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Rigid-Flex PresentationRigid-Flex Presentation2Content:Material Introduction Design rule Standard Process Flow Open Discussion2Content:3 1.軟板基材薄膜種類軟板基材薄膜種類 聚脂樹脂(Polyester,PET)-尺寸熱安定性不如 PI Aramid纖維布-高吸水性，單價及使用性並不理想 強化型介電材料 撓曲性較差且供應者與使用者不多 氟素樹脂膜-無法在高溫下維持尺寸的穩定 聚亞醯胺樹脂聚亞醯胺樹脂(Polymide,PI)-熱聚合後仍保一定柔軟與彈性，同時在很寬的操作範圍下有不 錯電氣特性故最常使用。Material IntroductionMaterial Introduction3 1.軟板基材薄膜種類Material Int4 2.聚亞醯胺基材種類聚亞醯胺基材種類 依軟板結構分為兩大類 1.有接著劑三層軟板基材(3L FCCL)2.無接著劑二層軟板基材(2L FCCL)兩者分屬不同製造過程，製造方式與材料特性不同。3L應用在大宗軟板產品，2L用在較高階軟板製作上，例：軟硬複合板、COF。以單面板為例COPPERPI銅箔基板(FCCL)高尺寸安定需求高尺寸安定需求高尺寸安定需求高尺寸安定需求高密度線路需求高密度線路需求高密度線路需求高密度線路需求耐化性需求耐化性需求耐化性需求耐化性需求電氣特性需求電氣特性需求電氣特性需求電氣特性需求耐燃性需求耐燃性需求耐燃性需求耐燃性需求環保需求環保需求環保需求環保需求COPPERAdhesivePI銅箔基板(FCCL)2L-FCCL 3L-FCCLMaterial IntroductionMaterial Introduction4 2.聚亞醯胺基材種類COPPERPI銅箔基板5 2-1.聚亞醯胺薄膜簡介聚亞醯胺薄膜簡介 聚亞醯胺薄膜(Polyimide,簡稱 PI)，外觀呈黃棕色，是由芳香族的雙酐類 及雙胺類合成聚亞醯胺酸高分子(簡稱PAA)，之後經高溫熱化脫水形成。2-2.品目型號說明品目型號說明 各家標示項目不盡相同，以台虹3L-FCCL為例：Material IntroductionMaterial Introduction5 2-1.聚亞醯胺薄膜簡介Materia63.2L-FCCL製造方式與比較製造方式與比較Production MethodCross-Section塗佈法塗佈法(Casting)濺鍍法濺鍍法(Sputtering)壓合法壓合法(Lamination)Chill rollPI filmTargetVaccumChamberPAAHeaterPAAHeaterCopper foilPlating CuSputter metalPI filmCopper foilPAACopper foilTPIPI filmMaterial IntroductionMaterial Introduction63.2L-FCCL製造方式與比較Production Me73.2L-FCCL製造方式與比較製造方式與比較方法方法塗佈法塗佈法(Casting)濺鍍法濺鍍法(Sputtering)壓合法壓合法(Laminate)銅箔選擇性銅箔選擇性ED,RA限EDED,RA銅箔厚度銅箔厚度薄銅(9um)有良率問題可自由控制厚度薄銅(9um)有良率問題雙面板製造性雙面板製造性較複雜與困難相對容易相對容易接著特性接著特性優尚可優生產性生產性優差尚可基板透明性基板透明性尚可(有改善空間)優優成本成本低高中生產廠商代表生產廠商代表Nippon Steel（新日鐵）Sumitomo Metal(住友）Ube(宇部興業)Material IntroductionMaterial Introduction73.2L-FCCL製造方式與比較方法塗佈法(Casting8 資料來源：JMS；工研院IEK-ITIS計劃(2004/3)4.全球全球 FCCL廠商廠商 3L FCCL/2L FCCL概況概況ManufacturerAdhesive typeAdhesiveless typeARISAWATORAYNippon Steel(新日鐵)NIKKANNippon Mektron(NOK)UBE(宇部興產)Mitsui Chemical(三井化學)Dupont(杜邦)3MTHINFLEX(台虹)表量產 表小量產、試產或送樣中Material IntroductionMaterial Introduction8 資料來源：JMS；工研院IEK-ITIS計劃9CVL Cover layStructureRemark1.Protect circuit2.IsolationPI film AdhesiveRelease paperMaterial IntroductionMaterial Introduction9CVL Cover layStructureRemark110StructureRemarkPPNon-flow or Low-flow PPBSThickness:15um,25um,40umBonding material1.PP Prepreg1.BS Bonding sheetRelease paperAdhesivePET filmEpoxy&Glass fiberMaterial IntroductionMaterial Introduction10StructureRemarkPPNon-flow o11EMI material1.Silver filmStructureRemarkEx:SF-PC5000SF-PC1000(32um)SF-PC5000(22um)SF-PC5500(22um)Material IntroductionMaterial Introduction11EMI materialStructureRemarkE12Content:Material Introduction Design rule Standard Process Flow Open Discussion12Content:13A.A.Working Panel SizeWorking Panel Size Popular Working Panel SizeB.Usable area,Border(A,B)B.Usable area,Border(A,B)and Routing Path(C)and Routing Path(C)Structure typeMIN.AMIN.BMIN.CMIN.C*InchmmInchmmInchmmInchmmPCB(1 press)0.4711.430.6516.510.12.540.31.07.6225.4PCB(2 press)0.5513.970.7017.780.12.540.31.07.6225.4HDI(1 