半导体词汇缩写表

半导体词汇缩写表A/DnalogtodigialAtoic asoptionAatoi absrpionspctocoACativt-based otiABMactivit-basd managemenCalerating curren； actiatedcbonCFnsoropic codtieilmACIaterclean inspectonACaisotopic onductivepsCTaltntvecontrol teique; ata cyce imeDCanalogt-dal covreADEanced dvloment envinmenADIftedelopnspectionADTaplediagnoschniqueADTSEMApply/Develp rackSpeciEquent MdelAEaomic emisin； aouticisson；absolutlsomtryAECadvncdequpment ontolerAECAdvanceEqupmen ControSystem； Aate Equipentotrl SytmAEIaferethinspion;atomad equimentinteraceEManlytical elecro microscopASuge mission/lectron petsoyAFMomic frce icroscpAFPbraivee olshgslverA-GETFAdvancedGEM Tsk orceVatoatedguied veiceHFhous hydrog florieAHUir andiguitAIutotd mageretalAllumiuADaomic lyer deposiionLatomc laer epiaxy； acaio logi eementALSnced liht ource； advnced lowpower SchokyAMCiborne molecula contamiaiAMHSautomte atrialndling systemMTadaced maacurng tchnloyMatm ass unitANNartfical nual networkOVAaalsis ofvriancAOVroera valeAPadhsion romterAPAadvc peforancalgrithmACadvanced oes cotlADddnollutio cotrol diceAPCFAvadocesCntrol Fraework InititivPCVDatosphecressurchemical vapodpostiPCadvcedprocss equpmnt onoAPaplicato prgramnginterface; atmospheri pesure ionizatiAatshrc pasvation module； acousc latemoeAPDAdvaned PrducsResarchadDevelopme LabrtorySMattenuating hsshift maskAQIACCSS qury inraceQLaccptble qualy levelraonAasct raioMSAumadeliailiyACantireflecvecotinRDEsperato-eedent ethingARPAdnced Reerch Projects Aency(see DRPA）RSang-resld scatteigAsaseicAS/RSauomad sgand retieasysemAAPAdvane teppe pplicaon PrgrASICaplicaionsecic trad cruitAOtomatic shutoffAPadvanced strip and assvion； dvancedstrippessSRautomaed sn receieATDAdnceTolDepmnFaclityEaoatic tstequimntAGautmati tesgenertioTLASbreviated est anguag fal ssestmatmospereATPadvnetchnoogyprogram；denosin triposphate； acceptnc adtoolprormaneATRttenuae totl rflectneAttateutdAuoldVPvacd vertical rcesorAVSvancd visliato ysemAWEasypotc wavefo evatioWISPMabe er in si priclemontoringAWSavaned wt stationBilli； boronBabrmARCbottm antirefetive coatingBASEBostonAre Seonduct Eduatio (Council)BAbukacos vBCbias contrBDEVbhavior-level evatnBDSBonian DynicsSimulatinBebrlimBEbak end lineSOIonded detcack silcon n insuatorFbrigtfieldFGSBoydFltcher GoldfarbShanno opimizaionlgrithmBbfeed fielefect transistor gcBGAbll grid aryTBrinel adness tetBiismutBiCMSbilar comentaymetaoide semicoductorFETbiplar iedeffet transsBMbinar intensitymkBSbiolr mealoxid emiconductoSTbuilt-neltesBITbu on temperaureBITbuiltin est eipmentMCbubblememoyconrllerDbulk icro dfctOEbufered xd etchatBRbottom angeOSBokof SEMIanad； inar object storagesysmBObuied oxieBbea pr；busnessrocs reengierigBPSoon posphoslicate lsBPTEOSBPG fromaOS suBrbrominBSEbackscatteredelecton detectionTAbup tape autmdbodigBVbeakdowvolaeCcanCalciumACIM rhittreCAACIM apliationsarhitcturCABCompeitive Analyis encmaigCADcmtiedesgnCADTcontrol apicatio deelomen toolCAEcomuteraided egineergIcomputer-assiste istrtiMcoputerai mnfctrigCASomputer-assiseprolesolinCARchemicaly aplifed ristCARRIComutredsessmento eate ikImpactsCASEompt-aded softwreenginrig; copuerid sytems egineerigCATcoueridd esingCAWConstrctio