集成电路表面安装技术

单击此处编辑母版标题样式,单击此处编辑母版文本样式,第二级,第三级,第四级,第五级,*,*,表面安装技术,传统工艺与现代工艺,传统工艺,插脚封装,：,现代工艺,表面安装,：,表面贴装工艺,插脚工艺,与,传统工艺相比,SMA,的特点：,高密度,高可靠,小型化,低成本,生产的自动化,贴片工艺的优点,插脚工艺与贴片工艺的差别,类型,Through Hole Technology,Surface Mount Technology,元器件,双列直插或,DIP,针阵列,PGA,有引线电阻，电容,SOIC,SOT,SSOIC,LCCC,PLCC,QFP,PQFP,片式电阻电容,基板,印制电路板，,2.54mm,网格，,0.8mm0.9mm,通孔,印制电路板，,1.27mm,网格或更细，导电孔仅在层与层互连调用（,0.3mm0.5mm,），,布线密度高,2,倍以上，厚膜电路，薄膜电路，,0.5mm,网格或更细,焊接方法,波峰焊,再流焊,面积,大,小，缩小比约,1,：,31,：,10,组装方法,穿孔插入,表面安装,-,贴装,自动化程度,自动插件机,自动贴片机，生产效率高,印刷机,自动印刷机,手动印刷机,现代工业设备,自动贴片机,手动贴片机,现代工业设备,贴片机,光学检测机,人眼检测,现代工业设备,光学检测机,现代工业设备,波峰焊测机,现代工业设备,无铅回流焊机,工厂一角,(1).,贴装电阻,（封装为,1206,）,(2).,贴装电阻,（封装为,SOT-23,）,39k,62k,表面贴装元器件（,SMD,）,(3).,二极管,(4).,电解电容,1N4148(,有黑环的一端为负,),LED (,有绿点的一端为负,),铝电解电容,(,有黑环的一端为负,),钽电解电容,(,有黑环的一端为负,),负,负,表面贴装元器件（,SMD,）,(5).,三极管,(6).,集成电路,9012,或,8550(,封装为,SOT-23),MCR100-6 (,封装为,SOT-89),钽电解电容,(,靠标记点一脚为,1),C,B,E,G,A,K,1,表面贴装元器件（,SMD,）,SMT,工艺流程双面回流焊,通常先作,B,面,再作,A,面,印刷锡高,贴装元件,再流焊,翻转,贴装元件,印刷锡高,再流焊,翻转,清洗,双面再流焊工艺,A,面布有大型,IC,器件,B,面以片式元件为主,SMT,工艺流程回流焊,+,波峰焊,波峰焊,插通孔元件,清洗,混合安装工艺,多用于消费类电子产品的组装,印刷锡高,贴装元件,再流焊,翻转,点贴片胶,贴装元件,加热固化,翻转,先作,A,面：,再作,B,面：,插通孔元件后再过波峰焊：,SMT,工艺流程回流焊与波峰焊,印刷锡高,贴装元件,再流焊,清洗,锡膏,回流焊工艺,简单，快捷,涂敷粘接剂,红外加热,表面安装元件,固化,翻转,插通孔元件,波峰焊,清洗,贴片,波峰焊工艺,价格低廉，但要求设备多，难以实现高密度组装,PCB,元件,钢网印刷,贴片,回流焊,SMT,SMT,工艺流程实现,自动化设备,手工设备,锡膏,刮刀,钢网,PCB,SMT,工艺流程实现钢网印刷工艺,自动化钢网印刷,手动钢网印刷,锡膏,),图片,锡膏类型,M705-GRN360-K2-V,L23-BLT5-T7F,物质含量,Sn 96.5/ Ag 3.0/ Cu 0.5,Sn 42/ Ag 1.0/ Bi 57,熔点,217,138204,颗粒尺寸,25-36,m,25-36,m,粘性,200,200,锡膏的主要成分：,锡膏,),成 分,主 要 材 料,作 用,焊料合金粉末,Sn/Pb,Sn/Pb/Ag,SMD,与电路的连接,助,焊,剂,活化剂,松香，甘油硬脂酸脂，盐酸，联氨，三乙醇酸,金属表面的净化,增粘剂,松香，松香脂，聚丁烯,净化金属表面，与,SMD,保持粘性,溶 剂,丙三醇，乙二醇,对焊膏特性的适应性,摇溶性,附加剂,Castor,石腊（腊乳化液）,软膏基剂,防离散，塌边等焊接不良,钢网设计规则,SMT,工艺流程实现贴片工艺,自动化贴片机,手动贴片,X-Y DATA,CAM350 edit Gerber file,Combination X-Y Data and Gerber file by CPS,SMT,工艺流程实现贴片定位,SMT,工艺流程实现回流焊工艺,预热,回流焊温度曲线,25150 ,150217 ,Over 217 ,Over 230 ,below 217 ,Ramp up : 6/sec (max),Ramp down : 6/sec (max),25,150,217,230,保温,回流,冷却,峰值,= 235255,温度,时间,This heating zone cause the uniform-temperature in all part of PCBA, that can reduce PCB warped ,and avoid solder-paste heating disproportion ally to cause splash down to get another failure,Pre-heat zone temperature setting :,(,generally setting, actually constant follow vendors data specification,),Lead-free ,25(room temp) 150 ,:,预热段是把,PCBA,加热到均匀温度状态，以防止,PCB,板,变形,回流焊温度曲线预热段,Solder-paste include solder alloy and Flux.,Commonly, Flux content include Rosin, Activation, Solvent, and,Rchological,addition.,Flux-heating can cause the content of Flux deoxidize solder to raise the soldering of the joint.,Soaking zone temperature setting :,(,generally setting, actually constant follow vendors data specification,Lead-free ,150 , 220 ,:,保温段包括去除氧化层，软化锡膏，挥发非焊接材料等功能,回流焊温度曲线保温段,In the Reflow zone, solder-joint comes into being Interface-alloy, that because most of metal becomes being melting.,Peak temperature is in this zone, that is the highest temperature in the profile.,Generally, in this zone (,230 to peak temp,) means solder alloy is in the melting states and different metals are becoming interface-alloy.,Sometimes, we can raise the of this zone to reduce void occur ratio.,Reflow zone temperature setting :,(,generally setting, actually constant follow vendors data specification,),Lead-free ,Over 220 ,Peak temp : 235255,回流段：锡膏变变成熔融状态,回流焊温度曲线回流段,In IPC 610-D, solder-joint must to be bright , shine and smooth .,When interface-alloy coagulated, the ramp down ratio (cooling rate) is more fast, that cause alloy atomic bond becomes more tightly, that cause solder surface is more shine and smooth .,Cooling zone temperature setting :,(,generally setting, actually constant follow vendors data specification,),Lead-free Ramp down ratio : 6 /sec,冷却段：锡膏从流体状态变为固体状态,回流焊温度曲线冷却段,Sample,image,inspect,image,1.,采取自动化光学检测技术,2.,检测项目,：,Missing parts/Polarity/Reverse/missing solder/Bridge/Shift /etc;,3.,可检最小器件,：,Angular chips 0201,；,SMT,工艺流程实现自动光学检测工艺,CCC,系统,功能,：,By,Regional network,control production line and feedback the NG phenomenon from AOI machine in factory at once.,REPAIR system Function,：,1.,Record the NG data for AOI.,2. Mark the NG location.,3. Using the statistic data to,calculate the NG rate by SPC,.,On production,AOI in line record,SMT,工艺流程实现自动光学检测工艺,脉冲可调恒流充电器电路原理图,脉冲可调恒流充电器印制电路板图,温馨提示,由于手抖，开始贴装的元件会,有点歪斜，,先不急于去调整，贴完后再做调整。,虽然元器件安装在电路板上需要高的精度，但是在回流焊的情况，这种要求稍有放松。这是因为熔融的焊剂的表面张力有自动调节中心的作用。,如有焊膏连在一起，焊接后不会短路。,手工放置元器件时，每个元器件位置下面有明显的取向标志图示。,调试步骤,.,w,2,动端调到地端，可控硅不起作用,.,示波器观测,NE,555,的输出幅度、周期、及占空比范围。,.,直流毫安表测量充电器的电流及调节范围。,注意事项,用第一个作品（直流稳压电源）作为供电电源。,将示波器探头钩拆下，使用探头针测试。,测试完毕后，装好探头钩，并由组长负责检查。,