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单击此处编辑母版标题样式,单击此处编辑母版文本样式,第二级,第三级,第四级,第五级,*,ODM,生產製造流程及內部作業程序,Agenda,1.ODM,業務簡介及重要性,2.,工廠生產流程簡介,3.,內部流程溝通及問題整合,ODM-Original Design Manufacture,OEM-Original Equipment Manufacture,ODM,業務簡介及重要性,進料所,必需之電子零件,零件製造廠商,企 劃,、,行 銷,完 成,品,交 貨,交 貨,檢 查,生 產,量 產,試 作 品 開 發,基 本 設 計,EMS,EMS,是包辦完成品製造廠商所企劃的製品之生產。,OEM,是製造廠商把自己開發或生產的製品用對方的商標提供。,何謂,EMS,企業,?,(Electronics Manufacturing Service),電子機器與零件的設計、試作、量產,接受委託專門公司,ODM,業務簡介及重要性,SMT Process,Solder,Print,Chip,Mount,IR,Re-flow,AOI,Test,To dip,Process,DIP Process,Visual,Inspect,Touch,Up,ICT/AOI,PCB,Routing,PCB,Assembly,Base Unit,Assembly,Burn-In,Test,FA Process,Function,Test,Final,Test,Final,Assembly,Packing,OQC,Shipping,工廠製程簡介,OOBA Check,-Out Of Box Audit(Test),Surface Mount Technique,Final Assembly,1.,調整承載,架寬度,2.,調進板架,1.,下刮刀,清刮刀,2.,清鋼板,3.,找鋼板,4.,選擇程式,5.,架治工具,6.PCB,定位校正,7.,架鋼板,8.Mark,校正,9.,刮刀壓力校正,10.Offset,調整,1.,拿取站數表,2.,下料,3.,取料,4.,上料,5.,下治具,/Pin,6.,架治具,/Pin,7.,輸入程式,8.,調整軌道,9.,選擇程式,10.PCB,定位,11.Offset,校正,12.,外籍對料,13.QC,對料,14.,檢查,Feeder,1.,拿取站數表,2.,下料,3.,取料,4.,上料,5.,支撐,Pin,佈局,6.,輸入程式,7.,調整軌道,8.,選擇程式,9.PCB,定位,10.Offset,校正,11.,外籍對料,12.QC,對料,13.,檢查,Feeder,1.,拿取站數表,2.,下料,3.,取料,4.,上料,5.,下治具,/Pin,6.,架治具,/Pin,7.,輸入程式,8.,調整軌道,9.,選擇程式,10.PCB,定位,11.Offset,校正,12.,外籍對料,13.QC,對料,14.,檢查,Feeder,1.,拿取站數表,2.,取料,3.,上料,4.,支撐,Pin,佈局,5.,選擇程式,6.QC,對料,7.,檢查,Feeder,8.,外籍對料,9.,點料,10.,更換,Nozzle,11.Tray,盤設定,吸料顆數,1.,調整軌道,2.,手放治具,調整,1.,調整軌道,寬度,2.,溫度設定,3.,昇溫等待,4.,測溫,1.,調整軌道,寬度,2.,調收板架,Loader,Printer,Chip-shooter I,IC Mounter,Work-Station,Reflow,Chip-shooter II,Mid-Mounter,Unloader,1.Material,By Model,Material,SMT,製程之基本認識,Loader,IC Mounter,Work station,Mid-Mounter,Chip-shooter I,Printer,Reflow,Unloader,Chip-shooter II,SMT,製程之基本認識,PM/Sales,QA,資材,RD,PE,ODM Meeting,ODM,執行組織架構,生管,QA,採購,/,物控,SQE/EMS,工廠,PE,Production Meeting,PM/Sales,對外,對內,ODM,相關專有名詞,-1,AFR(Annual Failure Rate),AOI(Automatic Optical Inspection),DOA(Dead on Arrival),DPPM(Defect Parts Per Million),ECN(Engineering Change Notice),ECO(Engineering Change Order),ECR(Engineering Change Request),EE(Electrical Engineering),EMI(Electromagnetic Interference),EOS(Electrical Over Stress),FAE(Field Application Engineering),FAI(First Article Inspection),FCC(Federal Communications Commission),ODM,相關專有名詞,-2,FCS(First Customer Ship),FFR(Field Fill Rate),FPF(First Pass Fall-out),FRR(Field Return Rate),ICT(In Circuit Test),ME(Mechanical Engineering),ORT(Ongoing Reliability Test),PE(Production Engineering),PMP(Process Management Plan),PPM(Part Per Million),QBR(Quarterly Business Review),QVL(Qualified Vendor List),SKU(Semi Kit Unit),SQE(Supply Quality Engineer),Q&A,
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