ASM自动焊线机器介绍Auwirebondingprocess

2021/7/1 page 1Section 9.3 Basic Au Wire Bond Process2021/7/1 page 2ContentspBasic IntroductionpGold Wire BonderpBonding SequencepMaterial&ToolspBond Quality2021/7/1 page 3Basic IntroductionpUnderstand an IC PackagepIC Manufacturing FlowpWire Bonding Introduction2021/7/1 page 4Cross-section of an IC PackageDieGold WireLead Frame2021/7/1 page 5Wafer GrindingDie BondingWafer SawToaster Wire Bonding Die Surface Coating Molding Laser MarkSolder BallPlacement SingulationPackingIC Manufacturing FlowDejunk TrimSolder PlatingSolder PlatingForming/SingulationTrim/Forming BGASURFACEMOUNTPKGTHROUGHHOLE PKG2021/7/1 page 6Gold Wire Bonding2021/7/1 page 7Wedge Bonding2021/7/1 page 8What technique is used in Gold Wire Bonding?2021/7/1 page 9Wire Bonding TechniquespThere are three basic wire bonding techniques:n Thermosonic bonding:utilizes temperature,ultrasonic and low impact force,and ball/wedge methods.n Ultrasonic bonding:utilizes ultrasonic and low impact force,and the wedge method only.n Thermocompression bonding:utilizes temperature and high impact force,and the wedge method only.2021/7/1 page 10Thermocompression vs ThermosonicpThermocompression welding usually requires interfacial temperature of the order of 300 C.This temperature can damage some die attach plastics,packaging materials,and laminates,as well as some sensitive chips.pThermosonic welding,the interface temperature can be much lower,typically between 100 to 150 C,which avoids such problems.The ultrasonic energy helps disperse contaminates during the early part of the bonding cycle and helps complete the weld in combination with the thermal energy.2021/7/1 page 11Advantages of ThermosonicpMetallurgical joining is more reliable than conductive particles and adhesive joining.pProcess cycle time can be reduced from several minutes to less than 10 seconds.pLower manufacturing cost per unit.2021/7/1 page 12WirebondingOperating TemperatureWire MaterialsPad MaterialsNoteThermo-compression300-500 CAuAl,AuHigh pressure,no ultrasonic energyUltrasonic25 CAu,AlAl,AuLow pressure in ultrasonic energyThermosonic100-240 CAu,CuAl,AuLow pressure in ultrasonic energyComparison of Different Wire Bonding Techniques2021/7/1 page 13What are the important parameters in Gold Wire Bonding?2021/7/1 page 14Bonding ParameterspThermosonic Bonding n Pressure(Force)n Amplify&Frequency(Power 138KHz)n Welding Time(Bond Time)n Welding Temperature(Heater)High Power3.2W maxLow Power1.6W maxUltra-Low Power0.8W maxPower-mWVib.-umPower-mWVib.-umPower-mWVib.-um32003.2116002.268001.592021/7/1 page 15SiO2Si Bonding PrincipleAlPressure(Force)Vibration(Power)Al2O3GlassHeat2021/7/1 page 16Next to Gold Wire Bonder2021/7/1 page 17Gold Wire BonderpMachine RoadmappUnderstand Individual PartpMachine SpecificationpBonding Temperature2021/7/1 page 18ASM Gold Wire Bonder RoadmappMachine Model(ATS)n AB308AB309AB309AAB339AB339EagleEagle60 Eagle60AP Harrier Twin Eagle HummingBird n Eagle50?2021/7/1 page 19ASM Gold Wire Bonderp Machine Model(ATS)Description2021/7/1 page 20MatchingEagle60APEagle60-03HummningBirdHarrierTwin Eagle .ACEDB2021/7/1 page 21Eagle60AP Machine Introduction2021/7/1 page 22Eagle60 vs Eagle60APEagle60Eagle60APFine pitch 35 m.30 m.Speed 60+ms.60 ms.BondheadDigital bondheadNew bondhead with 810%faster Bond Placement Accuracy 3 m 3 sigma 2.5 m 3 sigmaLoop TypesStandard looping databaseAdditional Escargot,Flex,Bell loopOpticsProgrammableBall Formation MonitoringStandard8x fasterCapacitance non-stick detectionStandard10 x faster2021/7/1 page 23uLow impact