press)0.5513.970.7017.780.12.540.31.07.6225.4HDI(2 press)0.6516.510.8020.320.12.540.31.07.6225.4HDI(3 press)0.7519.051.0025.40.12.540.31.07.6225.418X20 inch457.2 x 508 mmWidth XLength YC C A B PCBPCBPCBPCB*PCB with 1.G/F Design2.Impedance couponDesign Rule13Working Panel Size Popular W14Optimized.Array Size16“X19.685”4.4212“x4.6”(77%)3.517“x4.6”(77%)4.4212“x3.425”(77%)3.517“x2.72”(76%)17“X19.685”4.4212“x4.8”(76%)3.517“x4.8”(76%)4.4212“x3.675”(77%)3.517“x2.92”(76%)18“X19.685”4.4212“x5.1”(76%)3.517“x5.1”(76%)4.4212“x3.925”(78%)3.517“x3.12”(77%)Panel typePanel size Optimized Panel Utilization Design Rule14Optimized.Array Size16“X19.15NF Prepreg NF Prepreg FCCLNF Prepreg NF PrepregL1L2L3L4L5L6Flex areaRigid AreaTransition ZoneRigid AreaDesign Rule15NF Prepreg NF Prepreg FCCLNF16FCCLFCCL:Flex Copper Clad LaminateCVL:Cover layerStiffener:FR4/PI/Stainless base ReinforcementLow flow Prepreg:Resin scale flow lower than normal typeBS:Bonding SheetSF:Silver Foil(EMI shielding)Partial CVLComponent on flexPlus II-stack viaSqueeze out(from Low flow Prepreg)Terms&Definition:Design Rule16FCCLFCCL:Flex Copper Clad L17UMT StandardUMT Advanced1eSMT pad(edge of pad)to board edge spacingRigid/Flex400um300um2dShield can(edge of ground)to board edge spacingRigid/Flex300um200um3dGround plane to board edge spacingRigid/Flex300um200um4dPower plane to board edge spacingRigid/Flex300um200um5cTrace(edge of trace)to board edge spacing Rigid/Flex400um250um6aMicro-via(edge of pad)to board edge spacingRigid/Flex400um300um7bPlated through hole(edge of pad)to board edge spacingRigid/Flex400um300um8bNon plated through hole to board edge spacing(no pad)Rigid/Flex300um200um9bBuried via(edge of pad)to board edge spacingRigid/Flex400um300umdFlex AreaBoard edgeBoard edgeabcFlex AreaBoard edgeBoard edgeeFlex AreaBoard edgeBoard edgeTrace and component pad at transition zone:Design Rule17UMT StandardUMT Advanced1eSM18UMT StandardUMT Advanced10FAdhesive squeeze outRigid/Flex0.80mm0.50mm11GMinimum flex width Flex2.00mm1.00mm12HFlex outline radiusFlex1000um500um13IMilling pathRigid/Flex1.00mm0.80mmGHRigid PCBRigid PCBFIFlex areaMechanical design at transition zone:Design Rule18UMT StandardUMT Advanced10FA19ItemDesign IssueUMTStandard GuidelineUMTAdvanced GuidelineS1Minimum S1 bending to board edge distance1.00mm0.80mmS2minimum flexible area(edge of FPC)to board edge spacing2.00mm1.50mmS1Flexible areaRigid areaS2Mechanical design at transition zone:Design Rule19ItemDesign IssueUMTStandard20Rigid sectionRigid sectionPunch with hard die requirement,UMT suggest to place radius 0.50mm.(Change from right angle to radius.Only UV laser cutting can make it right angle.)BeforeBeforeAfterAfterMechanical design for flex radius:Design Rule20Rigid sectionRigid sectionPu21Rigid sectionRigid sectionRadius only 0.2mmPunch with hard die requirement,UMT suggest to place radius 0.50mm.