Vacuum&机台专用名词

按一下以編輯母片標題樣式,按一下以編輯母片,第二層,第三層,第四層,第五層,*,真空概念,&,机台专有名词导读,李海波,Air knife,：长片状出气孔的喷,气除屑装置,Ashing,：光阻去除,Angstrom,：,Alignment,：对准,ADI,：显影后检查,EDI,：蚀刻后检查,a-,Si,：非晶硅,Actone,：丙酮,Air shower,：空气洗尘室,Assembly,：晶粒封装,Acceleration electrodes,加速电极,Aging,老化,Alloy,合金,Alumina,铝土,Aluminum Flow,热流铝,Aluminum Plug,铝插塞,Amorphous Silicon,非晶硅,Anneal,回火,Argon,氩气,Argon instability,氩气抽气不稳定性,Array,阵列,PVD Group,A,0,Backing Pump,辅抽泵,Barrier layer,阻障层,Base Pressure,基准压力,Binder,粘合剂,Buffer Agent,缓冲剂,Barrier layer,：阻障层,Brass,：黄铜管，用来提供设备的真空度，,CDA,，厂务氮气的非制程直接使用气体的传输,BDG,：保持剂，溶解,PR,防止,PR,再附着，因强碱性的,MEA,有机溶剂较难将剥离的,PR,溶解，因此需加入保持剂,Breakdown voltage,：崩溃电压,B.O.E.,：缓冲蚀刻液,Burn In,：预烧试验,BIN,：针测结果类别,Backstreaming,回流，逆流,PVD Group,PVD Group,Capacitance manometer,电容式测压计,Cryo,pump,冷冻邦浦,Check Valve,整流阀，防止气体在管路中回流,Chemical Vapor Deposition,：,CVD,，化学气相沉积,Clean Room,洁净室,Coating,涂布,Combustible Gas,易爆性气体,Compressor,压缩机,Contact Plug,接触窗插塞,Cryogenic Pump,低温泵,Cryosorption,低温吸附,CA,：,Cathode,阴极,Cathode dark space,阴极暗区,CDA,：,compressed dry air,压缩的干燥空气,CD bias,：,circuit dimension,蚀刻完后线宽,Cross Section,：横界面,Contact,：接触窗,Concentration,：浓度,CMOS,：互补式金属氧化半导体,CD measure,：微距测量,Control Limit,：管制界限,CP,：电路针测,Cycle time,：生产周期时间,Central Monitor,：设备中央监控系统,Condensation,冷凝,crane:,天车,PVD Group,DC Magnetron Sputter,磁控,DC,溅镀机,Developer,显影液,Development,显影,Dry Etcher,干蚀刻机,Wet Etcher,湿蚀刻机,Dummy Load,：替代原设备的等效阻抗,DIW,：去离子水，纯水，阻抗达,16M ohm,Desum,：电浆预处理,Defect density,：缺点密度,Down,：设备故障,DIPC,：站点周期时间,Discharge valve,：排气阀,Displacer,：置换器,Direction detection sensor,方向检测感应器,Exposure,曝光,Ellipsometer,椭圆测量仪（,T,n),Epitaxy,：磊晶,Exhaust,：抽气装置,Electromigrate,：电致迁移，因高电场流通下造成金属原子沿材质本身边界向电子流方向移动造成断路。,Electromigration,resistance,：抗电移能力,ESD,：静电放电,EDC,：工程资料分析系统,Effective pumping speed,有效抽气速率,ELB Electric Breaker,EMO Emergency Mechanical Off Switch,PVD Group,Fab,晶圆厂,FTIR:Fourier,Transform,红外线光谱仪，测量键结强度,Facility Down,：公用系统故障,Facility,：公用系统,FT,：封装后测试,Future Hold,：预先扣留,FA,：工厂自动化系统,Forepump,前级邦浦,Freeze drying,冷冻干燥,Filament,灯丝,PVD Group,Gate valve,：闸阀,Gowning Room,：更衣室,Gas flow,气流,Gauge,真空计,PVD Group,Hook Up,：,hardware,连结，,gas&cable,tray,组立,Homogeneous nucleation,：均匀成核,Heterogeneous nucleation,：非均匀成核,Hot,alumium,：热铝制程，在高于,400,o,C,以上利用沉积铝在高温下所具备的较佳的表面迁移的特性，使溅镀铝对晶片表面几何结构的阶梯覆盖能力提升的多重金属化制程方式。