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Folienberschrift,Inhalt,*,*,Seite,*,按一下以編輯母片標題樣式,按一下以編輯母片,第二層,第三層,第四層,第五層,*,*,*,Metalex Enterprise,鎧蔚企業有限公司,Presentation,1,Metalex Enterprise1,今日主題,材料需求,for 3C,產品連接器,物理,/,機械特性 基礎簡介,&,對產品的影響,高性能銅合金,2,今日主題材料需求 for 3C 產品連接器2,連接器所需要的效能,銅材所必需具備的條件,高接觸力,/Normal Force,高降服強度,/Yield Strength,好的散熱性及低溫升,完成較低的接觸阻抗,高的導電率,/Conductivity,折彎角度小,/,微型化產品,優異的折彎性,/,低,R/T,比,交變應力不失效,/,高插拔次數,優異的抗疲勞強度,/Fatigue Strength,材料需求,for 3C,產品連接器,位移形變小,/,下壓行程有限但需高接觸力,符合環保標準,無環境有害物質,/ROHS,高楊氏,/,彈性系數,Youngs Modulus,高熱傳導係數,/Thermal Conductivity,持久的高接觸力,/,高溫環境下工作,高的抗應力鬆弛,/Stress Relaxation,3,連接器所需要的效能銅材所必需具備的條件,Tensile Test,抗拉測試,4,Tensile Test抗拉測試4,F,F,Tensile Test/,抗,拉測試,5,FFTensile Test/抗拉測試5,L,o=,50,mm,Lf=50 mm+A,A,Lo=5 mm,5 mm+A,A,5 mm,A,10 mm,A,50 mm,Tensile Test/,抗,拉測試,A,50 mm,=L,f,-L,o,x 100%,L,o,Lo-Original Length,/,原始長度,Lf-Final Length,/,最終長度,6,Lo=50mmLf=50 mm+AALo=5,Tensile Test,/,抗拉測試,R,m,Tensile strength,R,p0.2,Yield strength,Rupture,0.2%,Total elongation,Stress,MPa,=(L,f,-L,0,)/L,0,x 100%,R,p0.2,R,m,Elongation%,Youngs Modulus E,7,Tensile Test/抗拉測試Rm Tensile s,Stress,MPa,R,p0.2,Elongation%,Yield Strength/,降服強度,降服強度越高，要使材料產生永久變形的力也越大。適合需要高接觸力的產品。,8,Stress MPaRp0.2Elongation,Stress,MPa,Elongation%,Youngs Modulus,楊氏,/,彈性系數,楊氏系數越大斜率越陡，在相同形變下，有較高之接觸力。適合,下壓行程有限但需高接觸力的產品。但須配合降服強度。,E ,9,Stress MPaElongation%Yo,影,響,成型性能/折,彎,性能的因素,material/temper,材料/强度,bending direction,折,彎,方向,thickness,厚度(,通常,0.25 mm),beam width,折,彎寬,度(,通常,3 mm),Bending direction,Bending direction,good way,bad way,Rolling direction,10,影響成型性能/折彎性能的因素 material/tempe,r=0,90,V-shape die,Punch with bending radius,r,o,180,U-shape die,r,o,Punch with,bending,radius,specimen,影,響,成型性能/折,彎,性能的因素,bending angle,折,彎,角度,bending radius,折彎半徑,f,orming speed,成型速度,f,orming in steps,成型步驟,11,r=090V-shape diePunc,Electrical Current Sent,Current Received,In 2 seconds,Electrical Current Sent,Current Received,In 5 second,導電率的高低將影響阻抗的表現,導電率,/Conductivity,12,Electrical Current SentCurrent,維克氏硬度,硬度,=,材料抵抗凹陷的力量,薄的材料與過小的力量會增加數據的誤差,0.5 mm,厚度以下誤差甚大,0.5 mm,厚度以下只可為參考值,抗拉,/,降伏強度能夠更精確的表達材料強度,13,維克氏硬度硬度=材料抵抗凹陷的力量13,Load,Vickers,HV,Diagonal,Load,Brinell,HB,Diameter,Load,Rockwell,HRB,HR30T,Indentation depth,硬度測量法,维克氏,布氏,洛氏,14,LoadVickersDiagonalLoadBrinell,當端子在有接觸力的情況下,1),時間,2),溫度 將是材料產生應力鬆弛最主要的因素,Load,Time,Time,t,0,0,L,應力鬆弛,15,當端子在有接觸力的情況下LoadTimeTimet00L,40,50,60,70,80,90,100,100,1000,10000,K55-C70250,K75-C18070,C,5190,time(h),remaining stress(%),K88-C18080,K57-C70350,Relaxation 150 C,Thermally stress relieved samples,應,力,釋,放比照,-150 C,條,件下,Relevance