入门级专业英文词汇

单击此处编辑母版标题样式,单击此处编辑母版文本样式,第二级,第三级,第四级,第五级,Page:,*,/15,PCB,入 门 级 专 业 英 语 词 汇,编制,:,工程,MI,组,日期,:2013-11-15,Page:,1,/15,物料篇,Laminate,层压板,Base material,基材,CCL(Copper-clad laminate),覆铜板,PP(,Prepreg,),胶片,预浸或半固化片,常用的有,1080/2113/2116/7628,等,.,Resin,Epoxy Resin,树脂,环氧树脂,Woven glass fabric,玻璃纤维布,Core,芯板,Copper foil,铜箔,主要使用的铜箔有,HOZ/1OZ,等,.,Rolled copper foil,压延铜箔,THE,铜箔,(High temperature elongation electrodeposited copper foil),高延展性电解铜箔,Kraft Paper,牛皮纸,Peelable,mask,兰胶,Kapton,tape,高温胶,Carbon ink,碳油,Page:,2,/15,Solder mask/Solder resist ink,阻焊油墨,Thermosetting type ink,热固化油墨,Silkscreen/Component mark/Legend,字符,Solder,Tin/Lead solder,焊料,铅锡焊料,Drill bit,Rout bit/milling cutter,钻咀,锣刀,铣刀,Chemical,化学的,Dry film,干膜,是一种能感光,显像,抗电镀,抗蚀刻之阻剂,TG(Temperature of,Glass Transition,),玻璃态转换温度,CTE(Coefficient of Thermal Expansion),热膨胀系数,CTI(Comparative Tracking Index),相对漏电指数,Anti-CAF(conductive anodic filament),耐离子迁移,Dielectric constant,介电常数,(DK/,Er,),TD(Temperature of Decompose),热裂分解温度,RoHS,(Restriction of Hazardous Substances Directive),危害性物质限制指令,(Lead,铅,Mercury,汞,Cadmium,镉,Chromium(VI),六价铬,Polybrominated,biphenyls(,PBBs,),多溴联苯,Polybrominated,diphenyl,ethers(,PBDEs,),多溴联苯醚,),Page:,3,/15,工艺篇,Laminate cutting,开料,裁板,Baking,烤板,Desmear,除胶渣,PTH(Plated-Through-Hole),镀通孔,也指沉铜,Plasma cleaner,等离子清洗,Panel plating,全板电镀,也叫整板电镀,Pattern plating,图形电镀,Image transfer,图形转移,Tin Stripping,褪锡,Etching,蚀刻,Under cut,侧蚀,SES,褪膜,-,蚀刻,-,褪锡连线,(,碱性蚀刻线,),DES,显影,-,蚀刻,-,褪膜连线,(,酸性蚀刻线,),Etching factor,蚀刻因子,(,蚀刻系数,),主要用来衡量侧蚀量的大小,蚀刻 因子,=2*,铜厚,/(,下线宽,-,上线宽,),Page:,4,/15,Solder mask printing,印阻焊,Exposure,曝光,UV cure UV,固化,(ultraviolet),LPI(Liquid Photo Image),液体感光成像,Developing,显影,Silkscreen stencil,丝印钢网，简称丝网,Aluminum sheet,铝片,Scrubbing,磨边,DI water,纯水,去离子水,(Deionization),由树脂对无物理大颗粒的水体进行阴阳离子的吸附,常见的有钙离子,/,氯离子,/,镁离子等,HASL(Hot Air Soldering Level),喷锡,热风整平,LF-HASL(lead free-hot air soldering level),无铅喷锡,ENIG/Immersion gold,沉金,(,沉镍金,Electroless Nickel/Immersion Gold),ENEPIG(,electroless,nickel,electroless,palladium immersion gold),沉镍钯金,HDI(High Density Interconnector),高密度互连,Page:,5,/15,Flash gold,水金,(,电薄金,),Hard gold,厚金,Immersion Tin,沉锡,OSP/Entek(Organic Solderability Preservatives),有机保焊剂,防氧化处理,Immersion silver,沉银,Pressing process,压合工艺,Brown oxidation,棕化,Layer up,叠层,预叠板,Lamination structure,压合结构,LASER(Light Amplification by Stimulated Emission of Radiation),镭射,激光,Registration,对准，对位,Page:,6,/15,OPE(,Optiline,Post Etch),內,层蚀,刻,对,位,冲,孔,机,Rivet,铆钉,/,铆合,Fusion,热熔,X-ray,X,射线,CCD(Charge Coupled Device),电荷耦合器件,X-Y dimension machine,二次元,Label,Barcode