零件MSD标准

Click to enter slide title,Click to edit Master text styles,Second level,Third level,Fourth level,Fifth level,Celestica Asia,CONFIDENTIAL,Generic Introduction,Moisture Sensitive Device(MSD) Process Control,Purpose,空气中的水分會通過滲透進入一般性包裝材料,.,利用表面裝貼技術將,SMD,物料,焊接到,PCB,過程中,SMD,物料會接触到超過,200C,的高溫,.,高溫回流時,濕气迅速膨脹,材料配合不當以及材料表面降級會使,SMD,物料斷裂和分層,.,MSD,控制指對不同潮濕,等級的,MSD,物料的搬運,包裝,運輸和使用進行標準方法控制,以免物料受潮而高溫回,流導致优率及可靠性下降,.,Procedures,Sites are required to conform to the specifications of J-STD-033A,and be aware of,the information contained in J-STD-020C.(,CELESTICA,),The following procedures are described in this document and,represent the basic,processes that shall be maintained and,controlled for,MSDs,.,1.Receiving Inspection,2.Storage,Generic Introduction,3.,post Exposure to Factory Ambient,4.,Board Rework,5.Reuse of material,6.,Audit Requirements,Reference Doc of CELESTICA,J-STD-033A :,A joint standard developed by the JEDEC and IPC about handling, Packing,shipping and Use of Moisture/Reflow Sensitive Surface .,由,JEDEC,和,IPC,共同制定的有关潮湿敏感,SMD,物料的搬运,包装,运输和使用标准,J-STD-020 :,Moisture Sensitivity Classification for Non-hermetic Solid State Surface,Mount Devices .,非密封固态,SMD,装置的湿敏性分类.,Reference Doc of CDG,CELQ-029-PROC-510 Handling Procedure For Dry Packing Component,干燥包装物料的操作程序,CELQ-029-PROC-56 Procedure for ICs, PCBs and,PCBAs,Moisture Control and,Baking .,MSD,物料, PCB, PCBA,的,焗烤,和湿度控制的工序,Celestica Asia,Scope for MSD,IC, BGA handling, packing, shipping & use IC,搬運,包裝,運輸和使,用,J-STD-033A,Assembly processes: mass reflow, localized heating ( board rework) ,高溫回流,局部,加热(,PCBA,返工,),有關術語和定義,MSD: Moisture Sensitive Devices,潮濕敏感裝置,SMD: Surface Mount Device,表面裝貼裝置,(Active) Desiccant,干燥劑,HIC: Humidity Indicator Card,濕,度,指示卡,MBB: Moisture Barrier Bag,防潮袋,Floor Life,允許暴露時間,Shelf Life,保存期限,MSL: Moisture Sensitivity Level,潮濕敏感等級,RH: relative humidity,相對濕度,相對濕度是指在特定溫度下空氣中的水氣相對這個溫度下空氣所能包含的最大水氣量的比率,用百分比表示,.,Generic Introduction,Celestica Asia,Key,Requirements,Receiving Inspection,Purpose,Components shall be received in a controlled environment for,Temperature and Humidity,with proper identification.,Procedure,Components must be received in the following manner:,1. Dry packed SMD packages should be inspected for a bag,seal date located on the caution or bar code label,.,2.,MBB, desiccant, HIC & MSD Label shall conform to,J-STD-033A .,The MBB shall have a Moisture Sensitive ID,and Moisture Caution label affixed to the outside or to the,lowest level shipping container (Figure 1).,3.,The HIC should be read immediately upon removal from,the MBB. If the 5% RH dot is pink and the 10% RH dot is,not blue, the SMD packages have been exposed to an,exces,-,sive,level .,Celestica Asia,Flow chart in CDG,Key,Requirements,Celestica Asia,Procedure :,IQC,检查来料,召集,ME,QA,PROD,PROG,TE,MP,等部门召开,MRB,会议.确定哪些物料可以继续再用, 哪些物料需要重新,Baking,哪些物料必须,Reject,给供应商.,可继续再用的物料贴上,UAI,标签(,IQC),图1.,HIC,超标的物料帖上,SROT/RWK,标签(,IQC),设立相应的,MRR,号并存入,MRB,图2.,生产部要,Baking,的物料贴上,Special Handling,标签(,IQC).,此标签主要是对该物料,Baking,的要求,图3.,生产部,Baking,完后,贴上一个焗炉标签(,PROD),图4.,2.生产部,Baking :,开,MRB,会议,主要确定的项目?,规则和流程, 标签填法,图片?