for,automotive,applications,C5210,YCUT-F-H,應力鬆弛的比例*原始的強度,=,最終保留的強度,K57,雖然鬆弛較,K55,嚴重，但最終強度依然較高,16,405060708090100100100010000K55,銅合金,for,連接器運用,各式材料特性的重要性,導電率,/,熱傳導係數,Electrical/thermal,conductivity,折彎性,/Bendability,楊氏係數,/Youngs Modulus,抗應力鬆弛,/,Stress relaxation,resistance,降服強度,/Yield strength,通訊,&,電腦,17,銅合金 for 連接器運用導電率/熱傳導係數折彎性/Bend,CuBe2,C172,CuTi3,C199,200,300,400,500,600,700,800,900,1.000,Electrical conductivity(MS/m),Electrical conductivity(%IACS),Yield strength R,p0,2,(MPa),0,10,20,30,40,50,10,20,30,40,50,60,70,80,90,100,0,1.100,1.200,CuBe,C17410,Bending 90,r=0,5 x s,Good way,max.strip thickness,0,35 mm,電腦,&,消費性連接器,K75,/C18070,K88/,C18080,K55,C7025,B18,C5210,K57,C70350,B18,Supralloy,YCuT-FX,18,CuBe2 C172CuTi3 C1992003004005,鈦銅,-YCuT-FX,*需要高壽命及高接觸力之開闢,switch,和連接器,(Battery,socket,min USB,等,),19,鈦銅-YCuT-FX*需要高壽命及高接觸力之開闢switc,YCuT-FX,Bendability:w/t,比 與,r/t,比,20,YCuT-FX Bendability:w/t 比 與 r,Tensile strength R,m,MPa,62,0,76,0,65,0,78,0,69,0,80,0,608-725,Yield strength R,p0,2,MPa,min.,50,0,min.,585,min.,655 550-650,Elongation A,50,%min.,10,min.,7,min.,5,min.,6,HV (,1,8,0,-,22,0,)(,20,0,-,24,0,)(,22,0,26,0,),(,180,220,),El.conductivity%IACS,43.1,43.1,43.1,43.1,R,620,R,65,0,R,690 TR02,Min.Bend Radius 90,Good way,0,1,1.5 1,Bad way,0,1,1.5,3,Temper,Wieland,K,55,高性能铜合金,*需要高接觸力,低阻抗及在高溫環境下有較佳之抗應力鬆弛,可運用在連接器,(phone Jack,、,LVDS,、,I/O conn,、,等,),，,也適合應用在汽車端子及,IC,導線架材料上。,21,Tensile strength RmMPa 620,Wieland K57,高性能铜合金,Tensile strength R,m,MPa770-900 840-970,Yield strength R,p0,2,MPa 750-850 810-920,Elongation A,50,%4 1,HV (220-280)(240-300),El.conductivity%IACS 50 45,TM04 TM06,Min.Bend Radius 90,10 mm sample width,Good Way(0,35/0.15mm)2.0/1.5 2.5/2.0,Bad Way (0.35/0,15 mm)2.0/1.5 2.5/2.0,Temper,*需要高接觸力,低阻抗及在高溫環境下有較佳之抗應力鬆弛,可運用在連接器,(phone Jack,、,LVDS,、,I/O conn,、,等,),，,也適合應用在汽車端子及,IC,導線架材料上。,22,Wieland K57高性能铜合金 Tensile stre,200,300,400,500,600,700,800,900,1.000,Rel.bend radius r/t,Yield Strength R,p0,2,(MPa),0,1,2,3,4,5,1.100,1.200,max.strip thickness 0.5 mm,K57-C70350,C17410,C17460,K55-C70250,bad way,good way,Temper 1,Temper 2,Temper 1,Temper 2,Temper 1,Temper 2,Temper 1,Temper 2,Temper 2,K57,與,CuBe,的折彎表現,最小折彎半徑,&,降伏強度,Expected values,23,2003004005006007008009001.000R,0,0,5,1,1,5,2,2,5,3,0,20,40,60,80,w/t,r/t,good way,bad way,bad way“,w,good way“,w,Data sheet values,K57 Bendability:w/t,比 與,r/t,比,Results for 90 Bends,Temper TM 04,Expected values,24,00,511,522,53020406080w/tr/,0,0,5,1,1,5,2,2,5,3,0,20,40,60,80,w/t,r/t,bad way“,w,good way“,w,Data sheet values,good way,bad way,K57 B
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