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Click to edit Master title style,Click to edit Master text styles,Second level,Third level,Fourth level,Fifth level,*,*,*,有关,COV.,计算,测试方法,板面铜镀层厚度分布测试,试板规格,底铜厚:,H,OZ,or,1 OZ,尺寸:,18”,X 24”,板厚:,1.6,mm,双面板,数量:挂,满飞巴,试板流程,磨板,沉铜,板电,测总铜厚,计算镀铜厚,CoV,分析,整板电镀条件,流密度,:1.8,ASD,时间,:70,min,镀液温度,:24,o,C,镀液各成分在控制范围内并分析记录,测量方式,采用光板整板电镀方式,用铜厚测试仪直接测板面铜厚,测量位置如下图所示:,x,y,12,25,50,y/4,y/2,5y/8,3y/4,y-50,y-25,y-20,12,x/4,x/2,3x/4,x-12,Measuring Grid,Points of Measurement,Plating Guarantee,x=4,57,mm,y=610mm,每块板测完后,检查数据,如发现特别的数据允许重测。,评估方法,用,CoV,(Coefficient of Variance),值评估铜厚均匀性,公式如下:,Statistical Method,Coefficient of Variance,(CoV,),=,Mean,Standard Deviation,Plating Guarantee,电镀铜板面镀层厚度分布评价标准:,整缸板,CoV,12%,为合格,Panel Orientation,Walkway Side(WS),Front Side,(Load Station),Service Side(SS),Plating Tank,Plating Guarantee,Panel 1,Panel 8,SIDE A,SIDE B,
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