Weekly-Report-FE-PE-DB-ZT-W1350解析

Changing Industry Landscape,*,Second level,Third level,Fourth level,Fifth level,FE PE,Weekly Report_W50,Zhongtao Jiang,Dec.17th.2023,Content:,High/Low Light,KPI(Deploy from AOD),Yield and defect distribution,Abnormal case,Improvement action implement progress,Project,4.Abnormal Case,*PHI,SO16 die chipping:,2023/12/06,三光后QA Gate觉察PHI SO16 ASSL2101TN106，LotIDPHI348M2C2.008 Die crack，位置固定。追溯前后批次觉察同样特别，,DB特别机台：A2600-0012,Background:,PHI SO16 die chipping:,切机后启始批,DB在制品,停机确认,有crack不良,Impact Lot confirm,Impact QTY：160465,100%sorting PHI348M2B8.005，sample size：1200.不良数量：210ea,不良比率为：210/1200=17.5%预期,其他影响批正在100%全检,Root Cause Analysis,Fish Bone analyze,Machine,Man,Material,Method,固定点die crack,Machine bad condition,Handling issue,Incoming wafer issues G/S),检查未上DB机台wafer，无crack特别觉察,DB机台作业的在制品材料确认：觉察有crack觉察，失效模式与QA觉察全都,依据以上确认不良为DB机台产生,3.1 Machine confirm,Bond step flow,Wafer put in,Die place,Die pick up,高倍下检查,Each step check,Check result,无crack损伤,三点一线确认,无特别觉察,Bond head,与轨道平坦度确认,平坦20um),Wafer膜的扩张,Wafer膜的扩张松为4mm,依据不良现象分析，不良发生于pick up阶段，需模拟确认,pickup camera,Ejector,Bondhead,Center line,3.2 特别模拟simulate,Normal condition,Center line shift,Simulate condition,模拟三点不在一线上状态，其模拟的失效模式与QA觉察全都,Normal,Abnormal,顶针座已经变形,3.3 进一步确认顶针座,*经确认顶针座已经变形,由于顶针座变形，顶针向上后，机台三点一线发生变化顶针倾斜，不在同一线上，die pick up芯片有倾斜，芯片与芯片间发生碰撞，导致die chipping,Conclusion,：,4 Corrective Action,4.1 ME sorting当前机台顶针座变外形况,-Due date 2023-12-10,4.2 PE DBS 宣导ME切机前检查tooling，确保使用的是完好的tooling，,包括顶针座，顶针，吸嘴等,-Due date 2023-12-10,5.Improvement action implement progress,*Tooling control,:,Tooling control:,Current Status:,1.型号标签,2.寿命使用label,3.更换记录表,Tooling/label/change sheet，已经就位,Next to do:,Trial run,Thank You,