目视检验规范教材

按一下以編輯母片標題樣式,按一下以編輯母片,第二層,第三層,第四層,第五層,*,目視檢驗規范,IPC610,IPQC RUI_LI2010/1/20,目視檢驗規范標准,IPC610,1.,允收標准,2.,拒收標准,零件本體僅下方有二接觸點的零件Chip ponents/Bottom Only Terminations cont.,偏移 Shift,允收,(Target Condition),零件黏焊於錫墊中心位置,沒有任何偏移.,No side overhang.,允收極限,(Acceptable),零件往錫墊寬邊(A)偏移,但零件,本體寬邊(C)有75%以上焊接於,錫墊上.,零件本體與電路板錫墊間(G)錫,厚至少0.2 mm.,Side overhang(A)is allowed if,minimum end joint width(C),requirements are met.Minimum,is 75%.,Minimum thickness(G)is 0.2,mm unless satisfactory cleaning,can be demonstrated with reduced,clearance.,拒收,(Nonconforming Defect),零件往錫墊寬邊(A)偏移,且零,件本體小於75%寬邊(C)焊接,於錫墊上.,零件往錫墊長邊(B)偏移.,Side overhang(A)is allowed if,minimum end joint width(C),requirements are met.,Minimum is 75%.,Minimum thickness(G)is 0.2 mm,unless satisfactory cleaning can be,demonstrated with reduced clearance.,零件本體有1,3,5面矩形金屬焊接點,Rectangular End ponents-1,3or5 side Termination 偏移 Shift,允收,(Target Condition),零件金屬部份黏焊於錫墊中,心位置,沒有任何偏移.零件,本體錫墊完全沾錫.,No side overhang.Side joint,length(D)equals component termination length.,允收極限,(Acceptable),零件往錫墊寬邊(A)偏移,但,零件本體金屬焊墊寬邊(W),75%以上焊接於電路板錫墊上.,End joint width(C)is 75%width,of component termination area(W),or 75%width of PB land(P),whichever is less.,拒收,(Nonconforming Defect),零件往錫墊寬邊(A)偏移,但零,件本體不足75%寬邊(C)以上焊,接於電路板錫墊上.,零件往錫墊長邊偏移(B).,Side overhang(A)causes,minimum end joint width(C),requirements not to be met.,End overhang(B)is not permitted.,零件本體有1,3,5面矩形接觸點 Rectangular End ponents-1,3or5 side Termination 偏移 Shift,允收,(Target Condition),零件黏焊於錫墊中心位置,沒有任何偏移.零件本體錫,墊完全沾錫.,No side overhang.,允收極限,(Acceptable),零件往錫墊寬邊偏移,但零件,之焊接面佔75%以上.,End joint width is 75%width of,component termination area or,75%width of PB land,whichever,is less.,拒收,(Nonconforming Defect),零件往錫墊長邊偏移.,End overhang is not permitted.,圓柱體零件 Cylindrical End Cap Termination 偏移 Shift,允收,(Target Condition),零件黏焊於錫墊中心位置,沒有任何偏移.,吃錫面在圓筒零件直徑(W),與板上錫墊長(P)之間.,No side overhang.,End joint width is equal to,or greater than the,component width(W)or,width of the land(P),whichever is less.,允收極限,(Acceptable),零件往錫墊寬邊偏移(A),側,邊偏移度允收極限為零件直,徑(W)的25%或錫墊長度(P),的25%.,Side overhang(A)is 25%,diameter of component width,(W)or land with(P).,拒收,(Nonconforming Defect),零件側邊偏移度(A)超出25%零,件直徑(W)或錫墊長度(P)的25%.,零件往錫墊長邊偏移(B).,Side overhang(A)is 25%,diameter of component width(W),or land with(P).,End overhang is not permitted.,無導腳零件,Leadless Chip Carriers with Castellated Terminations 偏移 Shift,允收,(Target Condition),零件未偏移.,零件延伸引腳長等於電路板,上錫墊長.,零件立於電路板上錫墊中心.,No side overhang.,Fillet extension equals land,width.,Fillet height covers terminal.,允收極限,(Acceptable),零件偏移向錫墊寬邊之間(A),偏移度小於電路板上錫墊面,(W)的25%.,Maximum side overhang(A)is 25%W.,拒收,(Nonconforming Defect),零件偏移向錫墊寬邊之間(A),偏,移度大於電路板上錫墊面(W)的,25%.