pcb印刷电路板制程介绍

PCB Engineering Report Sheet,*,印刷电路板制程介绍,Flow Chart of PCB Process,1,2,3,4,8,7,6,5,12,11,10,9,IQC,TRIM,DRILL,BLACK HOLE,DRY FILM LAMINATING,18,19,20,14,15,10,17,23,22,21,27,26,25,24,EXPOSURE,13,DEVELOPMENT,PATTERN PLATING,ETCHING,INSPECTING,S/M SURFACE CLEAN,1,ST LIQULD SCREENPRINT,PRE-CURE,2,ST LIQULD SCREENPRINT,PRE-CURE,S/M EXPOSURE,S/M DEVELOPMENT,POST-CURE,LEGEND PRINT,CURE,HAL/ENIG G/F,PUNCH/NC-R,V-CUT,FINAL CLEAN,CURE,O/S TEST/OSP,HOLE COUNT,28,29,30,31,32,FQC,OQC,PACKING,WARHHOUSH,OUTGOING,SYMBOL,:QUANTITY INSPECTION,:QULITY INSPECTION,:STORAGE,:WORKING,:100%INSPECTION,(1),前 制 程 治 工 具 制 作 流 程,顾 客,CUSTOMER,裁 板,LAMINATE SHEAR,业 务,SALES DEP.,生 产 管 理,P&M CONTROL,MASTER A/W,底 片,DISK,M/T,磁 片磁 带,蓝 图,DRAWING,数据传送,MODEM,FTP,网版制作,STENCIL,DRAWING,图 面,RUN CARD,制作规 范,PROGRAM,程 式 带,钻孔,成型机,D.N.C.,工 程 制 前,FRONT-END DEP.,工作底片,WORKING A/W,(2),多 层 板 内 层 制 作 流 程,曝 光,EXPOSURE,压 膜,LAMINATION,前 处 理,PRELIMINARY,TREATMENT,去 膜,STRIPPING,蚀 铜,ETCHING,显 影,DEVELOPING,黑化处理,BLACK OXIDE,烘 烤,BAKING,LAY-UP,及预迭板迭板,后 处 理,POST TREATMENT,压 合,LAMINATION,内层干膜,INNERLAYER IMAGE,预迭板及迭板,LAY-UP,蚀 铜,I/L ETCHING,钻 孔,DRILLING,压 合,LAMINATION,多层板内层流程,INNER LAYER PRODUCT,MLB,AO I,检 查,AOI INSPECTION,裁 板,LAMINATE SHEAR,DOUBLE,SIDE,雷 射 钻 孔,LASER ABLATION,Blinded Via,(3),外 层 制 作 流 程,通 孔电镀,P.T.H.,钻 孔,DRILLING,外 层 干 膜,OUTERLAYER IMAGE,二次铜及锡铅电镀,PATTERN PLATING,检 查,INSPECTION,前 处 理,PRELIMINARY,TREATMENT,二次铜电镀,PATTERN PLATING,蚀 铜,ETCHING,全板电镀,PANEL PLATING,外 层 制 作,OUTER-LAYER,O/L ETCHING,蚀 铜,TENTING,PROCESS,DESMER,除胶 渣,E-LESS CU,通孔电镀,前 处 理,PRELIMINARY,TREATMENT,剥 锡 铅,T/L STRIPPING,去 膜,STRIPPING,压 膜,LAMINATION,锡铅电镀,T/L PLATING,曝 光,EXPOSURE,液态防焊,LIQUID S/M,外观检 查,VISUAL INSPECTION,成 型,FINAL SHAPING,检 查,INSPECTION,电 测,ELECTRICAL TEST,出货前检查,O Q C,包 装 出 货,PACKING&SHIPPING,涂布印刷,S/M COATING,前 处 理,PRELIMINARY,TREATMENT,曝 光,EXPOSURE,DEVELOPING,显 影,POST CURE,后 烘 烤,预 干 燥,PRE-CURE,喷 锡,HOT AIR LEVELING,铜面防氧化处理,O S P(Entek Cu 106A),HOT AIR LEVELING,G/F PLATING,镀金手指,镀化学镍金,E-less Ni/Au,印 文 字,SCREEN LEGEND,选择性镀镍镀金,SELECTIVE GOLD,全面镀镍金,GOLD PLATING,(4),外 观 及 成 型 制 作 流 程,典型多层板制作流程,1.,内层,THIN CORE,2.,内层线路制作,(,压膜,),典型多层板制作流程,4.,内层线路制作,(,显影,),3.,内层线路制作,(,曝光,),典型多层板制作流程,5.,内层线路制作,(,蚀刻,),6.,内层线路制作,(,去膜,),典型多层板制作流程,7.,迭板,8.,压合,LAYER 2,LAYER 3,LAYER 4,LAYER 5,LAYER 1,LAYER 6,典型多层板制作流程,9.,钻孔,10.