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USE THIS OCCASIONALLY FOR SECOND TITLE(CAPS ONLY),Use this level,First Bullet Level,Second Bullet Level,#,Profiler board&Profiling,Date:200,2,.,05.12,Rev.No.:01,Approved B,y,:,Prepared By:,X,iaoping.chen,1.Scope,:,:,范围:,This programappliesforTemperatureProfiling forallproduct in Flextronics Industrial,(,(zhuhai,),).,适合伟,创,创力实,业,业有限,公,公司所,有,有产品,温,温度曲,线,线的制,作,作.,Date:2002.05.12,Rev,.,.No.:01,2.Instrument:,仪器及,工,工具,high temperature glue paper,high temperature solder,DATAPAQ9000,thermocouple,Date:2002.05.12,Rev,.,.No.:01,3.Thermocouplepreparation,准备热,电,电偶线,3.1Only“K”type thermocouplewire be usedfor temperatureprofiling.,做温度,曲,曲线只,能,能使用,型,型热电,偶,偶线,Date:2002.05.12,Rev,.,.No.:01,3.Thermocouplepreparation,准备热,电,电偶线,3.2Ensurethermocouple wireisminimum15cm extensionfromboardedge.,确定热,电,电偶线,从,从板边,延,延长最,少,少15cm,Date:2002.05.12,Rev,.,.No.:01,15,cm,4.preparationofprofilingboard,准备温,度,度曲线,测,测试板,4.1Getreadythe board fortemperatureprofiling,selectthe,actualproductorapproximateproduct as thesampleboard,.,.,用生产,产,产品的,板,板或者,近,近似生,产,产产品,的,的板做,为,为温度,曲,曲线的,测试样,板,板,4.2Identifythelocations forsolderingthermocouple wires.,确定焊,接,接热电,偶,偶线的,位,位置,Date:2002.05.12,Rev,.,.No.:01,A)A minimumofthreepoints mustbemeasuredonaPCB,.,.The,threepointstobemeasuredare thelead,end andcenterof,theSMD component,.,.,一块板,上,上最少,有,有三个,测,测试点,，,，这三,个,个点分,别,别在板,面,面上前,，,，,后,后及中,间,间的,元,件,件,4.preparationofprofilingboard,准备温,度,度曲线,测,测试板,Date:2002.05.12,Rev,.,.No.:01,B)Theselection willbebasedonthe coldestand thehottest,locationonthePCB.,在,上选,择,择最冷,的,的及最,热,热的位,置,置,1)Thecoldestwill be themost massivecomponent andinthe,most denselyloaded area,最冷的,位,位置在,最,最大的,元,元件和,元,元件最,密,密集的,区,区域,2)Thehottestwill be thehighlyexposedorisolatedarea,最热的,位,位置在,非,非常曝,露,露或者,单,单独一,个,个的区,域,域,4.preparationofprofilingboard,准备温,度,度曲线,测,测试板,Date:2002.05.12,Rev,.,.No.:01,C)Selecttheheat sinklocation,选择吸,热,热多的,位,位置,D)Selectthe temperature sensitivity component,.,.,选择对,温,温度敏,感,感的元,件,件位置,E)Selectthe thermalshocklocation,选择有,热,热冲击,的,的位置,Note:Refertothe productprocessinstructionforthe,thermocouplelocationofthe respectiveproducts,.,.,注意：,参,参考各,自,自产品,的,的工艺,流,流程指,示,示确定,热,热电偶,线,线的位,置,置,4.preparationofprofilingboard,准备温,度,度曲线,测,测试板,Date:2002.05.12,Rev,.,.No.:01,4.3Addhightemperaturesoldertothe components termination,whichhadbeendesoldered.,在需要,焊,焊接的,元,元件端,子,子加高,温,温锡,4.4Thermocouplewirewill be linkedtothereservedlocation,.,.,热电偶,线,线连在,指,指定的,位,位置,4.preparationofprofilingboard,准备温,度,度曲线,测,测试板,Date:2002.05.12,Rev,.,.No.:01,4.5Upon solderingiscompleted,.,.ensurethefollowing