铝基板制作流程教材课件

Click to edit Master title style,Click to edit Master text styles,Second level,Third level,Fourth level,Fifth level,*,*,按一下以編輯母片標題樣式,按一下以編輯母片,第二層,第三層,第四層,第五層,*,Page,*,深入Thorough 專注Studious 紮實Steady,精緻化,Exquisite,单击此处编辑母版标题样式,单击此处编辑母版文本样式,第二级,第三级,第四级,第五级,*,競華電子(深圳)有限公司,A,+,PCB Electorics(Shen Zhen)Co.,LTD,鋁基板制作流程介紹,1,競華電子(深圳)有限公司,A,+,PCB Electorics(Shen Zhen)Co.,LTD,一、鋁基板制程,1、噴錫流程：,來料檢查 一次沖/鑽孔圖形轉移圖形檢查蝕刻退膜蝕檢阻焊制作 打定位孔字符制作噴錫噴錫檢查單面磨板（依客戶要求而定）V-CUT/成型通斷測試高壓測試FQC、FQA包裝入庫,2,競華電子(深圳)有限公司,A,+,PCB Electorics(Shen Zhen)Co.,LTD,2,、,OSP,流程,来料检查一次冲,/,钻孔图形转移图,形检查蚀刻退膜蚀检阻焊制作,打定位孔字符制作,V-CUT/,成型,测试,FQC,、,FQA,OSP,FQC,包装入库,3,競華電子(深圳)有限公司,A,+,PCB Electorics(Shen Zhen)Co.,LTD,二、制程制作事项,2.1来料检查IQC,A、铜面检查：不允许有凹坑、擦花和严重氧化痕迹；,Cu surface check:Notches,scratches and serious oxidation are not allowed.,B、保护膜检查：保护膜不应有破损至铝面露出；,Protective film check:Protective film mustnt be broken withCu exposure.,C、厚度检查：按流程卡要求检测板厚、铜厚。,Thickness check:Check board thickness and Cu thickness according to lot card.,4,競華電子(深圳)有限公司,A,+,PCB Electorics(Shen Zhen)Co.,LTD,2.2,一次冲,/,钻孔One-time Hole-punching/,drilling,A、一次冲,/,钻孔主要冲管位孔和工艺孔，孔位和孔徑均要符合图纸要求；,One-time hole-punching/drilling is mainly to punchorientation-hole and technical hole.The hole-position and hole-diameter must be consistent with drawing requirement.,B、冲/钻板方向为从铜面到铝面，可有效避免铝面擦花；,Punching/drilling direction is from Cu surface to Al surface,which can effectively avoid scratches of Al surface.,5,競華電子(深圳)有限公司,A,+,PCB Electorics(Shen Zhen)Co.,LTD,2.3、图形转移,Image Transfer,A、磨板,Scrubbing,a、为提高干膜和保护膜面的结合力，防止保护膜面干膜、脱落，可轻磨保护膜面；,In order to improve the combination of dry film&protective film and to avoid falling off dry film on the protective film,it is necessary to lightly scrub the surface of protective film.,b、不允许有板面氧化和胶渍现象。,Oxidation and left glue stains on the board surface cannot be allowed.,6,競華電子(深圳)有限公司,A,+,PCB Electorics(Shen Zhen)Co.,LTD,B 贴膜Film,a、干膜种类：*,film type:*,b、预烘和贴膜时间间隔要尽量短。,The interval between pre-cure and film-pasting time should be as short as possible,C,、静置冷却,Placing and Cooling,.為了對位的准确，需將已貼膜的鋁基板靜置冷卻至室,溫。,In order to assure accurate registration,it is necessary to place aluminous board with pasted film for a while until it reaches room temperature.,7,競華電子(深圳)有限公司,A,+,PCB Electorics(Shen Zhen)Co.,LTD,D,、曝光,a、负片黄菲林；,Negative Yellow Film,b、注意丝印孔对位的准确性。,Pay attention to the registration accuracy of silkscreening hole.,E,、静置,Placing,线路部分发生光聚反应,经15min左右充分聚合。,The light-gathering reaction happens at the circuit part and reaches full aggregation after 15 minutes.,F,、显影,Developing,8,競華電子(深圳)有限公司,A,+,PCB Electorics(Shen Zhen)Co.,LTD,2.4 圖形檢查,Image Check,A、檢查重點在于開路、短路、缺口、顯影不淨等；,Mainly check open circuit,short circuit,gap and,unclean developing etc.,B、修板時不能用黑油筆，只能用黑油補；,Black oil-pen cannot be used when mending board but black oil.,9,競華電子(深圳)有限公司,A,+,PCB Electorics(Shen Zhen)Co.,LTD,2.5 蚀刻,A、必须在首板试验合格方可批量生产；,It is obligatory to conduct mass production after the first batch of boards is confirmed to be qualified.,B、不允许有保护膜破损现象，如发现保护膜破损，则应先用皱纹胶贴好再过机蚀刻；,The dilapidation of protective film is not allowed and if the protective film is broken,it should use adhesive tape to mend it before placing boards on the etching machine.,C、尽量控制一次蚀刻干净；,Assure one-time clean etching as possible as it can.,D、图形内任何地方的残铜或绝缘层上的垃圾都不允许用刀片来刮；,Using knife to scrape off left Cu on any part of the pattern or the dirt on the insulated layer is not allowed.,10,競華電子(深圳)有限公司,A,+,PCB Electorics(Shen Zhen)Co.,LTD,2.6,退膜/清洗,Film-stripping/Cleaning,A、退膜不能浸泡在退膜缸中，必须直接过机退膜，一次性退膜干净；,To strip the films clearly at one time,use tackle roller instead of immersing in the stripping chemistry.,B、退膜过程中残留在板面的药水会影响铝基板成品的耐用程度，故需对剥膜后的铝基板进行有效的清洗；,The residues of the stripping chemistry would affect the durability of the IMS,so which need efficient cleaning after stripping films.,C、退膜干净后的铝基板必须进行烘干处理后方可往下流程；,Baking is required after stripping.,D、所有铝基板均不能进行手动蚀刻；,No manual etching is allowed.,E、如有蚀刻不净的板子，可进行快速过机返蚀;,If etching was not well done,re-etch is needed quickly.,11,競華電子(深圳)有限公司,A,+,PCB Electorics(Shen Zhen)Co.,LTD,2.7蚀刻检查Etching Check,A、绝缘层上的任何地方都不允许用刀片来刮；,Using knife to scratch any part of the insulated layer is not allowed.,B、主要检查短路、缺口、开路，报废单元不能钻孔，,只能用黑油笔打“”；,Mainly check short circuit,gap,open circuit.,Abandoned unit mustnt be drilled and can only be marked with“X”by black oil-pen.,12,競華電子(深圳)有限公司,A,+,PCB Electorics(Shen Zhen)Co.,LTD,2、8,阻焊制作Solder Mask Making,A,、单面磨板（线路面），不允许板面有氧化和胶渍现象；,Single-side scrubbing(circuit side).Oxidation and glue stains on the board surface are not allowed.,B,、待板子冷却至室温后印阻焊,Print solder mask after the board is cooled into room temperature.,C,、待铝基板冷却至室温后，方可对位曝光；,Register and expose aluminous PCB after it is cooled into room temperature.,a、对位前应认真检查板面是否有感光油堆积及不均匀，如有且多则应及时返工；,Before registration,it is necessary to seriously check if the sensitization oil accumulates on the board surface or is uneven.If there is a lot of sensitization oil on the board surface,it must re-process such boards in time.,b、对位时应注意菲林与板面MARK点的同心度；,During