forceuReal time Bonding Force monitoringuHigh resolution z-axis position with 0.4 micron per encoder stepuFast contact detectionuSuppressed Force vibration&Fast Force responseuFast response voice coil wire clampBond Head ASSY2021/7/1 page 24X Y TableuLinear MotoruHigh power AC Current AmplifieruDSP based control platformuHigh X-Y positioning accuracy of+/-3 um3 sigmauResolution of 0.2 um per encoder step2021/7/1 page 25W/H ASSYpIndexing resolution of 1um per encoder steppFully programmable indexer&trackspMotorized window clamp with soft close featurepOutput indexer with leadframe jam protection featurepTool less conversion window clamps and top plate enables fast device2021/7/1 page 26Bonding SystemuBonding Method Thermosonic(TS)uBQM ModeMulti-mode with programmable BQM BduWire Size15.2um up to 76.2um(Au,Cu)uWire Length0.6 to 8mmuBonding Accuracy+/-2.5um 3 sigmauBonding Area54mm X 65mm(LF Width 72mm)54mm X(137-LF Width)mmuBonding Speed+60ms for 2mm Wire(Q loop)uBond Force Range1400 gramuLoop TypeQ-Auto,Square&PentauLoop Height Range316 miluXY Resolution 0.2 umuZ Resolution0.4 umuFine Pitch Capability 30 um pitch 0.6 mil wireuNo.of Bonding Wires up to 3000uProgram Storage1000 programs on Hard DiskuTransducer System138KHZ2021/7/1 page 27Vision Systemu Pattern Recognition Time60 ms/pointu Pattern Recognition Accuracy 0.37 umu Lead Locator Detection12 ms/lead u Minimum Lead Pitch80 umu Post Bond Inspection1st,2nd Bond and Wire Tracingu Depth of Field3.5X(320um)8X(100um)Facilitiesu Single Phase 110 VAC(optional 100/120/200/210/220/230/240 VACu Floor Spacing 720mm(width)X 820mm(length)X 1600mm(height)2021/7/1 page 28Material Handling SystemuIndexer Resolution1umuLeadframe Position Accuracy 2 miluApplicable Leadframe W=23 90 mm bonding area in Y=65mm L =140 295 mm T =0.1 0.8 mmuApplicable Magazine W=16 100 mm(Maximum)L =140 295 mm H =180 mm(Maximum)uMagazine Pitch 2.4 10 mm(0.09”0.39“)uDevice Changeover 4 minutes(within same LF type)uPackage Changeover 1000,490/1004,8,1175%)2021/7/1 page 123Inter-metallic Layer ThicknessX=Kt1/2Where X is the inter-metallic layer thickness,t is the time and K is the rate constant which is calculated by following:K=Ce-E/KT Where C is the rate constant,e is the activation energy,K is the Boltzman constant,and T is the temperature in absolute scale.2021/7/1 page 124CBall bondTest specimenSpecimen clampShearing ramWireBond shoulderInterfacial contactball bond weld areaBonding padh(A)UnshearedCLCBall bondCLTest specimenSpecimen clampBonding padFull ball attached to wire-except for regionsof intermetallic voidingBall separated at bonding pad-Ball interface-residual intermetallic(and sometimes portion of unalloyed ball and metal)on pad in bond interaction area(D)Ball bond-bonding pad interface separation(typical Au to Al)CTest specimenSpecimen clampShearing ramWireMinor fragment of ballattached to wireBonding padCLBall sheared too high(off line,etc.)only aportion of shoulder andball top removedInterfacial contactball bond weld area(B)Wire(ball top and/or side)shearCBall bondCLTest specimenSpecimen clampShearing ramBonding padMajor portion of ball attached to wireInterfacial contact-ball bond weld area intact(C)Below center line shear,ball sheared through(typically Au to Au)CBall bondCLTest specimenSpecimen clampBonding padPad metallization separates fromunderlying surfaceResidual pad on ball ball-pad interfaceremains intact(E)Bond pad liftsTest specimenSpecimen clampCBall bondCLBonding padBonding pad lifts,taking portion of underlying substrate material with it(F)CrateringResidual pad and