手机照相模组生产流程介绍

,Confidential and Proprietary Information of Altus Technology Inc.,*,Go to View Mnu,Header/Footer and type Date,3,照相模块,COB,工艺流程,2,照相模块,SMT,工艺流程,4,1,照相模块基本结构,数据内容,照相模块产品类型,照相模块基本结构,1,照相模块,SMT,工艺流程,2,SMT,贴片流程,送板机：连片送板。,印刷机：印刷锡膏。,贴片机：组件的贴装。,回焊卢：固化组件。,AOI,：质量检测。,成品：完成电子元器件贴片,COB(,Chip on board,),-,芯片封装流程,照相模块,LHA,工艺流程,3,DA,着晶,最终外观检查,PCB,板清洁,PCB,板,贴载板,WB,焊,线,盖镜头,（,LHA),镜头检验,Wafer,清洗,烘烤（,PMC),SAW,打包入库,工单领料,三,目视检验,镜头来料点数,镜头转入载板,吹,气,镜头转,Tray,SN,Resolution,Sensor,Type,Connector,Remark,1,VGA,OV7690,OV7675,FF,BTB,Golden finger,Socket,2,1.3M,OV9665,S5K6AA,FF,BTB,Golden finger,Socket,3,2M,OV2655,FF,BTB,Golden finger,Socket,4,3M,OV3640,S5K5CA,ST-VD6803,AF,EDOF,FF,L/C,BTB,Golden finger,Socket,5,5M,OV5647,OV5642,S5K4E2,AF,EDOF,FF,L/C,BTB,Golden finger,6,8M,OV8825,AF,BTB,Golden finger,7,13M,Sony091,AF,BTB,Golden finger,照相模組產品類型,5,End,Thanks!,