wire-bonding--介绍

单击此处编辑母版标题样式,单击此处编辑母版文本样式,第二级,第三级,第四级,第五级,*,WIRE BOND PROCESS INTRODUCTION,CONTENTS,ASSEMBLY FLOW OF PLASTIC IC,Wire Bond,原理,M/C Introduction,Wire Bond Process,Material,SPEC,Calculator,DEFECT,封裝簡介,晶片,Die,金線,Gold Wire,導線架,Lead,fram,Wafer Grinding,Die Bonding,Wafer Saw,toaster,Wire Bonding,Die Surface Coating,Molding,Laser Mark,Solder Ball,Placement,Singulation,Packing,封裝流程,Dejunk,TRIM,Solder,Plating,Solder,Plating,Dejunk,TRIM,TRIM/,FORMING,BGA,SURFACE,MOUNTPKG,THROUGH,HOLE PKG,Wire Bond,原理,pad,lead,Gold wire,Ball Bond,( 1st Bond ),Wedge Bond,( 2nd Bond ),GLASS,CONTAMINATION,VIBRATION,SiO2,Si,GOLD BALL,PRESSURE,MOISTURE,AL2O3,Al,B.PRINCIPLE,銲接條件,HARD WELDING,Pressure (Force),Amplify &,Frequecy,Welding Time (Bond Time),Welding,Tempature,(Heater),THERMAL BONING,Thermal,Compressure,Ultrasonic Energy (Power),Bond Head ASSY,Low impact force,Real time Bonding Force monitoring,High resolution z-axis position with 2.5 micron per step resolution,Fast contact detection,Suppressed Force vibration,Fast Force response,Fast response voice coil wire clamp,X Y Table,Linear 3 phase AC Servo motor,High power AC Current Amplifier,DSP based control platform,High X-Y positioning accuracy of +/- 1 mm,Resolution of 0.2 mm,W/H ASSY,changeover, Fully programmable indexer & tracks, Motorized window clamp with soft close feature, Output indexer with,leadframe,jam protection feature,Tool less conversion window clamps and top plate enables fast device,Eagle,Bonding System,Bonding Method,Thermosonic,(TS),BQM Mode,Constant Current, Voltage, Power and Normal,(Programmable),Loop Type,Normal, Low, Square & J,XY Resolution,0.2 um,Z Resolution (capillary,travelling,motion),2.5 um,Fine Pitch Capability,35 mm pitch 0.6 mil wire,No. of Bonding Wires,up to 1000,Program Storage,1000 programs on Hard Disk,Multimode Transducer System,Programmable profile, control and vibration modes,MACHINE SPECIFICATIONS (I),Eagle,Vision System,Pattern Recognition Time,70 ms / point,Pattern Recognition Accuracy,+ 0.37 um,Lead Locator Detection,12 ms / lead,(3 leads/frame),Lead Locator Accuracy,+ 2.4 um,Post Bond Inspection,First Bond, Second Bond,Wire Tracing,Max. Die Level Different,400 500 um,Facilities,Voltage 110 VAC (optional 100/120/200/210/,220/230/240 VAC,MACHINE SPECIFICATIONS (II),Eagle,Material Handling System,Indexing Speed,200 250 ms 0.5 “ pitch,Indexer Resolution,1um,Leadframe,Position Accuracy,+ 2 mil,Applicable,Leadframe,W = 17 75 mm bonding area in Y = 65mm,= 17 90 mm bonding area in Y = 54mm,L = 280 mm Maximum,T = 0.075 0.8 mm,Applicable Magazine,W = 100 mm (Maximum),L = 140 300 mm,H = 180 mm (Maximum),Magazine Pitch,2.4 10 mm (0.09” 0.39 “),Device Changeover, 4 minutes,Package Changeover,100 0,4,90/1004,8,11,9011,15,IC type loop type,Gold Wire,Gold Wire Manufacturer,(,Nippon , SUMTOMO , TANAKA.,),Gold Wire Data,( Wire Diameter , Type , ),SPEC,Pad Open & Bond Pad Pitch,Ball Size,Ball Thickness,Loop height,Wire Pull,Ball short,Crater Test,BPO&BPP,單位:,um or Mil,BPO :,是指,Pad,內層,X,方向及,Y,方向的,size,一般是取最小值為 我們的,data,BPO :,是指,Pad,如左邊內層至右邊,Pad,左邊外層邊緣其它依此類推,;,或著一個,Die,上出現不同,Pad,大小那就是以兩個,Pad,中心距離為,BPP,但是一般我們要取一個,Die,上最小的,BPP,Bond Pad Pitch,Bond Pad Open,Bond Pad Open,Ball Size,Ball Thickness,Ball Size & Ball Thickness,單位:,um，Mil,量測倍率: 50,X,Ball Thickness,計算公式,60,um BPP 1/2 WD=50%,60 um BPP 1/2 WD=40%50%,Ball Size,Loop,Heigh,單位:,um，Mil,量測倍率: 20,X,Loop Height,線長,Wire Pull,1 Lifted Bond (Rejected),2 Break at neck (Refer wire-pull spec),3 Break at wire ( Refer wire-pull spec),4 Break at stitch (Refer stitch-pull spec),5 Lifted weld (Rejected),Ball Short,單位:,gram or,g/mil,Ball Shear,計算公式,Intermetallic（IMC,）,有75%的共晶,SHEAR STRENGTH,標準為6.0,g/mil,。