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单击此处编辑母版标题样式,单击此处编辑母版文本样式,第二级,第三级,第四级,第五级,*,*,笔记本结构设计经验教训NB,ME-Design-Lesson-learn,Case 1,BITLAND宝龙达,Root cause/Solution,R角可以改善力集中於尖角道是基本常識,Case 1,BITLAND宝龙达,Root cause/Solution,一形排氣不良所造成的B0ss尾端钻合產生劣,b可支撐,扭轉時所造成,Rb與boss面齊平有助於支撐 hinge扭轉所造成的廳力,Case 2,BITLAND宝龙达,Issue:Hinge Bracket broken,斷裂處工缺口,Case 2,BITLAND宝龙达,Root cause/Solution,彎折處高度,模具壓痕,Case 2,BITLAND宝龙达,Root cause/solution,Fu Roun,十h,A,CALE5 000,檢查此山型凹槽、是否有裂紋,圆角設計避免應力集中,RRSEE DETAILA,無圓,Case 3,BITLAND宝龙达,Issue:E-sata Jack Interferance,Case 3,BITLAND宝龙达,Root cause/Solution,For strength concerned to EC hinge support,Case 3,BITLAND宝龙达,Root cause/Solution,There are different type Jack,RD check Molex only(no plastic),foxconn and tyco have plastic 0.7mm high,interfere 0.3mm,Molex,Case 3,BITLAND宝龙达,Root cause/Solution,EMN has no top side portion,for all Jack,
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