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HDI Manufacturing Process FlowHDI Manufacturing Process FlowHDI Manufacturing Process FlowPre-engineeringPattern imagingEtchingLaminatingDrillingCu platingHole pluggingPattern imagingLaminationLaser AblationMechanical drillingPattern imagingCu platingSolder MaskSurface FinishedRoutingVisual inspectionElectric testShippingPre-engineeringPattern imagingPre-engineeringPattern imagingEtchingLaminatingDrillingPre-engineeringPattern imagingDesmearCu platingHole pluggingCu platingBelt SandingDesmearCu platingHole pluggingLaminationLaser AblationMechanical drillingCu platingPattern imagingLaminationLaser AblationMechanSolder MaskGold platingRoutingElectrical testPattern imagingSolder MaskGold platingRoutingHole counterShippingVisual inspectionHole counterShippingVisual ins1.內層基板(THIN CORE)LaminateCopper Foil裁板(Panel Size)COPPER FOILCOPPER FOILEpoxy GlassEpoxy Glass1.內層基板(THIN CORE)LaminateCoppPhoto ResistPhoto Resist2.內層線路製作(壓膜)(Dry Film Resist Coat)Etch Photoresist(D/F)Photo Resist2.內層線路製作(壓膜)(Dry Photo ResistPhoto Resist3.內層線路製作(曝光)(Expose)A/WArtworkArtwork(底片底片)ArtworkArtwork(底片底片)After ExposeBefore ExposePhoto Resist3.內層線路製作(曝光)(Expo4.內層線路製作(顯影)(Develop)Photo ResistPhoto Resist4.內層線路製作(顯影)(Develop)Photo Re5.內層線路製作(蝕刻)(Etch)Photo ResistPhoto Resist5.內層線路製作(蝕刻)(Etch)Photo Resis6.內層線路製作(去膜)(Strip Resist)6.內層線路製作(去膜)(Strip Resist)7.黑氧化(Oxide Coating)7.黑氧化(Oxide Coating)8.疊板(Lay-up)LAYER 2LAYER 3LAYER 4LAYER 5LAYER 1LAYER 6Layer 1Layer 2Layer 3Layer 4Copper FoilCopper FoilInner LayerPrepreg(膠片)Prepreg(膠片)8.疊板(Lay-up)LAYER 2LAYER 3LA9.壓合(Lamination)9.壓合(Lamination)典型之多層板疊板及壓合結構典型之多層板疊板及壓合結構.COPPER FOIL 0.5 OZThin Core,FR-4prepreg COMPS0LD.prepreg Thin Core,FR-4prepreg COPPER FOIL 0.5 OZ疊合用之鋼板疊合用之鋼板10-1210-12層疊合層疊合壓合機之熱板壓合機之熱板COPPER FOIL 0.5 OZThin Core,FR-4prepreg COMPS0LD.prepreg Thin Core,FR-4prepreg COPPER FOIL 0.5 OZ疊合用之鋼板疊合用之鋼板典型之多層板疊板及壓合結構.COPPER FOIL 0.5 墊木板鋁板10.鑽孔(Drilling)墊木板鋁板10.鑽孔(Drilling)11.電鍍Desmear&Copper Deposition11.電鍍Desmear&Copper Deposit12.塞孔(Hole Plugging)13.去溢膠(Belt Sanding)12.塞孔(Hole Plugging)13.去溢膠(14.減銅(Copper Reduction)Option15.去溢膠(Belt Sanding)Option14.減銅(Copper Reduction)Op16.外層壓膜 Dry Film Lamination(Outer layer)Photo Resist16.外層壓膜 Dry Film Lamination(17.外層曝光 ExposeUV光源17.外層曝光 ExposeUV光源18.After Exposed18.After Exposed19.外層顯影 Develop19.外層顯影 Develop20.蝕刻 Etch20.蝕刻 Etch20.去乾膜 Strip Resist20.去乾膜 Strip Resist21.壓合(Build-up Layer Lamination)RCCRCC(R Resin esin C Coated oated C Copper foil)opper foil)21.壓合(Build-up Layer Laminati21.護形層製作(壓膜)(Conformal Mask)Dry FilmDry Film(乾膜乾膜)Dry FilmDry Film(乾膜乾膜)21.護形層製作(壓膜)(Conformal MaskArtworkArtwork(底片底片)ArtworkArtwork(底片底片)22.護形層製作(曝光)(Conformal Mask)Before ExposureAfter ExposureArtworkArtwork22.護形層製作(曝光)(23.護形層製作(顯像)(Conformal Mask)23.