主要是那些,COMP,在用干燥箱和焗炉?,Key,Requirements,图1,图2,图3,图4,Celestica Asia,IQC,检查合格后贴上,UAI,标签 .,MRB,会议确定必须,Reject,给供应商的物料贴上,RTV,标签,(,IQC),并存入,MRB,内 , 图5.,图5,Celestica Asia,Key,Requirements,Storage,Purpose,Components shall be received in a controlled environment,for,Temperature and Humidity with proper identification.,Procedure,The following procedures are covered on the following pages:,1.Dry Cabinet storage,2.Dry Pack storage,Table 1 outlines the attributes of the different storage methods.,Celestica Asia,Storage - Dry Cabinet,Purpose,Dry cabinets used to store components shall control the Temperature and Humidity,of the space within consistently.,Procedure,1. Dry components and packaging material if necessary as defined,in Drying section .,2. Place dry components in cabinet maintaining RH of no more,than 5% RH. Components may be exposed or sealed in a MBB.,3. Log the Date and Time component is place in the cabinet or,place a MSD control label/tag on the component packaging.,4.,Temperature within the cabinet shall be controlled to,30C.,IN CDG : 35%-85% RH12-27,Key,Requirements,Celestica Asia,McDry,干燥箱,Ref Doc. :,CELQ-052-MPI-1907,(,Dongguan,MPI DL-1),打开包装的物料:,1.如果在一个小时内用完, 只需真空包装.,2.如果超过暴露时间用完, 就必须重新,Baking .,3.,濕敏水平為2至4的元件, 如果暴露時間不超過12小時，最少需要暴露時間的,5倍的时间去干燥，这要求儲存的濕度條件不可高于10%,RH.,4.濕敏水平為5至5,a,的元件, 如果暴露時間不超過8小時，最少需要暴露時間的,10倍的时间去干燥，这要求儲存的濕度條件不可高于5%,RH.,Key,Requirements,RH,顯示器,Celestica Asia,CDG,的3个主要湿度控制表 :,Celestica Asia,Key,Requirements,Storage - Dry Pack,Purpose,Dry packing shall be performed consistently to control the Temperature and Humidity,Within the MBB.,Procedure,1. Dry components and packaging material if necessary as,defined in Drying section .,2. Place the components into a MBB.,3. Place the required amount of desiccant into the MBB.,4. Place a HIC into the MBB with the components. Ensure HIC,is not placed on top of the desiccant.,5. Remove any excess air from the MBB by gently pressing the,bag towards the opening as close to the components as possible.,Using vacuum prior to sealing is optional.,6. Seal the MBB using the heat sealer. Seal the bag close to the,opening of the bag to allow space for subsequent sealing.,Vacuum Packer(,真空包装机,),Ref Doc.:,CELQ-029-MPI-850,(,Dongguan,MPI DL-1),7. Inspect seal for any air leaks.,8. Place or update existing MSD control label/tag on the MBB.,9. Store the dry pack in ambient conditions 40C/90%RH.,Floor life,Floor life are always 24 hrs for all components except level 6, 1 & 2.,除,Level 6, 1, 2,外所有,MSD,零件的,Floor Life CDG,均定為,24,小時,.,SMD packages classified as Level 6 must be dried by baking, then reflowed within the time,limit specified on the label. Level 6,用之前必須焗,CDG have no floor life limit for Level 1 & 2. CDG,對,Level,& 2,沒有,floor life,限制,.,.,Celestica Asia,Key Requirements,Attention,1. Moisture sensitive items classified at levels 2a through 5a should be packaged in,hermetically sealed barrier materials with desiccants. The components must be dried prior,to being sealed in MBB .,2. SMD packages classified as Level 6 must be labeled and dried by baking, then,reflowed within the time.,3. Table below details dry packing requirements for different MSL devices,Celestica Asia,Key,Requirements,4. Carrier materials that are placed in the MBB can affect the moisture level within,the MBB. Therefore, the effect of these materials must be compensated for by baking or,adding additional desiccant in the MBB .,post Exposure to Factory Ambient,If components are with level 1 or level 2, the exposure time is not a concern.,If exposure not greater than 1 hr: floor life clock can stop.,If components are,rebagged,using the original packing materials this should be done,within 30 minutes according to,J-STD-033A.,If exposure not greater than 8 hrs: a minimum desiccating period of 10X by dry pack,the exposure time is required to dry the SMD packages enough to reset the floor life clock.,If components with level 2a or 3 exposed for anytime less than their floor life, the,floor life clock can stop using dry pack.,If exposure greater than 8 hrs and less than its floor life (24 hrs), the components,should be reflowed prior to the floor life or otherwise must be re-baked and dry packed.,reflowed prior to the floor life or otherwise must be re-baked and dry packed.,如暴露超過,8,小時小于小時,須在,24,小時 里,reflow,完,否則要,Re-bake,再包裝,.,If exposure more than its floor life (24 hrs), the components must be baked 48 hrs at 125 C.,prior to reflow or dry pack.,若暴露超過,24,小時,則,reflow,或干包裝前一定要焗小時。