,HF,：氢氟酸,HEPA,：高效过滤器,Hot,：急件,Halogen lamp,卤素灯,High vacuum,高真空,Hot cathode,热阴极,PVD Group,Inter lock,：连锁装置,ITO,：透光导电膜,InO,90%+SnO 10%,烧结而成的靶材电极,Idle,：闲置,Interbay,：工程间搬运系统,Intrabay,：工程内搬运系统,Ionization,电离,Isolation valve,隔离阀,Ion voltage,离子加速电压,Ion source,离子源,Ion,desorption,离子逸出,Ion detector,离子侦测器,Indium,铟,PVD Group,LD,：,loading,Lend,：借机,Lot ID.,：料号,Liquid nitrogen,液态氮,PVD Group,Mercury Probe,水银测量仪，测临界电压,Mos,：,Metal-Oxide-Semiconductor,，金属氧化半导体,Metallization,：金属化制程,Multilevel interconnects,：多重金属内连线，因在晶座上制造两层以上的金属层而所需的导通方式,Multilevel metallization process,：多层金属化制程,MTBF:mean,time between failure,，平均故障周期时间,MTTR:mean,time to repair,，平均每次修复时间,MFC,：,mass flow controller,，质流控制器,MEA,：剥离剂，剥除,PR,防止,PR,再附着,Monitor,：例行测试,Merge,：分批,Medium vacuum,中度真空,Mechanical booster pump,机械邦浦,PVD Group,Operation movement,：站点转移量,O-ring O-,型环,PVD Group,Passivation,：保护层,Physical Vapor Deposition,：,PVD,，物理气相沉积,Photolithography,：微影制程,Poly silicon,：多晶硅，由多种不同结晶方向的单晶硅晶粒所组成的纯硅物质,Post bake,：烘烤的预烤,Peeling rate,：剥离速率,Positive,：正片,Priming,：涂底,Pilot,：试作,Polymer,聚合物,Pumping speed,抽气速率,Pre-exposure bake,：曝光前的预烤,Pilo,valve,：专门控制气体是否输入气动阀的开关,Process gas,：制程气体,Pressure relief valve,：舒压阀，用于调节管件内压力,PVC,：塑胶管,PR,：,photo resist,光阻,PH3,：氢化磷,Pass Room,：空气缓冲室,Power Zone,：设备维修间,Priority,：派工级数,PVD Group,Reliability,：可靠性,Rush,：快件,Route,：生产涂程,Rework,：重工,Release,：解除,Recycle,：内部回收,Recipe,：制程分发,Radiation,辐射,Regeneration,再生,Rough vacuum,粗略真空,PVD Group,Sputtering deposition,：溅镀,Spike,：尖峰，因硅对铝有一定的固态溶解度而造成的,Suspector,：晶座,SiH,4,：,silane,Spin dry,：水洗之后，旋转烘干的机台或是动作,Stainless steel,：不锈钢管，用在与制程相关的制程气体传输上,Stripper,：剥离剂,Solvent,：溶剂,Sensitivity:,灵敏度,Supporting,Room,：生产支援室,SPEC.Limit,：规格界限,SPC,：,statistic process control,统计制程管制,SWR,：特殊工程需求,STB,：投片,Scrap,：报废,Stage movement,：阶段转移量,Split,：分批,Scheduling,：生产排程系统,Stocker,：保管库,PVD Group,Teflon,管：替代不锈钢不便使用的制程液氮气体传输场合,TLV,：,Threshold limit value,，启时限值,silane,只需,1.5ppm,则能爆炸,Trouble shooting,：故障排除,Turn Ratio,：周转率,Tour corridor,：无尘室安全走道,Throughout,：产速,TECN,：短期工程变更通知,TAT,：累计生产时间,Thermal conductivity gauge,热导真空计,Throughput,抽气量，排气量，气流通量,PVD Group,UPW,：超纯水，阻抗达,18M ohm,Uniformity,：（,max-min)/(,max+min,),Utilization,：动用率,Up-time,：可供利用的时间,Ultrahigh vacuum,超高真空,PVD Group,Vacuum,真空,Vacuum stage,真空级,Vacuum system,真空系统,Valve,阀门,roughing,粗抽阀,high vacuum,高真空阀,Vent,破真空,PVD Group,Waive,：规格外放行品,Wait,：待修,WIP,：在制品,WAT,：晶片接受测试,Window,：视窗,PVD Group,Yield,：良率,PVD Group,Vacuum Class,粗略真空（,rough vacuum,）,760torr1torr,中度真空,(medium vacuum),1torr10,-3,torr,高真空,(high vacuum),10,-3,torr10,-7,tor,超高真空,(ultra-high vacuum),10,-7,torr,以上,Parameter of Vacuum Pump,所能達到之最低的壓力,其大小有邦浦本身氣體逆流的大小或所用抽气媒體的,蒸汽壓大小來決定。,有效之工作壓力範圍,指在此壓力範圍内，邦浦有足夠的抽气速率。,抽气速率大小,邦浦的抽气速率隨壓力而改變，並非定值。,排氣口壓力,主要針對排氣式邦浦而言，排氣口壓力不為一大氣,壓的邦浦必須使用輔助邦浦（或前级邦浦）组合工,作以达到抽气目的,。,Function of Vacuum System,Exhaust,Rough Vacuum 10,torr,High Vacuum 10,torr,Vent,Slow Vent(