label,标签,条码标签,V-cut/V-score,刻槽,Rout,锣槽,锣板,Routing,布线,(route,的,ing,形式,),也指锣槽,锣板,Punch,冲板,/,啤板,AOI(Automated Optical Inspection),自动光学检查,Fly-probe test,飞针测试,Ultrasonic Cleaning,超声波清洗,Microetching,微蚀,Aspect Ratio,纵横比,厚径比,一般指板厚与最小孔孔径的比值,Page:,7,/15,工程篇,Gerber data:Gerber,资料,Original Gerber,原稿,Working Gerber,工作稿，生产稿,Specification,规格,规范,Fabrication drawing,制作图纸,Purchasing order,定单,Technical card/form,技术卡,/,表单,Pad,焊盘,Isolation pad,孤立焊盘,Ground layer,接地层,Power layer,电源层,Signal layer,信号层,Dielectric,介质层,Impedance,阻抗,Single-end impedance/Characteristic impedance,特性阻抗,Differential impedance,差分阻抗,Page:,8,/15,Copper circuits,线路,Solder mask opening,阻焊开窗,Solder dam/solder mask bridge,阻焊桥,Thermal Via,导热孔,散热孔,Teardrop,泪滴,Annular ring,焊环,Beveling,斜边,Chamfer,斜边,倒角,Clearance,清除,(,通常在内层指隔离环,clearance land,在阻焊指开窗,solder mask clearance),Via holes,导通孔,Component holes,元件孔,BGA(Ball Grid Array),矩阵式球垫表面装组件,IC,(Integrated Circuit),集成电路器,Pitch,节距,比如,IC,的节距,就是,IC pad,的中心距离,VIP,Via,in Pad,盘中孔,Page:,9,/15,SMD(,Surface Mount Device),表面贴装组件,(,零件,),SMT(Surface Mounting Technology),表面贴装技术,THT(Through hole technology),通孔插装技术,Artwork,底片,菲林,Break-away area/panel rail,工艺边,Panel/Set/array,套板,Panelization,排版,Component side,元件面,Solder side,焊接面,Soldering/Assembly,装配,Fiducial mark,光点,定位光学点,用于装配时定位,Slot,槽,FPC(,Flexible Printed Circuits,),软性电路板,(,软板,),挠性印制板,Rigid PCB,硬板,Rigid-Flex PCB,软硬结合板,Semi-Flex PCB,半挠性板,FR-4(,Flame Resistant Laminates,),耐燃性积层板材,Page:,10,/15,Gold fingers,金手指,Connector,连接器,Press-fit hole,压接孔,一般孔径公差要求严,插件的脚一般不需要焊接,Stamp hole/thread hole/mouse bite,邮票孔,Blind hole,盲孔,Buried hole,埋孔,Tooling hole,工具孔,一般为,NPTH,X-out,打,X,板,即有缺陷的板,Counterbore,沉头孔,Countersinking,锥型扩孔，嗽叭孔,Drill map/Drill drawing/Hole chart,孔图,SPC(Statistical Process Control),统计制程管制,Green,绿色,gloss green,光亮绿色,matte green/dull green,哑光绿色,Compensate,补偿,Page:,11,/15,品质篇,Tolerance/out of tolerance,公差,/,超出公差,Dimension,尺寸,Delamination,分层,多指多层板的金属层与树脂之间的分离而言,Dent,凹痕,/,凹陷,Wrinkle,皱褶,/,起皱,Hole breakout,孔破,Void,空洞,Nick,缺口,Pin hole,针孔,Wicking,灯芯效应,Cleanliness,清洁度,Ion Cleanliness,离子清洁度,Etchback,凹蚀,Negative,Etchback,负凹蚀,灯芯效应,Page:,12,/15,Electrical test,电测试,Roughness of hole wall,孔壁粗糙度,Shelf life,保质期,(,沉金,喷锡板,12,个月,OSP,沉银,沉锡,6,个月,),Inspection,检查,visual examination,目视检查,Thermal shock test,热冲击测试,Solderability test,可焊性测试,Edge dip test,浸锡测试,Solder float test,浮锡测试,Wave solder test,波峰焊 测试,Wetting Balance,湿润平衡,Conductor width,导体宽度,(,线宽,),Conductor spacing,导体间距,(,线距,),Page:,13,/15,Bow and twist,板弯板翘,Scratch,刮痕,刮伤,Measling,白斑,Split,裂纹,Repair/rewor