零件偏移向錫墊長邊之間,(B).,Maximum side overhang(A)is,25%W.,End overhang(B)is not permitted.,允收,(Target Condition),零件腳未偏移.,No side overhang.,允收極限,(Acceptable),零件偏移向錫墊寬邊之間(A),偏移小於電路板上錫墊寬度,(W)的 25%或偏移小於0.5mm.,Side overhang(A)is 25%W or,0.5 mm.,拒收,(Nonconforming Defect),零件偏移向錫墊寬邊之間(A),偏移大於電路板上錫墊寬度(W),的 25%或偏移大於0.5mm.,不允許任何的零件趾端偏移,如(B).,Side overhang(A)is greater than,25%W or 0.5 mm whichever is,less.,Toe overhang(B)is not specified,平緞腳 L型/鷗翼腳/圓柱L腳,Flat Ribbon L/Gull Wing leads/Round leads 偏移 Shift,I 腳“I Leads 偏移 Shift,允收,(Target Condition),零件腳未偏移.,No side overhang.,允收極限,(Acceptable),零件偏移向錫墊寬邊之間(A),偏移大於錫腳寬度(W)的25%,仍不允許.不允許任何的偏移.,Overhang(A)exceeds 25%lead,width(W).No overhang,allowed.,拒收,(Nonconforming Defect),不允許任何的零件趾端偏移,如(B).,Toe overhang(B)is not specified.,範例 Example-平緞腳 L型/鷗翼腳/圓柱L腳 Flat Ribbon L/Gull Wing leads/Round leads,允收,(Target Condition),允收極限,(Acceptable),拒收,(Nonconforming Defect),範例 Example-平緞腳 L型/鷗翼腳/圓柱L腳 Flat Ribbon L/Gull Wing leads/Round leads,拒收,(Nonconforming Defect),拒收,(Nonconforming Defect),拒收,(Nonconforming Defect),範例 Example-J 腳/I 腳,允收極限,(Acceptable),拒收,(Nonconforming Defect),拒收,(Nonconforming Defect),範例 Example,拒收,Nonconforming Defect,高翹,/,LIFTED,範例 Example,高翹,/,LIFTED,OK,NG,範例 Example,拒收,Nonconforming Defect,折腳,/,BENT,缺件,/,MISSING,偏移,/,SHIFT,範例 Example,拒收,Nonconforming Defect,破損,/,DAMAGE,範例 Example,拒收,Nonconforming Defect,撞件,/,BROKEN,撞件,/,BROKEN,範例 Example,允收極限,Acceptable,偏移,/,SHIFT,錫洞,/,Solder Hole,範例 Example,ASR1:LED2,反向,/,REVERSE,拒收,Nonconforming Defect,缺口端為負極/Nick side is“,5168:SW4,反向,/,REVERSE,Switch,數字與,PCBA,同向/,Number on ponent same direction with PCBA.,範例 Example,折腳,/,PIN BENT,包焊,/,Poor Solder,拒收,Nonconforming Defect,範例 Example,拒收,Nonconforming Defect,NG,OK,退,PIN,Travis M/B DIP ponent cosmetic,1,整体高翘，且最大不可以超过,0.3mm,2,.后邊、前邊緣高翹不可超過0.2mm,整體高翹,單邊高翹,Travis M/B DIP ponent cosmetic,1.,水平高翘，最大允许限度为,0.3mm.,2.,不允许,單,边高翘。,Travis base sample,RAM,的卡勾不可出现变形等不良。,Travis M/B DIP ponent cosmetic,不能出现任何标记,特别是有铅异物。,不能出现任何标记,特别是有铅异物。,Travis M/B DIP ponent cosmetic,JUSB,不可出现气泡和明显擦痕,.,Travis base sample,Microphone 不能失掉海绵，禁止使用双面胶黏贴脱落海绵。,Travis M/B solder hole,JDOCK 不允許單邊高翹,Travis base sample,1.Function Pin,吃锡量不应少于,75%.,2.,固定,pin,锡量不应少于,50%.,以固定住零件为标准,3.,折脚,1,:,如果,pin,折,脚,但是,有露出，,function,測試pass,可以判断为良品。,2,如果,pin,脚完全没有露出，则要判断为不良。,固定pin,Function pin,Travis base sample,pin,脚不可刺穿该处,Mylar,Travis base sample,Smart c