substrate attachedto ball,ball-pad interface remainsintactShear Failure Modes2021/7/1 page 125Normal Condition2021/7/1 page 126Material Problem2021/7/1 page 127With BallWirePad SizeMissing BallWire BrokenBonding Ball InspectionpBall Detection 2021/7/1 page 128Ball Size Pad CenterBall CenterBall Placement(X,Y)Ball Off Pad Bonding Ball Inspection(cont.)pBall Measurement 2021/7/1 page 129u Peeling1st Bond Fail(1)Power too muchBase Force not enoughAl pad not fully cured or contamination between Al and oxide layer2021/7/1 page 130u Ball Lift1st Bond Fail(2)Ball LiftBall Lift With Pad PeelingBase Power not enoughMaterial problem 2021/7/1 page 1311st Bond Fail(3)pNeck CrackRD too highRH too lowWrong/over used capillaryWire Clamp gap too smallWire problemEFO Current too large 2021/7/1 page 132Off Center BallTail Length too longWire or Wire Path contaminationEFO Box or cable connection problemAir Tensioner flow too low 1st Bond Fail(4)pOff Center Ball(Golf Ball)2021/7/1 page 133u Smash BallTail Length too shortWire or E-torch contaminationTip of tail length swing away from E-torch Smash Ball2021/7/1 page 134uMissing BallTail Length too shortFire Level too low or too highE-torch tip dirty2nd Bond Power/Force/Search Speed too high 2021/7/1 page 135With WeldWireCapillary MarkMissing WeldBroken WedgeLeadSufficient Wedge Width&LengthSecure Tool ImpressionNo Fish TailNo Damage/Broken WedgeBonding Weld InspectionpWeld Detection2021/7/1 page 136Broken Wedge2nd Bond Power/Force too highLead clamping not enough2nd Bond Fail(1)pBroken Wedge2021/7/1 page 137Lead floating or contamination2nd bond time,power,force too smallOver used capillary2nd Bond Fail(2)pLift Stitch2021/7/1 page 138Capillary Geometry2nd bond time,power,force too smallOver used capillary2nd Bond Fail(3)pStitch Peeling2021/7/1 page 139Wire ShortCapillary GeometryWire Path problemSecond Bond parametersAir Tensioner problem Looping Fail(Wire Short 1)pWire Sway2021/7/1 page 140Wire ShortCapillary GeometryWire Clamp Gap too bigTail BentAir Tensioner Force not enough Looping Fail(Wire Short 2)pLoop Base Bent2021/7/1 page 141Wire ShortCapillary GeometrySearch Delay setting not optimizedBase strength too weak,increase RD Looping Fail(Wire Short 3)pExcessive Loop2021/7/1 page 142Floating leadsFriction along wire pathTrajectory selection is not goodWire on capillary is not good Looping Fail(Inconsistent)pInconsistent Looping2021/7/1 page 143Critical Parameters for Bondingu Bond Parameter Contact Time、Power、Force(for 1st&2nd Bond)u Base Parameter Base Time、Power、Force(for 1st&2nd Bond)u Reference Parameter Search Height、Search Speed(for 1st&2nd Bond)u EFO Parameter Ball Size、FAB Size、EFO Time、EFO Current、EFO Voltage.u Looping Parameter R.H、R.D、Neck Angle、.2021/7/1 page 144Multi-tier Looping2021/7/1 page 145Stacked DieDie Thickness 80umTotal Die Height 850um2021/7/1 page 146Ultra Low LoopBell LoopEscargot LoopLoop HeightMinimum32 m.Maximum42 m.Mean37 m.Loop HeightMinimum40 m.Maximum47 m.Mean44 m.2021/7/1 page 147Short Wire LoopingDie edge to wire gap27.38 m mmDie edge to 2nd bond pt.124.3 m mm2021/7/1 page 148J WirepJ wire on 1st and 2nd kinkn Provide better wire clearance and mold sweep especially for the corner wires2021/7/1 page 149BSOB/BBOS/Pump BallBond Stitch On BallBond Ball On Stitch2021/7/1 page 150Bond Stitch On StitchSide View of 2nd BondTop View of 2nd BondTop View of Looping2021/7/1 page 151Multi-Ball&Flex Bump BallTop View of Multi-BallSide View of Multi-BallFlex Bump Ball ShapeLooping for Flex Bump Ball2021/7/1 page 152 END 若有不当之处，请指正，谢谢！若有不当之处，请指正，谢谢！