(Change from right angle to radius.Only UV laser cutting can make it right angle.)BeforeAfterMechanical design for flex radius:Design Rule21Rigid sectionRigid sectionRa22UMT suggest to make this waste slot as min.1.50mm wide.Rigid sectionRigid section1.25mmNominal 2.00mmOr min.1.50mmBeforeAfterMechanical design for flex outline:Design Rule22UMT suggest to make this was23UMT suggest to make these corners as full radius.Rigid sectionRigid sectionKey points:The quality of appearance inspection for these corners will be better.(Burr-both rigid and flex material will be less than previous design.BeforeAfterMechanical design for flex outline:Design Rule23UMT suggest to make these co24UMT suggest to place two pcs in zero degree direction and the other two pcs in 180 degree rotation.YXRigid sectionRigid sectionKey Points:All outline should be symmetrical.(Incl.waste material slot)Mechanical design for panelization:Design Rule24UMT suggest to place two pcs25Provide tear resistance,UMT suggest to place recessed slot at the transition zone.Rigid sectionRigid sectionKey Points:A recess slot would decrease the stress.Recommended slot width:Min.1.50mm;Nominal:2.00mmMechanical design for transition zone:Design Rule25Provide tear resistance,UMT26Mechanical design for bending criteria:Radius&Flex lengthDesign Rule26Mechanical design for bendin27Content:Material Introduction Design rule Standard Process Flow Open Discussion27Content:281.TYPE 1(STANDARD PROCESS)2.TYPE 2(PMF PROTECT FLEX)3.LASER CUTTING(For Remove FR4)4.TYPE 3(FR4 PROTECT FLEX)CONTENT:28TYPE 1(STANDARD PROCESS)CONTYPE 1 PROCESS(Standard)(For Flex Without Edge Finger or SMT Pads)TYPE 1 PROCESS(Standard)(FUnimicronUnimicron(TYPE 1)(TYPE 1)A.Stack up&Structure 3+(2F)+3A.Stack up&Structure 3+(2F)+UnimicronUn31(L45)Flex Material Wait for Combination With Rigid materialCover layer Material Lamination(Flex core with CVL)CVL-CuttingMechanical Drilling(I)Inner Layer (image transfer)DES Line (develop,etch,strip)AOI(automatic optical inspection)Oxide Treatment P.T.H&Copper PlatingLaminate Cutting(TYPE 1)(TYPE 1)B.Process Flow-Flex(L4-L5)B.Process Flow-Flex(L4-L5)Sub processMain process31(L45)Wait forCover layer Lam32L36 Plus I ProcessConformal Mask (image transfer)DES Line (develop,etch,strip)AOI(automatic optical inspection)Ply-Up Of LayerLamination L45-coreBlind&Copper PlatingLaser DrillingBlaser AOIInner Layer (image transfer)DES Line (develop,etch,strip)AOI(automatic optical inspection)Oxide Treatment Wait for Build up to L27Non flow Prepreg Material Prepreg Routing(TYPE 1)(TYPE 1)B.Process Flow-Rigid-Flex(L3&L6)Plus IB.Process Flow-Rigid-Flex(L3&L6)Plus ISub processMain process32L36 Conformal Mask DES Lin33L27 Plus II ProcessConformal Mask (image transfer)DES Line (develop,etch,strip)AOI(automatic optical inspection)Ply-Up Of LayerLamination L36-coreBlind&Copper PlatingLaser DrillingBlaser AOIInner Layer (image transfer)DES Line (develop,etch,strip)AOI(automatic optical inspection)Wait for Build up to L18Non flow Prepreg Material Prepreg Routing Oxide Treatment(TYPE 1)(TYPE 1)B.Process Flow-Rigid-Flex(L2&L7)Plus