司总览,3,5,概述,公司成立于,2010,年,位于广东省,珠海市斗门区斗门镇凯德斯工业区,厂房面积,:8000,月生产产能：,25000,致力于专业生产双面及多层精密印制线路板,员工人数,:400,人,组织架构图,技术规格,序号,项目,技术能力,1,层数,1-28,层,2,最大板尺寸,450 x660mm,（,18x26,）,3,最小板厚,4,层,0.38mm 15mil,6,层,0.55mm 22mil,8,层,0.80mm 32mil,10,层,1.00mm 40mil,4,最高铜厚,外层,6 oz/,内层,4 oz,5,最小线宽,/,线隙,0.075mm 3mil,6,最小孔径,0.15mm 6mil,7,孔壁铜厚,0.025mm 1mil,8,金属孔孔径公差,0.075mm 3mil,9,非金属孔孔径公差,0.05mm 2mil,10,孔位公差,0.05mm 2mil,技术规格,11,外形公差,0.10mm 4mil,12,最小绿油桥,0.075mm 3mil,13,板弯,/,板曲,1.0%,14,绝缘电阻,10,12,15,测试电压,50300,伏,16,抗电强度,1.3KV/mm,17,耐电流,10A,18,剥离强度,1.4N/mm,19,阻焊剂硬度,6H,20,抗热冲击,288 20,秒,21,防火等级,94V-0,22,阻抗控制,+/-10%(Differential),23,盲,/,埋孔,24,表面处理,沉金，沉银，银锡，,OSP,，无铅喷锡，含铅喷锡，电金,25,板材,Getek,罗杰斯,铝基,铜基,CEM-3,FR-4(Tg140c,Tg170c),其它,医疗,通信,电源,消费类,8L,10L,DS,6L,4L,产品应用图解,产品结构图解,铝基板,/,陶瓷板,TEFLON,FR4,H-Tg,产品基材图解,产品结构,主要客户,企业精神,对产品,对工作,对客户,精心,毅力,负责,Page 4,废气处理塔,设备图片,纯水系统,Page 4,钻孔,Drilling,沉铜,PTH(Electroless metalization),设备图片,Page 4,图形转移,Imaging Transferring,图形电镀,Automatic Pattern Plating,设备图片,丝印,Silkscreen Printing,锣板,Routing,设备图片,电测,E-T,设备图片,公司前台,员工口号,创造更美好的明天,自强,自信,自律,自力,Thank You!,