LED工艺制程+good

单击此处编辑母版标题样式,单击此处编辑母版文本样式,第二级,第三级,第四级,第五级,*,LED,工艺简介,LED,发光管是怎样练成的,衬底材料生长或购买衬底,LED,结构,MOCVD,生长,芯片加工,芯片切割,器件封装,Sapphire,蓝宝石,2-inch,衬底片,氮化物,LED,发光管的器件结构及发光机理,electrons,电子空穴复合发光,P,欧姆接触,N,欧姆接触,蓝宝石或碳化硅,MOCVD,外延,蓝宝石,缓冲层,N-,GaN,p-GaN,MQW,第一步 清洗,有机物,金属离子,第二步,n,区光刻,刻蚀,Cl2+Bcl3+Ar,去胶,3#,液,p,电极蒸发,P,电极光刻,P,电极腐蚀,KI+I2,去胶,丙酮,+,酒精,P,电极合金,O2,N,电极光刻,N,电极蒸发,N,剥离,N,退火,N2,P,压焊点光刻,P,压焊点蒸发,P,压焊点剥离,钝化层沉积,气体，功率,钝化层光刻,钝化层刻蚀,钝化层去胶,丙酮,中道终测检验,减薄,划片,裂片,扩膜,划片,裂片工作流程图,划片前晶片背面,划片后背面,划片后,侧视图,裂片后,侧视图,扩膜后,正视图,测试分检,LED:Whats inside?,electrodes,semiconductor,chip,epoxy,dome,bond wires,“silver cup”,reflector,Design Growth Processing,Packaging,Characterization,A packaged LED,Different parts of an LED,Process flow:,Radiometry,Photometry,Power,Watt (W),lumen (lm),Power per unit area,W/m,2,lm/m,2,=,lux,(lx),Power per unit solid angle,W/,sr,lm/,sr,= candela (,cd,),Photometry is just like radiometry except that everything is weighted by the spectral response of the eye,光学知识,Solid angle:,sr,= 2,(1 - cos(/2),立体角,:,如何理解光通量,(Lumen),和发光强度,(,Mcd,),470nm LED: 3000mcd (20mA),P*62.139(lm)/Sr(15Deg)=3cd,P*62.139/0.0537=3cd,P=0.00259W=2.58mW,市场上,:,