IIB.Process Flow-Rigid-Flex(L2&L7)Plus IISub processMain process33L27 Conformal Mask DES Lin34L18Plus III ProcessLay UpLamination L27-coreConformal Mask (image transfer)DES Line (develop,etch,strip)AOI(automatic optical inspection)P.T.H&Copper PlatingMechanical Drilling(I)Laser DrillingBlaser AOIOuter Layer (image transfer)DES Line (develop,etch,strip)AOI(automatic optical inspection)Solder MaskImmersion GoldRouting Hard Die PunchingO/S TestingOQCPacking&ShippingNon flow Prepreg Material Prepreg Routing(TYPE 1)(TYPE 1)B.Process Flow-Rigid-Flex(L1&L8)Plus IIIB.Process Flow-Rigid-Flex(L1&L8)Plus IIISub processMain process34L18Lay UpLamination L27-coreTYPE 2 PROCESS(PMF Protect Process)(For Flex With Edge Finger or SMT Pads)TYPE 2 PROCESS(PMF Protect36UnimicronUnimicron(TYPE 2)(TYPE 2)A.Stack up&Structure 1+(1+2F+1)+1 A.Stack up&Structure 1+(1+2F+1)+1 36UnimicronUnimicron(TYPE 2)A.37(L34)Flex Material Tooling DrillLaminate CuttingInner Layer L3/L4 (image transfer)DES Line (develop,etch,strip)AOI(automatic optical inspection)Wait for Combination With Rigid materialCover layer Material Lamination(Flex core with CVL)CVL-CuttingPumiceStiffener Material Stiffener ShearingLamination(Flex core with stiffener)PMF Material PMF ShearingLamination(Flex core with PMF)BakingLaminationFlex core with PMFSub processMain processPlasma Brown OxideB.Process Flow-Flex(L3-L4)B.Process Flow-Flex(L3-L4)(TYPE 2)(TYPE 2)37(L34)Tooling DrillLaminate C38Build Up L2-L5(Plus I)Wait for Build up to L1/L6PP CuttingLamination(with flex core)Blaser AOIMechanical Drill(L2-L5)Plug viaburied via L2-L5)ScrubbingInner Layer L2/L5 (image transfer)AOI(automatic optical inspection)Conformal Mask (image transfer)DES Line (develop,etch,strip)AOI(automatic optical inspection)Laser Drilling(L2-L3/L4-L5)P.T.H&Copper PlatingDES Line (develop,etch,strip)B.Process Flow-Rigid-Flex(L2&L5)Plus IB.Process Flow-Rigid-Flex(L2&L5)Plus I(TYPE 2)(TYPE 2)Sub processMain process38Build Up L2-L5Wait for Buil39L1-L6 ProcessLay upLamination Conformal Mask (image transfer)DES Line (develop,etch,strip)AOI(automatic optical inspection)L25-build up ICopper Reduction(by chemical)Electro-plating(filled via)Laser Drilling(L1-L2/L5-L6)Blaser AOIMechanical Drill P.T.H&Copper PlatingOuter Layer L1/L6 (image transfer)DES Line (develop,etch,strip)AOI(automatic optical inspection)Routing-2O/S Testing OQCPacking&ShippingSolder MaskImmersion GoldRouting-1Remove rigid waste area above flex areaPSF Lamination(cover rigid area)Plating hard gold(finger on flex)Remove PSF Flex PunchPP routingB.Process Flow-Rigid-Flex(L1&L6)Plus IIB.Process Flow-Rigid-Flex(L1&L6)Plus II(TYPE 2)(TYPE 2)Sub processMain process39L1-L6 Lay upLamination ConfoLASER CUTTINGDIAGRAMLASER CUTTINGDIAGRAM41LASER CUTTING DIAGRAM FOR CAP REMOVAL LASER CUTTING DIAGRAM FOR CAP REMOVAL Step 1Transition LineTransition LineStep 2Step 3Laser stop(target)copper design in L2/51.Laser Drill from top to L2&bottom to L52.Etch away target copper