is complied.,焊接后,，,，确认,是,是否遵,守,守下列,内,内容：,A)Noexcessivesolder cover up thethermocoupletermination.,没有过,多,多的锡,盖,盖在热,电,电偶线,的,的端子,上,上,B)Thethermocouple termination(spot welded)isfully,submergeinto thesolderwithoutanyexposure,.,.,热电偶,的,的端子,全,全部焊,在,在焊锡,中,中，没,有,有曝露,的,的,4.6Re-dosolderingifitdoesnotcomply withthe about requirements.,如果没,有,有达到,要,要求，,重,重新焊,接,接,4.preparationofprofilingboard,准备温,度,度曲线,测,测试板,Date:2002.05.12,Rev,.,.No.:01,5.Boardloading condition,板的传,送,送状况,5.1Flow theprofile board in theunloadedconditionduring the,initial andconcurrent stagesofprofiling,.,.thisistoattain an,acceptable profile,.,.,在起初,阶,阶段，,炉,炉内没,有,有加载,板,板的情,况,况下，,测,测试的,曲,曲线作,为一个,初,初步的,可,可接受,的,的曲线,Entry direction,进板方向,Date:2002.05.12,Rev,.,.No.:01,5.Boardloading condition,板的传,送,送状况,5.2Forthe final profile,flow theprofile board under aloaded,conditiontosimulateafullyproduction operatingcondition,.,.,Ensurethattherearetwo“productionboards,”,”in front of,theprofileboardandone behind,.,.,曲线确,定,定以后,，,，再做,曲,曲线时,以,以模拟,炉,炉内充,满,满,的状,态,态,在测试,板,板的前,面,面有两,个,个产品,板,板，在,它,它的后,面,面有一,块,块产品,板,板,Note:,“,“productionboards”caneither be boardsofsame,product typeorofsamedimension,.,.,注意：,产,产品板,既,既可以,是,是相同,的,的产品,或,或相近,似,似的产,品,品板,Date:2002.05.12,Rev,.,.No.:01,Entry direction,进板方向,Profile board,测试样板,Production board,产品板,5.Boardloading condition,板的传,送,送状况,Date:2002.05.12,Rev,.,.No.:01,6.Thermal profilerequirement,:,:,温度曲,线,线需要,表,表达的,内,内容,：,6.1Solderpastereflow forPCBA process,.,.,锡膏,焊,焊接工,艺,艺,Date:2002.05.12,Rev,.,.No.:01,6.Thermal profilerequirement,:,:,温度曲,线,线需要,表,表达的,内,内容,：,6.1,.,.1Thefollowing parameterhadtoconsideronthe temperature profile,.,.,在温度,曲,曲线上,必,必须考,虑,虑到下,列,列参数,：,：,6.1,.,.1.1Maximum Pre-heat Temp,.,.Rampfromambient to soak,temperature,从室温,到,到软化,保,保温区,的,的温度,的,的最大,的,的预热,温,温度和,斜,斜率,6.1,.,.1.2Soak temperature andtime,软化保,温,温区的,温,温度及,时,时间,6.1,.,.1.3Reflowtemperatureand time,回流的,温,温度及,时,时间,6.1,.,.1.4Peak temperature,最高温,度,度,Date:2002.05.12,Rev,.,.No.:01,6.Thermal profilerequirement,:,:,温度曲,线,线需要,表,表达的,内,内容,：,Peak temperature,Reflow,Soak,Cool,Preheat,Date:2002.05.12,Rev,.,.No.:01,6.Thermal profilerequirement,:,:,温度曲,线,线需要,表,表达的,内,内容,：,6.2Wave solderforPCBAprocess.,波峰,焊,焊工艺,Date:2002.05.12,Rev,.,.No.:01,6.Thermal profilerequirement,:,:,温度曲,线,线需要,表,表达的,内,内容,：,6.2,.,.1Thefollowing parameterhadtoconsideronthe,temperatureprofile,.,.,在温度,曲,曲线上,必,必须考,虑,虑到下,列,列参数,：,：,6.2,.,.1.1Pre,-,-heatTemp.andtime,预热温,度,度和时,间,间,6.2,.,.1.2Soldertemp.and time,焊锡温,度,度和时,间,间,Date:2002.05.12,Rev,.,.No.:01,6.Thermal pr
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