无线通讯领域之技术进步与产品开发趋势

单击此处编辑母版标题样式,单击此处编辑母版文本样式,第二级,第三级,第四级,第五级,Aug 31-Sept 3 2006,China Mobile Workshop,*,Technology and product development trends in wireless communications,无线通讯领域的技术进步和产品开发趋势,Jahan Ghofraniha,Ph.D.,Taiyuan,Shanxi,China,Aug 31-Sept 3,Northwestern Polytechnic University,美国西北理工大学,Aug 31-Sept 3 2006,China Mobile Workshop,2,Outline,主要内容,Wireless technology overview.,无线通讯技术的回顾,Trends in wireless communications.,无线通讯的发展趋势,Main technologies affecting these trends.,影响这些发展趋势的主要技术,Main players in wireless semiconductor sector.,无线半导体行业中的主要竞争对手,Interaction of networking technology and mobile communications.,互连网技术和移动通讯技术的相互作用,Aug 31-Sept 3 2006,China Mobile Workshop,3,Technology Overview,技术回顾,1,G,2G,2.5 G,3G and 4G.,ANALOG AMPS,TACS,NTT,1980 1990 2000 2010,years,1,G 2G 3G 4G,2.4,kbps,64,kbps,2,Mbps,1,Gbps,DIGITAL IS-95,IS-136,GSM,PDC,IMT-2000,Broadband wireless,Narrowband,窄带,Wideband,宽带,Broadband,Aug 31-Sept 3 2006,China Mobile Workshop,4,Technology Overview,技术回顾,1,G was very slow and mostly carry over from the past.1G,非常慢，都是已发生图象,2 G,faster data rates(upto 64kps)but too slow for retrieving images and text.2G,比较快（可达,64kps），,但是还是太慢，不能回溯图象和文本,The wide range demand on data rates led to 3G standard(high data rates,2Mbps).,对数据传输速率的广泛需求导致了3,G,标准的诞生（高速传输，,2Mbps),4G,global wireless system goal is to offer cellular and nomadic broadband access everywhere.4G,全球无线系统的目标是让全世界每个地方都能够连接到离动宽带网上。,Aug 31-Sept 3 2006,China Mobile Workshop,5,Wireless Trends in User Domain,从用户的角度看无线通讯的发展趋势,Increase in 2.5G and 3G handsets.2.5G,和3,G,话机增加,Enhanced multimedia(Edge,GPRS,Camera phones).,多媒体效果加强（,Edge,GPRS，,可摄象话机等）,From Gartner Report,Aug 31-Sept 3 2006,China Mobile Workshop,6,Mobile World Market,移动通讯世界市场,Enhanced phones will have the main market share.,功能强大的话机将占据主要的市场分额,2003,2006,Aug 31-Sept 3 2006,China Mobile Workshop,7,3,G Architecture Impact3G,结构的影响,3,G architecture will change the semiconductor trends towards a single chip implementation.3G,结构将使半导体技术朝着单芯片结构发展,2,G and 2.5 G Architecture 2G,和2.5,G,结构,Media,Baseband,Radio,Memory,Aug 31-Sept 3 2006,China Mobile Workshop,8,3,G Architecture Impact3G,结构的影响,In 3G we see a single chip implementation.,在3,G,结构中我们看到的是单芯片结构,3,G Architecture 3G,结构,Media,Baseband,Radio,Memory,Aug 31-Sept 3 2006,China Mobile Workshop,9,Market Demands Low Cost,市场需求与降低成本,There will be a lot of pressure on handset manufacturers to bring the cost down.,话机制造商将面临巨大的市场压力来降低成本,2000 Nokia 82102002 skyworks GSM/GPRS Chipset,Baseband:$15.62-Baseband:$11.00,Pwr Mgnt:$4.00-Pwr Mgnt:$4.00,Transceiver:$4.16-Pwr amp:$3.00,Pwr Amp:$2.67-antenna:$2.00,Antenna:$2.00,Total:$28.45-Total:$20.00,Aug 31-Sept 3 2006,China Mobile Workshop,10,Role of Baseband Section,基带的作用,Baseband processing constitutes the main cost of the system.,基带处理将是整个系统中成本最高的部分,Baseband will dominate the cost while it will be the main revenue factor.,基带将继续是成本的主要部分，同时也将是收入的主要部分,RF contributions will decrease.RF,的贡献将减少,Baseband includes;analog and digital BB,memory,power management and media processor.,基带包括：模拟和数字,BB，,存储器，电源管理和媒体处理器,Aug 31-Sept 3 2006,China Mobile Workshop,11,Baseband Processing=Growth,基带处理=增长,Baseband is where all the wireless chipset manufacturers are focusing.,基带是所有无线芯片制造商都非常注目的地带,This translates into new approaches to baseband processing,new power management systems and innovative memory solutions,.,这也就是说，基带处理、电源管理和存储方式将不断地进行改进,Aug 31-Sept 3 2006,China Mobile Workshop,12,Important Architectures,Wireless application processors will combine video and graphics.,无线处理器将集图象和图表功能与一体。,What is the trade off?,那么为此而付出什么代价？,There are 3 main architectures:,主要有三种结构：,Stand alone application processors,独立处理器,Highest Performance.,功能最强,Highest Cost.,成本最高,Aug 31-Sept 3 2006,China Mobile Workshop,13,Important Architectures,2.,Integrated application processors,集成处理器,Low Cost.,成本低,High Performance.,性能好,3.Baseband application processing,基带处理,Lowest Cost.,成本最低,Lowest Performance.,性能最差,Aug 31-Sept 3 2006,China Mobile Workshop,14,RF Packaging TrendsRF,包装发展趋势,Enhanced phones will be the driving force in the handset market.,强化话机将占据话机市场的主流,RF chips will also move towards a single package solution.RF,芯片也将朝着单包装的方向发展,Examples are:Skyworks,RFMD,Agilent,Renesas,Motorola.,例如：,Skyworks,RFMD,Agilent,Renesas,Motorola,Aug 31-Sept 3 2006,China Mobile Workshop,15,Innovative RF Architectures,创新性,RF,结构,New multiband/multimode handsets will need new RF solutions.,新的多带/多制式话机将需要新的,RF,结构设计,RF architectures address the new demand by using SiGe and CMOS processes.RF,结构将通过使用,SiGe,和,CMOS,处理系统来满足新的需求,New reconfigurable architecturs and WCDMA baseband processors will come to help.,另外，新的可重新刻度结构和,WCDMA,基带处理器也能够帮助满足新的市场需求,Bulk Acoustical Wave Filters.,大容量声学滤波器,Aug 31-Sept 3 2006,China Mobile Workshop,16,Key Players in Wireless Chipset,无线芯片领域的饿主要竞争对手,Intel,TI,Qualcomm,Motorola,STMicro,Philips,Infineon,Agere,Skyworks,RFMD,Aug 31-Sept 3 2006,China Mobile Workshop,17,Key Semi PA Suppliers,主要半导体,PA,供应商,RFMD,Skyworks,Renesas,Motorola,Philips,Anadigics,Aug 31-Sept 3 2006,China Mobile Workshop,18,Key Semi Transceiver Suppli