in L2&51.Remove FR4 cap above Flex along with laser cutting path41LASER CUTTING DIAGRAM FOR CATYPE 3 PROCESS(FR4 Protect Process)(For Flex With Edge Finger or SMT Pads)TYPE 3 PROCESS(FR4 Protect43(TYPE 3)(TYPE 3)A.Stack up&Structure 2+(2F)+2 A.Stack up&Structure 2+(2F)+2 43(TYPE 3)A.Stack up&Struct44B.Process Flow-Flex(L3-L4)B.Process Flow-Flex(L3-L4)(L34)Flex Material Mechanical Drilling(I)P.T.H&Copper PlatingLaminate CuttingInner Layer&DES (image transfer)AOI(automatic optical inspection)Oxide TreatmentWait for Combination With Rigid materialCover layer Material Lamination(Flex core with CVL)CVL-DrillingLaminationFlex core with CVLCVL-PunchSub processMain processSub processMain process(TYPE 3)(TYPE 3)44B.Process Flow-Flex(L3-L445B.Process Flow Rigid Inner CoreB.Process Flow Rigid Inner CoreRigid Inner Core ProcessWait for Build up to L25Bonding Sheet Material BS DrillingCore drillingLaminate CuttingInner Layer&DES (image transfer)AOI(automatic optical inspection)CORE-CuttingSoft Bonding(Core with BS)BS-PunchSub processMain process(TYPE 3)(TYPE 3)Bonding Sheet(BS)Inner core(one side copper)45B.Process Flow Rigid Inne46B.Process Flow Rigid-Flex(L2&L5)Plus IIB.Process Flow Rigid-Flex(L2&L5)Plus IIL25 ProcessLamination(Flex with Rigid )Micron viaCopper PlatingInner Layer&DES (image transfer)(L2/L5)AOIOxide TreatmentWait for Build up to L16Rigid Rigid FlexConformal Mask (image transfer)DES Line (develop,etch,strip)AOI(automatic optical inspection)Laser Drilling(L2-L3/L4-L5)Rigid core Laminate with Flex core(PRESS)Sub processMain process(TYPE 3)(TYPE 3)46B.Process Flow Rigid-Flex47B.Process Flow Rigid-Flex(L1&L6)Plus IIB.Process Flow Rigid-Flex(L1&L6)Plus IIL16 ProcessLay upLamination Laser Drilling L25-coreP.T.H&Copper PlatingDrilling Outer Layer&DES (Image transfer)(L1/L6)AOISolder maskRemove FR4 Above FlexImmersion Ni/Au Printing of Legend CNC Routing(2)O/S TestingFinal PunchBlaser AOIOQCPacking&ShippingConformal Mask (Image transfer)DES Line (develop,etch,strip)AOI(Automatic optical inspection)Sub processMain process(TYPE 3)(TYPE 3)CNC Routing(1)47B.Process Flow Rigid-Flex48Thank you48Thank you49Reference49Reference50L TypeU TypeZ Type Measure Method:1.Pretreatment:Reflow 2 cycles2.According customers condition to test 3.Static:above 30cycles，Dynamic:Until fail.Criteria:Resistance change rate 10%Reliability on flex:Bending test50L TypeU TypeZ Type Measure M51AB BAB Measure Method:1.Pretreatment:Reflow 2 cycles2.According customers condition to test 3.Static:above 30cycles，Dynamic:Until fail.Criteria:Resistance change rate 10%Reliability on flex:Sliding Test51ABBAB Measure Method:Reliabi52 Measure Method:1.Pretreatment:Reflow 2 cycles2.Criteria:Resistance change rate 10%Reliability on flex:Torsion test52 Measure Method:Reliability 53 Measure Method:1.Pretreatment:Reflow 2 cycles2.Criteria:Resistance change rate 10%Reliability on flex:G/F crack Test53 Measure Method:Reliability
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