PCB基本英语Word版

传播优秀Word版文档 ，希望对您有帮助，可双击去除！中英制基本单位换算1 kg=2.205 lb(磅)1磅=0.454 kg1英尺=12英寸1 OZ(盎司)=28.3527g1g=0.03527OZ1英寸inch=1000密尔mil1 ft(英尺)=0.3048m1m=3.281ft1mil=1000u”(uin mil)1码=0.914m1m=1.094码1OZ=28.35克/平方英尺=35微米1 in(英寸)=25.4mm1mm=0.03937in1in=1000mil=25.4mm,1mil=25.4um1 m2=10.76 ft21 ft2=0.0929 m21ASD=1安培/平方分米=10.76安培/平方英尺1磅力=4.4484牛顿1N=0.2248磅力1加仑美制=3.785升1psi=0.06895bar1bar=14.5psi=1.013kg/cm2 1bar=100000Pa1马力=0.746千瓦1 品脱=568 ml1oC=1.8 x oC+32 oF1 oF=( oF-32)/1.8 oC1 英尺=30.5 cm基本英文词汇流程Board cut开料Carbon printing碳油印刷Inner dry film内层干膜Peelable blue mask蓝胶Inner etching内层蚀刻ENIG(Electroless nickel immersion gold)沉镍金Inner dry film stripping内层干膜退膜 HAL(hot air leveling)喷锡AOI （Automatic Optical Inspection）自动光学检测OSP（Organic solderability preservative）有机保焊Pressing压板Punching啤板Drilling钻孔Profiling外形加工Desmear除胶渣，去钻污 E-Test电性测试PTH镀通孔，沉铜FQC(final quality control)最终品质控制Panel plating整板电镀FQA(Final quality audit)最终品质保证Outer dry film外层干膜Packing包装Etching蚀刻IPQA(In-process quality audit)流程QATin stripping退锡IPQC(In-process quality control)流程QCEQC（QC after etching）蚀检QCIQC(Incoming quality control)来料检查Solder mask感阻MRB(material review board)材料评审委员会Component mark字符QA(Quality assurance)品质保证Physical Laboratory物理实验室QC(Quality control)品质控制Chemistry Laboratory化学实验室Document control center文件控制中心2nd Drilling 二钻Routing锣板，铣板Brown oxidation棕化Waste water treatment污水处理V-cutV坑WIP（work in process）半成品Store/stock仓库F.G(Finished goods)成品概述Printed Circuit Board印制电路板Flexible Printed Circuit, FPC软板Double-Side Printed Board双面板IPC（The Institute for Interconnecting and Packing Electronic Circuits）电子电路互连与封装协会CPAR（Corrective & Preventive Action Request）要求纠正预防措施Flammability Rate燃性等级Characteristic impedance特性阻抗BUM（Build-up multilayer）积层多层板Date Code周期代码CCL（Copper-clad laminate）覆铜板Ionic contamination离子性污染Acceptance Quality Level (AQL)允收水平HDI（High density interconnecting）高密度互连板Base Material基材Radius半径Capacity生产能力Diameter直径Capability工艺能力PPM(Parts Per Million)百万分之几CAM（computer-aided manufacturing)计算机辅助制造Underwriters Laboratories Inc. 美国保险商实验所CAD (computer-aided design)计算机辅助设计Statistical Process Control统计过程控制Specification规格，规范Via导通孔Dimension尺寸Buried /blind via埋/盲孔Tolerance公差Tooling hole定位孔Oven焗炉Output/throughput产量湿流程PTH（plated through hole）镀通孔（俗称沉铜）Acid cleaning酸性除油PP(Panel Plating)板电Acid dip酸洗Pattern plating图电Pre-dip预浸Line width线宽Alkaline cleaning碱性除油Spacing线隙Flux松香Deburring去毛刺（沉铜前磨板） Hot air leveling喷锡Carbon treatment碳处理Skip plating跳镀，漏镀Track/conductor导线Undercut侧蚀Aspect ratio深径比Water rinsing水洗Etch Factor蚀刻因子Transportation行车Back Light Test背光测试Rack挂架Pink ring粉红圈Maintenance保养干流程Hole location孔位Annular ring孔环Image Transfer图象转移Component Side(C/S)元件面Artwork底片Solder Side(S/S)焊接面Mylar胶片Matte Solder Mask 哑绿油Silkscreen/legend/Component