Fabrication-technology-of-piezoresistive-conductive-PDMS-for-对压阻式导电PDMS制作技术ppt课件

按一下以編輯母片標題樣式,按一下以編輯母片,第二層,第三層,第四層,第五層,*,Fabrication technology of piezoresistive conductive PDMS for micro fingerprint sensors,IEEE MEMS 2007,Miao Lu,Amine Bermak,Yi-Kuen Lee,學號:9635517,姓名:陳立仁,Fabrication technology of piez,1,Outline,Introduction,Material characterization,Device fabrication,Device characterization,Conclusion,OutlineIntroduction,2,Introduction,With the progress of computer and internet,our life become more convenient and,comfortable.But it is also convenient for,hackers.,Though,how to keep personal privacy is,very important.,IntroductionWith the progress,3,Introduction(cont.),http:/ characterization,Coductive PDMS(CPDMS):,Mixture of PDMS and carbon black,Gauge factor,=(R/R,0,)/,CPDMS,7.4,Constantan alloy,2.1,Si,120,Piezoresistive sensitivity(Pa ),=(R/R,0,)/,CPDMS,3X10,Si,10,-1,-6,-9,Material characterizationCoduc,5,Device fabrication,1.Sputter Ti/W and Au electrodes,2.Spin a layer of PR(AZ4620),then pattern the PR.,Device fabrication1.Sputter T,6,Device fabrication(cont.),3.Electroplate the mushroom-shaped,Au electrodes,then remove the PR.,4.Spin and pattern another layer of PR.,Etch electrodes and remove PR.,Device fabrication(cont.)3.E,7,Device fabrication(cont.),5.Spin a layer of PR as a well.,Pour the CPDMS on the substrate.,6.Remove the excessive CPDMS.,Strip the PR.,Device fabrication(cont.)5.S,8,Device fabrication(cont.),7.Deposit parylene to protect the,electrode.,8.Spin and pattern the PR.,Etch parylene,then strip the PR.,Device fabrication(cont.)7.D,9,Device fabrication(cont.),Device fabrication(cont.),10,Device characterization,Device characterization,11,Device characterization(cont.),Device characterization(cont.,12,Conclusion,The operating pressure range of this,device is really close to that of,commercial products.,If the package is not good enough,the sensing ability will be affected.,A well mixtured CPDMS is needed.,Conclusion,13,Thanks for your attendance!,Thanks for your attendance!,14,