護形層製作(顯像)(Conformal Mask)24.護形層製作(蝕銅)(Conformal Mask)24.護形層製作(蝕銅)(Conformal Mas25.護形層製作(去膜)(Conformal Mask)25.護形層製作(去膜)(Conformal Mask)26.雷射鑽孔(Laser Ablation)及機械鑽孔26.雷射鑽孔(Laser Ablation)及機械鑽Mechanical Drill(P.T.H.)Laser Microvia(Blind Via)27.機械鑽孔(Mechanical Drill)Mechanical DrillLaser Microvia28.電鍍(Desmear&Copper Deposition)28.電鍍(Desmear&Copper Deposi29.外層線路製作(Pattern imaging)壓膜(D/F Lamination)29.外層線路製作(Pattern imaging)壓膜曝光(Exposure)顯像(D/F Developing)曝光(Exposure)顯像(D/F Developing)蝕銅(Etching)去膜(D/F Stripping)蝕銅(Etching)去膜(D/F Stripping)30.防焊(綠漆)製作(Solder Mask)30.防焊(綠漆)製作(Solder Mask)WWEI94V-0R10531.S/M 顯像(S/M Developing)32.印文字(Legend Printing)WWEIR10531.S/M 顯像(S/M Develo33.浸金(噴錫)製作(Electroless Ni/Au,HAL)WWEI94V-0R10533.浸金(噴錫)製作(Electroless Ni/WWEI94V-0R105Dedicate or universal Tester Dedicate or universal Tester Flying Probe Tester Flying Probe Tester 34.成型(Profile)35.測試(Electrical Testing)WWEIR105Dedicate or universal WWEI94V-0R105WWEI94V-0R10536.終檢(Final Inspection)37.O.S.P.(entek plus Cu_106A.)OptionWWEIR105WWEIR10536.終檢(FinalLASER BLIND&BURIED VIA LAY-UPA=THROUGH VIA HOLE(導通孔)B=BURIED VIA HOLE(埋孔)C=One Level Laser Blind Via (雷射盲孔)LASER BLIND&BURIED VIA LAY-UPBURIED VIA AND LASER BLIND VIA OPTION(雷射盲埋孔之選擇)DCCD=Two Level Laser Via(雷射盲孔)CDCB-STAGEB-STAGEFR-4 CoreRCCFR-4 CoreB-STAGEB-STAGERCCABBALASER BLIND&BURIED VIA LAY-UBURIED VIA LAY-UPA=THROUGH VIA HOLE(導通孔)B=BURIED VIA HOLE(埋孔)C=BLIND VIA HOLE(盲孔)D=BLIND HOLE MLB VIA(多層盲孔)BLIND VIA LAY-UPBLIND VIA SEQUENTIAL LAY-UPABBARESINB-STAGE BLIND AND BURIED VIA OPTION(盲 埋 孔 之 選 擇)DACC E=VIA IN PAD(VIP)(導通孔在pad裡面)EBURIED VIA LAY-UPA=THROUGH VConventional PCBFR-4Build-upLayerBuild-upLayerPhoto-viaPhoto-Imageable Dielectric(PID)FR-4Conventional PTHConventional PTHConventional PCBFR-4Build-upBuConventional PCBBlind Via PCBPTH3 mil lineSVHIVHChip-on-SVHFR-4Conventional PTHConventional PTHConventional PCBBlind Via PCBPQ&AEND1、有时候读书是一种巧妙地避开思考的方法。7月-247月-24Tuesday,July 23,20242、阅读一切好书如同和过去最杰出的人谈话。16:18:0916:18:0916:187/23/2024 4:18:09 PM3、越是没有本领的就越加自命不凡。7月-2416:18:0916:18Jul-2423-Jul-244、越是无能的人，越喜欢挑剔别人的错儿。16:18:0916:18:0916:18Tuesday,July 23,20245、知人者智，自知者明。胜人者有力，自胜者强。7月-247月-2416:18:0916:18:09July 23,20246、意志坚强的人能把世界放在手中像泥块一样任意揉捏。23七月20244:18:09下午16:18:097月-247、最具挑战性的挑战莫过于提升自我。七月244:18下午7月-2416:18July 23,20248、业余生活要有意义，不要越轨。2024/7/2316:18:0916:18:0923 July 20249、一个人即使已登上顶峰，也仍要自强不息。4:18:09下午4:18下午16:18:097月-2410、你要做多大的事情，就该承受多大的压力。7/23/2024 4:18:09 PM16:18:0923-7月-2411、自己要先看得起自己，别人才会看得起你。7/23/2024 4:18 PM7/23/2024 4:18 PM7月-247月-2412、这一秒不放弃，下一秒就会有希望。23-Jul-2423 July 20247月-2413、无论才能知识多么卓著，如果缺乏热情，则无异纸上画饼充饥，无补于事。Tuesday,July 23,202423-Jul-247月-2414、我只是自己不放过自己而已，现在我不会再逼自己眷恋了。7月-2416:18:0923 July 202416:18谢谢大家谢谢大家1、有时候读书是一种巧妙地避开思考的方法。8月-238月-250
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