Mark文字Hole breakout破孔Fiducial mark基点，对光点 Scrubbing磨板Expose曝光Developing显影内层制作Core material内层芯板Thermal pad散热PADPre-pregPP片Resin content树脂含量Kraft Paper牛皮纸Brown oxidation棕化Lay up排版Black Oxidation黑化Registration对位Base material板材Delamination分层其它Wicking灯芯效应Hole size孔径(尺寸)Yield良品率Touch Up修理Warp and Twist板曲度Solvent Test溶剂测试Peel off剥离Company Logo公司标识Tape Test胶纸试验UL MarkUL 标记Cosmetic外观Function功能Tin/Lead Ratio 锡/铅比例Reliability Tests可靠性试验Hole Wall Roughness孔壁粗糙度Base Copper Thickness底铜厚度PCB专业英语(PCB SPECIAL ENGLISH)1.PCB=Printed Circuit Board 电路板2.CAM=Computer aided manufacture 计算机辅助3.Pad 焊盘4.Annular ring 焊环5.AOI=automatic optical inspection 自动光学检测6.Charge of free 免费7.WIP=work in process 在线板8.DCC=document control center 文控中心9.Legend 字符10.CS=Component Side =Top Side （顶层）元件面11.SS=Solder Side =Bottom Side （底层）焊锡面12.Gold Plated 电金，镀金13.Nickel Plated 电镍，镀镍14.Immersion Gold 沉金=沉镍金15.Carbon Ink Print 印碳油16.Microsection Report 切片报告，横切面报告17.X-out=Cross-out 打X报告18.Panel （客户称）拼板，（生产线称）工作板19.Marking 标记，UL 标记20.Date code 生产周期21.Unit 单元，单位22.Profile 外形，轮廓23.Profile By Routing 锣(铣)外形24.Wet Film 湿菲林,湿绿油,湿膜25.Slot 槽,方坑26.Base Material=Base Laminate 基材,板料27.V-out =V-score V形槽28.Finished 成品29.Marketing 市场部30.Gerber File GERBER文件31.UL LOGO UL标记32.E-Test=Electric Open/Short Test 电子测试33.PO=Purchase Order 订单34.Tolerance 公差35.Rigid,Flexible Board 刚性,软性板36.Board cut 开料37.Board baking 焗板38.Drill 钻孔39.PTH=Plated Through Hole 镀通孔,沉铜40.Panel plating 板面电镀,全板电镀41.Photo Image 图象,线路图形42.Pattern plating 线路电镀43.Etching 蚀板,蚀刻44.SM=Solder Mask 防焊,阻焊,绿油45.SR=Solder Resist 防焊,阻焊,绿油46.Gold finger 金手指47.Silkscreen 丝印字符48.HAL=HASL=Hot air(Solder)leveling 热风整平喷锡49.Routing 锣板,铣板50.Punching 冲板,啤板51.FOC=final quality checking 终检,最后检查52.FOA=final quality audit 最后稽查(抽查)53.Shippment 出货54.Flux 松香55.Au金,Cu铜,Ni镍,Pb铅,Tn锡,Tin-lead锡铅合金56.Lead free 无铅57.COC=compliance of certificate 材料证明书58.Microsection=cross section 微切片,横切片59.Chamical gold 沉镍金60.Mould=punch die 模具,啤模61.MI=manufacture instruction 制作批示62.QA=quality assurance 品质保证63.CAD=computer aided design 计算机辅助设计64.Drill bit size钻咀直径65.Bow and twist 板弯和板曲 66.Hit 击打,孔数67.Bonding 邦定,点焊68.Test coupon 测试模块(科邦)69.Thieving copper 抢电流铜皮70.Rail-web 71.Break-up tab 工艺边72.Break away tab 工艺边73.GND=ground 地线,大铜皮74.Hole edge 孔边,孔内75.Stamp hole 邮票孔76.Template 天坯,型板,钻孔样板(首板)77.Dry film 干菲林,干膜78.LPI=liquid photo image 液态感光=湿绿油79.Multilayer 多层板80.SMD=surface mouted device 贴片,表面贴装器件81.SMT=surface mouted technology 表面贴装技术82.Peelable mask=blue gel 蓝胶83.Tooling hole 工艺孔,管位,定位孔,工具孔84.Fiducial mask 测光点,光学对位点,对光点,电眼85.Copper foil 铜箔86.Dimension 尺寸87.Nagative负的,positive正的88.Flash gold 闪镀金,镀薄金89.Engineering department 工程部90.Delivery date 交货期91.Bevelling 斜边92.Spacing=gap 间隙,气隙,线隙 PCB的各层定义及描述为了方便与印制板厂家的技术沟通，提高对PCB的技术认知一致度，特在此将我司常用PCB的有关板层特性做简单说明，请爱好者参考此说明进行设计和制造。 