AalyisWorkouCWCcrogeniaersolaerleaningBGerac ballgrid aaySchemiabottle stoae aeaCBTcompuer-sed trainingCCicie； cluster cotrollerCCceramic chip carrierCDchrgecopldevieCCScmpaiblcurnt-sinki oiCCWcunterclockwiseCdcaimCDrticadimensonCDOLcrtial imensiooverlaCAcln dryaCDEchmical downseam etchDEMstmer Dlier EepriseodelCIcoletordiuson iolatnCDommon Device Mdl or SABDOcontrlled deoposion/oxdinDRhemicldistribtion omSchemical distribution sstemCceriumCEcaplary lectropeisCCcelvlation chiCEEnrol execuionironmnCEcontinous emissions moioingCR-DIPcami dl in-lie ackgeFAcoponet flrenalysiFCclorfluoroarbnCFDcputationa flid dyamcsCFMconaiaionfreemanufauringICcleanroointerfaecamberCIDcare-ijectin diceCEcompterntegrated nginngCIMcompterinegrae nufcurigIMSAper-inegrad mauactringopen systems architctur（ESPIT prgrm)CICnnuusprovemetProgrmISneforIntrted SysemsCISComplx instrucin se omputerClchrieLCCcermic leaded chicarrierCLICcloed-loop intnsiy cotrolCconfguration anagement;cassett moduleCMCcassete odule cntrolerCMLct deloicCMcbiiy mut odelCMScopenary etaximiondctorCMPchemcal ehaicallanriztinCMRcomonmodeeection rti; cne e requestCNCcomp nerial cotrl;codesatnclus counterCTcarbon anotubeCoobaltCOBchip-bordCOcost f conmblODcodr-decoerCEDcmuter-oimizd xprimenta desinCGScot of gos soldCoOct of ownerhiCRAcomo bct reques brokr architectureCOREcompostebjecreereneCSScomoojctervice peciationOTcuster-wn oolgCoVoefficit ofvrianceppoce capilyCPcncurrent poduct devopetCPmmniatonsPAceramic grid arrCpprocesscpali inxQPceramic qad flpacCQNcls-queng nekCcromiumCRcycli redudncy checkCMCst/Resourc MoesesiumSACIM sste architectreCSEcotro ystems ngineringCFriicalsucessfactoSLcurrnt-sring logicCSMA/DcarirsenseCSPchipscle packageCPEDocrret siconducorpouion ad eqipment velomenCTIMsysms tecnogySTRcntinuuslystre tnk reactorVcomma-sparae vrableCTlstertoolcnrollerCTEcefficient o therma xpsionTIycl tme irovemetCTClste ol mulr comntinsucoppeCUBcntral utlty buildingCUBEScapacty uiiatiobtleck effcncy sytemCUIcmon usr ierfaceUMcmutie smCVcapaiancetovolageCVCMclecd voltiecodensable mateiasCVcheml apor epositioCWontinuouswaCzCzohas procesD/Adigital to nog/Bi bndngDACdgtalto-alonveterietabrtn pecosopyDSSLdifferenial algebrcytem solverDBdataa maaementystemDCirec crrentCAdretchip attchmntATdoublecontain cd trae systmdistributed cmputer environmeDCLdigitalcommandlangua; disay comuniation logDCdichloosilaneDLdevicdescriton langageDDMdeect data manageent ystemDEDSiscreteevent dymic smutnDESdataenryption tndrd; display qupmntstausDdkfieldFdnsifi fuidclenDFEuafrequnyethDFMdesign or aufctringDFResign r relabilityDTdesign for tetFYdeign foryiedDHdilt hydroluoic acidDIdeionied；dieleti ilatonBLdraiduced bair eakageICifferential intefrence otrasILdual iliIPdual nlin akaeDLBdeviclevel urniLCdveped ource lines of odeSiplay lot statusDLTevce-eveltestDLTSdeepeveltransiet spectoscopyMAdirctmemory acss； dyamimchanica aalysisDMHdispla messgepsDMLdmaniulaton anage； dila messgloDMdigital ltimeterMOdiffusedmetalodesidutorDMdisl mve equssDnam ptimiztnDOAdeadon alignenDOASiffrentialoptical bsorpionspectrscopDEeign of eperimentsDOFepth o focsDOiyphthaltDAdesuciv physical aalysisDPdigial anel merDPPdschareproduce