,cant be used.,超過儲存期限的物料用之前須檢查,.,Celestica Asia,Key,Requirements,If exposure more than its floor life (24 hrs), the components must be baked,48 hrs at 125 C prior to reflow or dry pack.,Board Rework,If any component temperature exceeds 200C, the board must be baked dry prior to,rework and/or component removal.,If do not need to reuse the suspected defective part or performance failure analysis,then baking the board is not required.,Bake duration of PCBA is based on the component to be removed.,PCBA rework flow chart,Celestica Asia,Key,Requirements,WORK DESCRIPTION: IC,PCB和PCBA的焗爐指示,Ref Doc. :,CELQ-029-MPI-1426,Dongguan,MPI DL-1,1. IC預焗方法,根據IC的焗爐溫度設定值，選擇可承受此溫度的導電管或盤。將電子元件,平放在導電的管上或盤上進行焗爐。焗完的電子元件必須作防潮包裝以备用,.,2. PCB預焗方法,對於PCB將電路板放在層架上，每疊之間及與焗爐內壁最小留2吋空間,以便疏氣,。,對除Matrox產品之外的所有PCB，每疊的高度最大2吋, 如沒有足夠的PCB,層疊,可把重物壓在電路板上，以避免電路板焗板後拗曲,。,對于Matrox產品所有PCB，每疊的高度最大1吋,而且需放置重物壓在電路,板上以避免電路板焗板後拗曲,。,對于Matrox需要特别Rework的產品,每疊的高度最多是4块PCB重叠放置，,而且需放置重物壓在電路板上以避免電路板焗板後拗曲,。,焗完的電路板必須於24小時內進行回流，否則要作防潮包裝.,Celestica Asia,3. PCBA預焗方法,對於PCBA將電路板放在層架上，不可層疊，電路板之間最小留1吋空間,以便疏氣,。,對於已裝配電路板PCBA,在出烘爐時, 生產部需要在已裝配電路板PCBA的,流程卡上邊蓋上B,印和寫下出爐的日期和時間,。 它們一定要在24小時之 內,進行加熱進行零件翻修,否則需要再一次烘板,。,ICs和PCBA的焗爐參數設定,PCB的焗爐參數設定,Celestica Asia,CDG MSD Label,Reuse of material,Purpose,Dry Packing materials may be recycled or reused to reduce costs.,Procedure,Desiccant, HIC and MBB can be recycled according to manufacturers instructions.,Reuse of Desiccants,1. J-STD-033 A requires that desiccants shall meet MIL-D-3464, TYPE II,2. Activated clay type desiccants can be baked according to manufacturers recommendation,to renew it to original specifications .,3. Prior to reuse, the desiccants should be baked for 48 hrs at 125 C along with the,MSDs,4. It is recommended that the desiccants should be reused only for,one cycle.,Reuse of HIC,1.J-STD-033 A requires that HIC shall comply with MIL-1-8835. At minimum, the HIC shall,have three color dots with sensitivity values of 5%RH, 10%RH, 15%RH .,2.,HIC can be baked for reuse. The HIC cant be reused until 5%RH value becomes completely,blue .,Celestica Asia,3.It is recommended that the HIC be baked 1 hr at 125C and reused only for one,cycle .,Reuse of MBB,MBBs,may be reused provided they have not been punctured or have tears that would,compromise the dry bag seal.,Any old labels on the MBB shall be removed or adequately covered prior to reuse.,Attention,1.Materials are processed and disposed according to suppliers specifications .,2.Recycling/Reusing materials is optional. Decision is based on economics and need.,Materials not reused/recycled must be disposed properly to adhere to ISO-14001 requirements.,Celestica Asia,Audit Requirements,Purpose,The MSD control process shall be audited to ensure compliance to Celestica MPS.,Procedure,1.,MSD process control documentation complies with Celestica MPS and,J-STD-033A.,2.,Training and Education program content .,3.,Factory Environmental Conditions are monitored .,4.,Monitoring equipment is maintained monthly and calibration verified annually .,5.,Dry storage equipment is maintained monthly and calibration verified annually.,6.,Procedures are followed accurately.,7. Tracking data is archived.,8.,Baking/Drying information is logged.,Celestica Asia,Thanks!,Celestica Asia,