PCB的各层定义及描述：1、TOP LAYER（顶层布线层）：设计为顶层铜箔走线。如为单面板则没有该层。 2、BOMTTOM LAYER（底层布线层）：设计为底层铜箔走线。 3、TOP/BOTTOM SOLDER（顶层/底层阻焊绿油层）：顶层/底层敷设阻焊绿油，以防止铜箔上锡，保持绝缘。在焊盘、过孔及本层非电气走线处阻焊绿油开窗。焊盘在设计中默认会开窗（OVERRIDE：0.1016mm），即焊盘露铜箔，外扩0.1016mm，波峰焊时会上锡。建议不做设计变动，以保证可焊性； 过孔在设计中默认会开窗（OVERRIDE：0.1016mm），即过孔露铜箔，外扩0.1016mm，波峰焊时会上锡。如果设计为防止过孔上锡，不要露铜，则必须将过孔的附加属性SOLDER MASK（阻焊开窗）中的PENTING选项打勾选中，则关闭过孔开窗。另外本层也可单独进行非电气走线，则阻焊绿油相应开窗。如果是在铜箔走线上面，则用于增强走线过电流能力，焊接时加锡处理；如果是在非铜箔走线上面，一般设计用于做标识和特殊字符丝印，可省掉制作字符丝印层。 4、TOP/BOTTOM PASTE（顶层/底层锡膏层）：该层一般用于贴片元件的SMT回流焊过程时上锡膏，和印制板厂家制板没有关系，导出GERBER时可删除，PCB设计时保持默认即可。 5、TOP/BOTTOM OVERLAY（顶层/底层丝印层）：设计为各种丝印标识，如元件位号、字符、商标等。 6、MECHANICAL LAYERS（机械层）：设计为PCB机械外形，默认LAYER1为外形层。其它LAYER2/3/4等可作为机械尺寸标注或者特殊用途，如某些板子需要制作导电碳油时可以使用LAYER2/3/4等，但是必须在同层标识清楚该层的用途。7、KEEPOUT LAYER（禁止布线层）：设计为禁止布线层，很多设计师也使用做PCB机械外形，如果PCB上同时有KEEPOUT和MECHANICAL LAYER1，则主要看这两层的外形完整度，一般以MECHANICAL LAYER1为准。建议设计时尽量使用MECHANICAL LAYER1作为外形层，如果使用KEEPOUT LAYER作为外形，则不要再使用MECHANICAL LAYER1，避免混淆！8、MIDLAYERS（中间信号层）：多用于多层板，我司设计很少使用。也可作为特殊用途层，但是必须在同层标识清楚该层的用途。9、INTERNAL PLANES（内电层）：用于多层板，我司设计没有使用。10、MULTI LAYER（通孔层）：通孔焊盘层。11、DRILL GUIDE（钻孔定位层）：焊盘及过孔的钻孔的中心定位坐标层。 12、DRILL DRAWING（钻孔描述层）：焊盘及过孔的钻孔孔径尺寸描述层PCB常用英文词汇汇编A aA.O.I(Automatic Optical Inspection)自动光学检查Acceptable quality level (AQL)可接受质量水平Accuracy精确度Activating活化Active carbon treatment活性碳处理After Pressed Thickness压板后之厚度Alignment校直，结盟Annular ring锡圈Anti-Static Bag静电胶袋Apparatus设备，仪器Area面积Artwork菲林Artwork Drawing菲林图形Artwork Film原装菲林Artwork Modification菲林修改Artwork No.菲林编号Assembly组装，装配Axis轴B bBackplane背板Back-up垫板Baking 烘板Ball Grid Array (BGA)球栅阵列Bare board裸板Base Copper底铜Base material基材Bevelling斜边Black Oxide黑氧化Blind via hole盲孔Blistering起泡/水泡Board Cutting开料Board Thickness板厚Bottom side底层Breakaway tab打断点Brushing磨刷Build-up积层Bullet pad子弹盘Buried hole埋孔C cC/M(Component Marking)元件字符Carbon ink碳油Carrier带板Ceramic substrate陶瓷Certificate of Compliance合格证书Chamfer倒角Chemical cleaning化学清洗Chemical corrosion化学腐蚀Chip Scale Package (CSP)晶片比例包装Circuit线路Clearance间距/间隙Color颜色Component Side(C/S)元件面Composite layers复合层Computer Aided Design (CAD)电脑辅助设计Computer Aided Manufacturing (CAM)电脑辅助制作Computer Numerial Control (CNC)数控Conductor导体Conductor width/space导体线宽/线隙Contact接点Copper area铜面积Copper clad铜箔Copper foil铜箔Copper plating电镀铜Corner角线Corner mark板角记号Corner REG.Hole角位对位孔Cracking裂缝Creasing皱折Criteria规格,标准Crossection area切面Cu/Sn Plating镀铜锡Current efficiency电流效率Customer客户Customer Drilling File客户钻孔资料Customer P/N客户产品编号D dD/F Registration Hole干菲林对位孔D/F(Dry Film)干膜Date Code日期代号Datum hole基准参考孔Daughter board子板Deburring去毛刺Defect缺陷Definition定义Delamination分层Delay耽搁Delivery交货Densitomefer透光度计Density密度Department部门Description说明Design origin设计原点Desmear去钻污,除胶Dessicant防潮珠Developer显影液,显影机Diamond钻石Diazo