plasmaDPRAMdual-prtsaic rnom accs mmrDRAMamicandomaes emoyDRACDesig Rule an Proces Architecture CunDRCdesin rul chckDREdestructn real fficiecDRIFTSdiffuse eflctnceinfraredFouier transformsecosopyDRefecreview toolDAdispyse actiity;dimnsionallysabe anodeDSCdiffeentl cnn calorimetryDCdirectsiulatonMoneCarDSdownstreamquartzDSSdisplay stocker statuWdirectstepon-waferTdnm tesDTAdiffenialthera alysTdirec thermooupl contrlDTiode tranistor logiDMfectemnitr； delay tme multplier; evie tet modue； diitalterrin mDTPNdeft tstmono pase numbrDUTdevie uertestUVdee utraviltVdesign vifiationDVEdsign ule verifcationDMdgitl volmetDVSisplayvhcle sttsDWGdmain or grupEAPSMebed atteuated haseshit masEAOMelecticllaterble eadonly oyEAEequimeadoftware emlatreemlctron beamEHelectrneamhg-throughut lithgrhEICelecro eam-indue urrentBRdge ead emovalECeinerin cnge; equpmnt cntolleECAngieerg capabilty asessmnECADelectniccomputeraided ein；egineeing compue-aieddsignEeletroic cutr-aide engineingECLemitr coledlogcEengineering hane oticeCOegineern chag rdeCBelectrchmcal quartz cystl lacERelectroyclro resonancEAeectrnic esignautomtionEenegyisprive pectrocopyEDUequipmenependentuptieEDXenergdsersveXrayEDArgyisprsiv X-raaalysisEEDFeletron energditrbutionfunctiEESelctonnrgy-os spctropyEPROMeletrically erasbl pogrammble read-olmoEFeipe fontend oulEFOCSevanesen fber-ot chemal sensorFTIRemissin Fouiertransform nfrared sptrcpyEFVexcss flowvaveEGethylneglycoletheEHSxremel zardous susanceEIequipet intgtionEIDipent IntrcevelopmentEIPEqupmenImroement rgrm; quipmet Impoemet ProjectEISlcrocemial impedacespectocpEKFexenedKala fiteFxrey ow freqecyEMenterprie moel；eecromagnetic； elecomigratiEAequipt maturty ssssentEMCeetragnetc capability; lectromagetc copatabiityMFelectromgeticfieldMGelctroigrinEMIeeoageti interfceEMAelecron microscopy nd mcroanaysisEMPelcromagntc pulseEMReter me requstEMUeletromagneti unitEOSeltical ovesresEOTed of tanse；equialen id thicnesPxtree rssur；electopolshEPLelctorojecin litogaphyEPRlecrnpamgnetic rsonncPROMelectrcalyporamal rea-ony emoyEPSSelectronic erformance suport systmEPTeupmnt peformne trckiEQUICI equiment otol adiegrationEQIPRTC equimntrl-timecntoEMeqipt eibilityERMentrprisefrene modlERNernal reurent neurlwokERPxtendedrage yrmterEevent rportin stnarETemencyrespn ennerngspcificaio；expet syteSClettic hukESCAeleron perscpy for chemical anlysisESDlectrosttc discarSHenvionetESeletronicseice manualEAExecutiveTechia visr BoardTRExternal Tota Quliy and ReibiltyEVtem ltrvoleVeectron ltEWexpoentialy wighted movng aeagFfluorieF/Ifin iecinAiuanalysiFABfas atm boardentFAMOSfloingate avlae-inctio mea-oxe eicndutrBGAfiptch bal grdarrayFCflip pFCMfaciitescmodeFfatory coro systemFDfault detetion nd classificatonFDErequecy doain experimntFDSOIfully depeted siicn onisutreroFECfabriao evaluaion chipFMfint elentodelELfront end oflieFESEMfeld emisio scnninelectrmcroscopyFETeldfet tanisorFTfastouer trasforFFUfilter fan uitFIfilterbiity index； facty integraonFIfocse in bamFIfame initindeectorIfirsiFIfrontoenig iterfac mchanial sandadFLfuzzy logicFPCfloating poinoperatis needd pcyleFOTOXltng gat tuneoxideFLfatory yutrlyut tolforeignmatrilEAfilr mode an fects alsiFMCfactor