黑孔,典型多层板制作流程,11.,外层线路压膜,12.,外层线路曝光,典型多层板制作流程,13.,外层线路制作,(,显影,),14.,镀二次铜及锡铅,典型多层板制作流程,15.,去干膜,16.,蚀铜,(,碱性蚀刻液,),典型多层板制作流程,17.,剥锡铅,18.,防焊,(,绿漆,),制作,典型多层板制作流程,15.,浸金,(,喷锡,),制作,干 膜 制 作 流 程,基 板,壓 膜,壓膜後,曝 光,顯 影,蝕 銅,去 膜,典型之多层板迭板及压合结构,.,.,.,COPPER FOIL 0.5 OZ,Thin Core,FR-4,prepreg,COMP,S0LD.,prepreg,Thin Core,FR-4,prepreg,COPPER FOIL 0.5 OZ,迭合用之钢板,迭合用之钢板,10-12,层迭合,压合机之热板,压合机之热板,COPPER FOIL 0.5 OZ,Thin Core,FR-4,prepreg,COMP,S0LD.,prepreg,Thin Core,FR-4,prepreg,COPPER FOIL 0.5 OZ,迭合用之钢板,迭合用之钢板,1.,下料裁板,(Panel Size),COPPER FOIL,Epoxy Glass,Photo Resist,2.,内层板压干膜,(,光阻剂,),3.,曝光,4.,曝光后,Artwork,(,底片),Artwork,(,底片),Photo Resist,光源,5.,内层板显影,Photo Resist,6.,酸性蚀刻,(Power/Ground,或,Signal),Photo Resist,8.,黑化,(Oxide Coating),7.,去干膜,(Strip Resist),9.,迭板,Layer 1,Layer 2,Layer 3,Layer 4,Copper Foil,Copper Foil,Inner Layer,Prepreg(,胶片,),Prepreg(,胶片,),10.,压合,(Lamination),11.,钻孔,(P.T.H.,或盲孔,Via)(Drill&Deburr),墊木板,鋁板,12.,镀通孔附着碳粉,13.,外层压膜,(,干膜,Tenting),Photo Resist,14.,外层曝光,(pattern plating),15.,曝光后,(pattern plating),16.,外层显影,17.,线路镀铜及锡铅,18.去 膜,19.,蚀 铜,(,碱性蚀刻,),20.,剥锡铅,21.,喷涂,(,液状绿漆,),22.,23.,绿漆显影,光源,S/M A/W,24.印文字,25.,喷锡,(,浸金,),R105,WWEI,94V-0,R105,WWEI,94V-0,光分解反应,(,正性工作,),底片,STENCIL(,网版,),光聚合反应,(,负性工作,),底片,STENCIL(,网版,),BURIED VIA LAY-UP,A=THROUGH VIA HOLE(,导通孔,),B=BURIED VIA HOLE(,埋孔),C=BLIND VIA HOLE(,盲孔,),D=BLIND HOLE MLB VIA(多层盲孔),BLIND VIA LAY-UP,BLIND VIA SEQUENTIAL LAY-UP,A,B,B,A,C,C,A,RESIN,B-STAGE,BLIND AND BURIED VIA OPTION(盲 埋 孔 之 选 择),D,6,Spindle Drilling Machine,Black Hole Line,Desmear,Dry Film Laminator,Automatic Exposure Machine,Pattern Plating Line,Etching Line,Automatic S/M Printing Line,Automatic Exposure Machine,Post Cure Line,Automatic Legend Printing Line,Solder Leveling Machine,O/S Tester,The End,