film重氮片Dielectric breakdown介电击穿Dielectric constant介电常数Dielectric Thickness介电层厚度Dielectric Voltage Test绝缘测试Dimension尺寸 Dimensional stability尺寸稳定性Direct/indirect直接/间接Distribution发放Document type文件种类Documentation Control文件控制Double sided board双面板Drill bit钻咀Drilling钻孔Drilling Roughness钻孔粗糙度Dry Film 干菲林Dry Film-Pattern干膜线路Dynamic动态E eECN(Engineering Change Notification)工程更改通知Effective date有效期Electrical Test Fixture电测试 针床Electro migration漏电Electroconductive paste导电胶Electroless无电沉Electroless copper无电沉铜Electroless Ni无电沉镍Electroless Gold/Au无电沉金Engineering drawing工程图纸Entek有机涂覆Epoxy glass substrate环氧玻璃基板Epoxy resin环氧基树脂Etch蚀刻Etchback凹蚀Etching蚀刻E-Test Marking电测试标记E-Test(Electrical Test)电测试Exposure曝光External layer外层F fFiducial mark基准点Filling填充Film Fabrication菲林制作Final QC最终检查Finish Overall Board Thickness成品总板厚度Fixture夹具Flammability可燃性Flash Gold薄金Flexible易曲的,能变形的Flux助焊剂G gGeneral information一般资料Ghost image重影Glass transition temperature玻璃化湿度Gold Finger(G/F)金手指Golden board金板Grid网格Ground plane地线层H hHAL(Hot Air Leveling)热风整平Hand Rout手锣Hardness硬度Heat Sealed热密封Heat Shrink-warp热收缩Holding time停留时间Hole孔Hole breakout破环Hole density孔的密度Hole Diameter孔径Hole location孔位Hole Location Chart孔位座标表Hole Position Tolerance孔位误差Hole size孔尺寸Hot Air Leveling(HAL)热风整平Humidity湿度 I iIdentification标识,指标Image影像Imaging transfer图形转移Impedance阻抗Impedance Test阻抗测试Inner copper foil 内层铜箔Inspection检验Insulation resistance Test绝缘测试Inter Plane Separation内层分离Interleave Paper隔纸Internal layer内层Internal stress内应力Ionic cleanliness离子清洁度Isolation孤立Isolation Resistance绝缘电阻Item项目K kKEY board按键盘Key slot槽孔Kraft paper牛皮纸L lLaminate板材Laminate Thickness材料厚度Lamination void 层间空洞Landless hole破孔Laser plotter激光绘图机Laser plotting激光绘图Laser via hole激光穿孔Layup层压配本Lay-up Instruction压板指示Legend字符Legend Width字符宽度Length长度Lifted Lands残铜Line Width线宽Liquid液体Location位置Logic diagram逻辑图形Logo唛头,标记Lot size批卡M mMark标记Master drawing菲林图形Material Thickness材料厚度Material Type材料类型Max. X-out坏板上限Max.Board Thickness After Plating电镀后总板厚度之上限Measling白斑Mech Drawing No.图纸编号Mechanical cleaning机械清洗Metal金属Method方法MI(Manufacturing Instruction)生产制作指示Microstrip微条线Min Conductor Copper Thickness最小线路铜厚Min Hole Wall Copper Thickness最小孔壁铜厚Min. Gold Plating Thickness最小金厚Min. Nickel Thickness最小镍厚Min. Tin-Lead Thickness (After HAL)（喷锡后）最小锡厚Min.Annular Ring最小环宽Min.Spacing between Line to Line线与线之间的最小距离Min.Spacing between Line to Pad线与焊盘之间的最小距离Min.Spacing between Pad to Pad焊盘与焊盘之间的最小距离Minimum 最小Mirroring镜像Missing 缺少Model No.