,SHEAR STRENGTH,Ball Shear/Area (g/mil,),Ball Shear = x; Ball Size = y; Area = (y/2),x/(y/2),= z g/mil,C,Ball bond,Test specimen,Specimen clamp,Shearing ram,Wire,Bond shoulder,Interfacial contactball bond weld area,Bonding pad,h,(A),Unsheared,C,L,C,Ball bond,C,L,Test specimen,Specimen clamp,Bonding pad,Full ball attached towire-except for regionsof,intermetallic,voiding,Ball separated at bonding pad-Ball interface-residual,intermetallic,(and sometimes portion of unalloyedball and metal) on pad in bondinteraction area,(D) Ball bond-bonding pad interface separation (typical Au to Al),C,Test specimen,Specimen clamp,Shearing ram,Wire,Minor fragment of ballattached to wire,Bonding pad,C,L,Ball sheared too high(off line, etc.)only aportion of shoulder andball top removed,Interfacial contact,ball bond weld area,(B) Wire (ball top and/or side) shear,C,Ball bond,C,L,Test specimen,Specimen clamp,Shearing ram,Bonding pad,Major portion,of ball attached to wire,Interfacial contact-ball bond weld areaintact,(C) Below center line shear, ball sheared through (typically Au to Au),C,Ball bond,C,L,Test specimen,Specimen clamp,Bonding pad,Pad metallizationseparates fromunderlying surface,Residual pad on ballball-pad interfaceremains intact,(E) Bond pad lifts,Test specimen,Specimen clamp,C,Ball bond,C,L,Bonding pad,Bonding pad lifts,taking portion of underlyingsubstrate material with it,(F),Cratering,Residual pad and substrate attachedto ball,ball-pad interface remainsintact,Shear Failure Modes,Crater Test,Calculate (I),UP Time =,(Total Actual Production Times Total Repair Time ),Total Actual Production Time,DOWN TIME RATE=,Total Repair Time,Total Actual Production Times,Total Operator Actual Repair Time,Total Operator Repair Frequency Stoppages,Total Actual Production Times Total Operator Repair Time,Total Operator Repair Frequency Stoppages,Total Technical Actual Repair Times,Total Technical Repair Frequency Stoppages,MTTS (MEAN TIME TO STOP ),=,MTBS (MEAN TIME BETWEEN STOP),=,MTTA (MEAN TIME TO ASSISTANCE ),=,Calculate (II),MTBA (Mean Time Between Assistance) =,Total Actual Production Times Total,Technican,Repair Times,Total Technical Repair Frequency Stoppages,MTBF(Mean Time Between Failure)=,Total Actual Production Times Total Technician Repair Time,Total Change Parts Repair Frequency Stoppage,規格寬度,製程寬度,規格上限,-,規格下限,6,(,公差,),(,上限,or,下限,) -,平均值,三個公差,CP (,製程能力指標,) =,CPK =,=,Quality,正常品,Material Problem,1st Bond issue,(,Peeling , Ball Lift , Off Center),2nd Bond issue,(,滑針，縫點脫，,short tail ),Looping Fail,(wire snake wire，sweep wire,loop base bent ),正常品,Material Problem,With Ball,Wire,Pad Size,Missing Ball,Wire Broken,Bonding Ball Inspection,Ball Detection,Ball Size,Pad Center,Ball Center,Ball Placement (X,Y),Ball Off Pad,Bonding Ball Inspection,(cont.),Ball Measurement,Peeling,1,st,Bond Fail ( I ),Ball Lift,1,st,Bond Fail (II),Ball Lift,Neck Crack,1,st,Bond Fail ( III ),Off Center,1,st,Bond Fail (IV),Off Center Ball,1,st,Bond Fail (V),Smash Ball,Smash Ball,With Weld,Wire,Capillary Mark,Missing Weld,Wire Broken,Lead,Bonding Weld Inspection,Weld Detection,2,nd,Bond Fail ( I ),滑針,2,nd,Bond Fail ( II ),縫點脫落,縫點脫落,Looping Fail(Wire Short,I,),Wire Sweep,Wire Short,Looping Fail(Wire Short II),Loop Base Bend,Wire Short,Looping Fail(Wire Short III),Excessive Loop,Wire Short,THE END,