英文版芯片封装 (2)

Cliquez pour modifier le style du titre du masque,Cliquez pour modifier les styles du texte du masque,Deuxime niveau,Troisime niveau,Quatrime niveau,Cinquime niveau,*,Cliquez pour modifier le style du titre du masque,Cliquez pour modifier les styles du texte du masque,Deuxime niveau,Troisime niveau,Quatrime niveau,Cinquime niveau,*,IC PACKAGING,PREPARED BY:SS SENG/24FEB2004,1,IC PACKAGING,PREPARED BY:SS SENG/24FEB2004,2,SEMICONDUCTOR MFG(BACK-END/PACKAGING),SMT PLASTIC PACKAGE:,WAFER SAW/DICING,DIE ATTACH/MOUNT,WIRE BONDING,MOLDING/ENCAPSULATION,CROPPING/TRIM&FORM,SOLDER DIPPING,TESTING,PACKING&SHIPPING,PREPARED BY:SS SENG/24FEB2004,3,SEMICONDUCTOR MFG(BACK-END/PACKAGING),BGA:,WAFER SAW/DICING,DIE ATTACH/MOUNT,WIRE BONDING,MOLDING/ENCAPSULATION,SAWING,SOLDER BALL ATTACH,TESTING,PACKING&SHIPPING,PREPARED BY:SS SENG/24FEB2004,4,WAFER SAW/DICING,PREPARED BY:SS SENG/24FEB2004,5,WAFER SAW/DICING,PREPARED BY:SS SENG/24FEB2004,6,WAFER SAW/DICING,Singulation of,individual die:,Mounting tape&frame,Saw blades,Washing,Tape Curing,PREPARED BY:SS SENG/24FEB2004,7,DIE ATTACH/MOUNT,PREPARED BY:SS SENG/24FEB2004,8,DIE ATTACH/MOUNT,Attach die to,leadframe/substrate:,Epoxy glue dispensing unto leadframe,Die attach,Epoxy glue curing,PREPARED BY:SS SENG/24FEB2004,9,WIRE BONDING,PREPARED BY:SS SENG/24FEB2004,10,WIRE BONDING,Connect die to external,leads:,Wires Au/Cu/Al,Thermo sonic bonding,1,st,Bond Ball bond,2,nd,Bond Stitch bond,PREPARED BY:SS SENG/24FEB2004,11,MOLD/ENCAPSULATION,PREPARED BY:SS SENG/24FEB2004,12,MOLD/ENCAPSULATION,Protect internal circuit,from external,environment:,Transfer molding,Mold curing,PREPARED BY:SS SENG/24FEB2004,13,CROPPING/TRIM&FORM,PREPARED BY:SS SENG/24FEB2004,14,CROPPING/TRIM&FORM/MARKING,Singulation of individual,IC unit(end product):,Cut dambars and unwanted leadframe,Form leads per specification,Marking:,Laser marking,Print,PREPARED BY:SS SENG/24FEB2004,15,SOLDER DIPPING,PREPARED BY:SS SENG/24FEB2004,16,SOLDER DIPPING,Lead finishing with,coated solder:,Flux,Solder dip,PREPARED BY:SS SENG/24FEB2004,17,TESTING,PREPARED BY:SS SENG/24FEB2004,18,TESTING,100%testing of all,units:,Continuity failure,Functional failure,Parametric failure,PREPARED BY:SS SENG/24FEB2004,19,PACKING&SHIPPING,Packing&shipping of,parts to customers:,Reels,trays,tubes,Dry-pack,Labellings,PREPARED BY:SS SENG/24FEB2004,20,PACKING&SHIPPING,New Traceability Code:,PPYWWLLL,(June Dec 2003),PP=Traceability production area code,Y=Year,WW=Work Week,LLL=Alphanumeric characters,PREPARED BY:SS SENG/24FEB2004,HT =Korean subcon A,=Year 2004,WW =WW08,21,