产品名称Molded模塑Mother board主板Moulding模房Mounting hole安装孔Multilayer多层板 Multi-layer Laminate多层板材料 N nNegative反面的Net list网络表 Network网络 Nick缺口No. of holes孔数No.of Array/Panel每个拼板套板数No.of Panel per Stack每叠板数No.of Panel/Sheet每张大料拼板数No.of Pcs Per Bag每包数量No.of Unit/Array每套单元数Normal value标准值O oOblong椭圆形的Offset 偏移Open/short开路/短路Optimization(design)最佳化(设计)Organic Solerability Peservatives(OSP)有机保护剂 Originator原作者Outer copper foil外层铜箔Outline外形P pPacking包装Packing包装Pad焊盘Panel Area拼板面积Panel Plated Crack板镀缺口Panel plating整板电镀Panel Size拼板尺寸Panel Size After Outerlayer Cutting外层切板后拼板尺寸Panel Utilization拼板利用率Pass rate通过率Passivation钝化Pattern线路Pattern Inspection线路检查Pattern plating图形电镀PCB(Printed Circuit Board)印制线路板Peck drilling啄钻Peel strength 剥离强度Peelable可剥性Peelable 剥离强度Peelable Mask可脱油Peeling剥离Permanent永久性PH valuePH值Photo plotting图形输出Photo via hole菲林过孔Photographers照片靶标Photoplotler光绘机Physical物理的Pin hole销定孔Pink ring粉红环Pinning hole钻孔管位Pitch间距Placement放置 Plated Though Hole(PTH)沉铜Plating电镀Plating Crack电镀裂缝Plating line电镀线Plating rack电镀架Plating Void电镀针孔Plug Hole塞孔Polymer聚合体Porosity孔隙率Positive绝对的Power plane电源层Prepreg半固化片Primary side首面Print印刷Probe point针床测点Process工序Process flow工序流程Product Planning Dept.生产计划部Production生产板Profile外形Profiling 外形加工Profiling Process外形加工Project No.产品编号PTH Thermal Seress TestPTH热冲击测试PTH(Plating Through Hole)沉铜Pull away拉离Punch啤模Punching冲切Punching Mould Drawing啤模图形Q qQA Audit品质审计QA(Quanlity Assurance)品质部Quad Palt Pack (QFP)四边扁平林整器件Quality质量Quantity数量R rRaw Material Utilization原材料利用率Recall回收Rectifier整流器Register mark对位点Registration重合点Remark备注Resin树脂Resin Recession流胶Resist抗蚀剂Resolution分辨率Rigid精密的Roller coating涂覆Roughening粗化Round pad圆盘Routing外形加工,铣板S sS/M Material绿油物料S/M(Solder Mask)阻焊Sales 销售Sample样板Sampling inspection抽样检验Scaling factor缩放比例因素Scope范围Scoring刻槽Scratch划痕Secondary side第二面Section Code组别代号Section Code Change组别代号更改Segment部分,片段Separated分离Sequence顺序Sets套Sheet Size大料尺寸Shematic diagram原理图Shiny有光泽的,发光的Silk screen丝印Silver film银盐片Single/double单层/双面Slot 槽,坑Smear污点Solder Mask阻焊Solder mask on bare copper (smobc)裸铜覆盖阻焊膜Solder side焊接面Solder Side C/M阻焊面字符Solder Side Cir.焊接面线路Solder Side Circuit焊接面Solder Side S/M焊接面阻焊Solderability可焊性Solvent Test可溶性测试Spacing线距Special requirement 特殊要求Specification详细说明，规范Spindle主轴Split裂片Square pad方块Standard标准值Static静态Stencial网版Step drilling分布钻Step scale光梯尺Store货仓Supplier供应商Supported hole支撑点Surface表面Surface mount technology表面组装技术Swimming滑移T tTack堆起Tape Programming铬带制作Tape Test胶带测试Target Hole目标孔Teardrop 泪珠Template天平Tenting封孔Test测试Test coupon图样Test Parameter测试参数Test Pattern测试孔Testing Voltage电压Thermal shock热冲击Thermal stress热应力Thickness厚度Tin Content锡含量Tin/Lead Stripping退铅锡Tin-lead plating电镀铅锡Tolerance公差Top side板面Touch up修理(执漏)Training训练Transmission传输线Transmittance传送Trim line修剪U uUltrasonic cleaning超声波清洗Undercut侧蚀Unit Arrangement单元排版Unit Layout Per Panel单元拼板图Uv-blocking 阻挡紫外线V vVacunm Pack真空包装Vacuum lamination真空压制V-CutV- 坑View From观察方向由Visual & Warpage可视性和翘曲度Visual inspection目检Voltage 电压W wW/F(Wet Film)湿膜Warp & Twist翘曲和弯曲Width宽度Wiring线路