新产品开发整体流程介绍中英文课件

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按一下以編輯母片標題樣式,按一下以編輯母片,第二層,第三層,第四層,第五層,单击此处编辑母版标题样式,单击此处编辑母版文本样式,二级,三级,四级,五级,2020/3/26,#,C-System Introduction will cover,Role&Responsibility(R&R),Process,Cx Stage:,C0:,Proposal,phase,構想階段,C1:,Planning,phase,規劃階段,C2:,R&D Design,phase,設計階段,C3:,Lab Pilot Run,phase,樣品試作階段,C4:,Eng Pilot Run,phase,工程試作階段,C5:,PD Pilot Run,phase,試產階段,C6:,Mass Production,phase,量產階段,Role&Responsibility,Function,Responsibility,PM,產品經理-,Product Manager(,或計畫專案經理-,Project Manager),為所負責計畫或產品線成敗之總負責人,將依產品線之性質指定專人負責某類產品,必須對所負責產品線專業領域之發展及行銷雙方面皆有相當程度的了解.並依照產品之條件及市場狀況,做適當的運用,訂定技術或產品市場競爭策略,並在適當的時機推出適當之技術或產品.,TM,TM is responsible to coordinate technical issues conflict among HW,SW,ID and ME and decision-making.TM has to handle all project technical issues.,PCC,為規劃推廣、連絡及控制專案進行的負責人,掌握專案進行之情況以協助處理異常狀況,使新產品能順暢切入工廠且如期推出,以提高產品競爭力.,協助,R&D RELEASE,開發階段,BOM CHANGE NOTICE.,R&D,R&D,包括電子部門及工業設計部門,若只寫,HW(Hardware Design),則指電子部門,若只寫,ID(INDUSTRIAL DESIGN),則指工業設計部門;包括,ME,Thermal,Packing design.,若只寫,SW(Software design),則指軟體設計部門有負責,BIOS,Driver,及,Pre-load,不同工作性質之軟體開發功能.,R&D,人員負責產品之開發、設計、測試規劃,包括,H/W、S/W,及,ID,的開發、設計、提出新發明及著作權揭露書.,-Wistron Case,Role&Responsibility,Function,Responsibility,HW(Hardware Design),*Hardware is responsible for Electronic Engineering Design,*Co-works with S/W and QT to make sure that the every function works well according to spec.,*H/W should conduct technical transfer to PE.,*H/W should input,update,and maintain the bugs/issues information in the bug tracking system.,SW(Software Design),*Software is responsible for the design of BIOS,Driver,Utilities,and S/W Preload.,*S/W co-works with H/W and QT to make sure that every function works well according to the specification.,*S/W has to release the SCD and the Cert.Team Document.,*S/W should conduct technical transfer to TE.,*S/W has to input/update/maintain the bugs/issues information in the bug tracking system.,ID/ME(Industrial Design/Mechanical Engineering),*ID/ME is responsible for Mechanical Engineering,Thermal and Packing designs.,*ID/ME should conduct technical transfer to PME.,*ID/ME should input,update,and maintain the bugs/issues information in the bug tracking system used.,-Wistron Case,Role&Responsibility,Function,Responsibility,PA,(EMI/Safety,QT,CE/Reliability,PCB,OS Certification),為產品保證暨開發支援,Function,之總稱,主要負責根據,MRS/PES,執行各項產品之測試,諸如,EMC/Safety:REGULATORY TEST,CE:RELIABILITY TEST,及,KEY COMPONENT APPROVAL,PCB:PCB LAYOUT,DC:BOM,OS:OS,認證,etc;,EMC/Safety,All products to meet EMC/Safety requirements and guarantee the legality in the international marketing.,申請產品之安規、測試、,Debug.,QT,為,R&D,轄下所屬之測試單位人員,主要負責各項產品之測試,諸如,COMPATIBILITY TEST,SOFTWARE TEST,S/W PRELOAD TEST,DIAGNOSTIC PROGRAM TEST,ETC.,CE/Reliability,組件承認測試、不良品故障分析及其他附件等材料品質之管制及保證,產品相關之可靠度與環境實驗,以及可靠度工程之研究與制定.,PCB,PCB Layout,之申請、,PCB,之設計、,Orcad library&Mentor library,的建立與管理.,信號品質,CAE,分析,PCB layout,外包廠商之管理,,PCB,製造廠商之管理.,OS Certification,執行公司各產品之,OS,相容性認證測試及,LOGO,申請.,O.S.Beta Site,測試,PDM,料號編碼及控管,BOM,製作,-Wistron Case,Role&Responsibility,Function,Responsibility,AM(Account Manager),1.爭取訂單與客戶合約協商,.,2.協調產品,SPEC.,工程變更,SAMPLE APPROVAL.,3.適時反應市場需求與趨勢,.,MM(Material Management),1.MM is responsible for new supplier development,parts purchasing,2.Controlling mechanical tooling status including the schedule,capacity,parts readiness,concerns,3.Manage the dependencies,long lead-time items.,4.MM also co-works with SQM and CE for component quality improvement and the key component QVL final version,SQM(Supplier Quality Management),*零件品質管理及參與分包商之評鑑,/,管理(,SQRC Plan/Status),*負責異常材料分析、追蹤與改善,.,*負責進行產品,QVL CANDIDATE APPROVAL,作業系統,AT mfg.,GCSD,1.開發及推動全球客戶服務及支援計劃.,2.各項售後服務及支援作業.,3.參與,Field,品質改善作業(,EWG),FI,負責評估,Project Cost,決定,Project,是否可行以及,Project,所花費之,Cost.,Legal,合約及專利審核,-Wistron Case,Role&Responsibility,Function,Responsibility,CFE,CFE acts on behalf of Wistron global manufacturing operation to deal with the customer,and also acts as a representative of the customer when dealing with internal Wistron teams.Based on the C4/C5 checklist,related reports and project status,CFE is responsible to conclude the exit judgment(Ready or Not ready)during C4/C5 Exit meetings to determine whether a product can move on to PD pilot run/MP or not,NPI,1.負責規劃、協調、整合與提供,各,Site,製造所需相關資訊與技術資料,2.協調安排新產品轉移至海外生產工廠,3.協調處理海外生產工廠發生之生產相關問題,PE/PME,1.產品設計審查,產品問題之發覺及產品移交,.,2.協助生產良率提昇,克服生產瓶頸,提高生產力,.,3.協助訂定製造規格及引進新的製作技術,進行改善以確保產品品質.,IE,1.設計及管理一個高效率的整合製造系統,.,2.消除浪費、杜絕不合理,提高生產力,3.生產流程規劃、製程改善、標準工時製定,QA,1.執行製程及產品之檢驗並反應品質報告請相關單位改善品質,2.收集及處理市場及客戶品質回饋資料反應相關單位改善品質,3.協助工程單位必要之驗證測試,.,4.,建立,PCBA,Final Assembly,之檢驗標準,QE,1.執行,DQA.FDI,MTBF,ORT Test,2.執行產品開發過程之可靠度及環境測試(,C4),3.協助工程測試驗證,4.品質工程問題分析與解決,-Wistron Case,Role&Responsibility,Function,Responsibility,PD(Production),PD has to work with PE,PME and IE respectively to get testing equipment&tools,assembly tools,and SOP ready before C5 Exit.PD is responsible to produce the product.PD is not just for efficiency only but also quality.,PSE(Process Engineer),PSE is responsible for SMT process and for releasing the SMT pilot run report.PSE is also responsible for t
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