maeria mveentcoponentFMPFamewrk MrValdatin ProjtFNNfedforard eualnewokFOCSfiberoptic hemicalsenorFOSBron penigshppin boxFOUPfrotopen unfie poField of vewField xideFPflahontfoallane devitin； fatpanldislayFPAelprogrammable gaterayPLAild-rogmmable logic arayfieloramble ic amlyFPfield-poambe lgi switchFPMSFactorPerfrmance Modli oftwaeOMield-pgrammale readnly memorFRAASFiue RetgRAMEFailure ate Aalys an ModeliRBfat amp mini batcFSGfsed slc gssSMini stemachinFTfinaltest; FouriertransformAfalt tree nlysisTABFoTecnlvsoy BoardFRoure trnsfrm iaredFfull aeFWfullwh alfmimmFflatonGglliumGACgraulactivated abonGCgaroatogray； graimetric cibratGCCgenriccell ntrollerCDs chromatograp iationGCMSga chromagrphy mas sptscopyGDPPga drv s pinchGDSgraphialdsgsytem; graphicl esign softwaGeermaniuMenerc EuipmentMdelGEMVSGEM verfication yseGEnricipmentsmulatGFCgas filtecorrltionGFCIrund ault circuitnterruperIDatedc drain lekgeGIDgas iersion lsedogGCas liquid crmatogrhyOgate oidntegitIBgenelpurpose iteae busGSEgas source control quipmentGTGM TeSystmHydroenHhazrdousair plutnthgh spectratio inspeonASThhlyceleat resstesingHZCMardCommuncation tandardBorzontalBrdemanrytaHCIhotarri injtoHChlow cathoemagneronHCMShgdeityCOSHCShot-arie supesseHhighdesitHDLhardware dscipto languaghigh-denity plaaHDPEhignsiy polyethylneHehliumHEMhihefficeny matchingEPAhi-effiiecy pariclateihnimHFhyluoric acigcrHISheav ion bakscattering seometryHOxhighpesre ognHLFhrizotal aminarlowHMDhamethydisilianeISazaro ateris inventytemHMMhzarous merials anagmet pnHMShigh-erfomance MOS； hih-denst MOSHMERhzardousanic ms eissinrateHOGhigy oriented pyroliic graphitePhpritHPEMHyd lama Equipnt MolHPgh pressure ilatnHPhigh-erormac loPLCig-erfomane liqid cromatographhzrous prducn mteris; ihpuritealHPVhhpressrevenHRAhuan eliablity anayisRRhigh am ratHRTEMhigresoltitansmssion electo icrscoyHSQhydrogen slesioanHTOhgh-temperatre oxdationTRBhightemeatur rse biUPWhot ultapure waterHVACheatingIdineIOnputotutI2integrated njector logicI300Internation 0m nitativeIigatedcircui； nvetmet Councl; in chromtorapyICAPinctivelcould agonplama sectrometrICSitegrated circut mesurement sytemIPducvly couled plasmaIP-Sndctivel couled lsmaoic emisosectroscopyICPSiductvelycopled lasma mass pectroetryICTdeal cyle timeIQdirect drin quicent crntELiniiatinILinrfaedfiniio anuageIDLimmedael dgeros t lif or healtISinteractive ignostc ystemIEAin eneranayisICifused emiter ungIDFienergy distrbtion functonIERNiternalxtnal ecurrent nural ntwoIFinterfIGFnlat-ga fild-effec trnsistorIBinner bonILintelvlieetric； nteray delectriILSitracavty lase spectroscpyIMintrted model;ntegrated metologyMDintmtalielecticMMAio micrphoe mass assIMSion moblit specoscynindiuNCASindividual cettemanacturgystmIiopropylacolLon proection thogrpyIPideal prcess timeririimIRinrredIRASnfraed eltionabsrption sectroscpyIRISimgngof adics itracn ih surfacesIRNinternalrecurent nuralntoIRONMANIprongRelblity f New acins at tIR-1inerconnecrlaiites hip1ISnformationsystems； inerc secicatios; integraedysemsSCnutrySterig CouncilSEinspeio/review spcifc euipmentmodelSinuctr uperanetoISMTInteational SEAECHISPMinsi rticlemonorISRin stu rinseISo sattering spectroscpyIRInterconnecionecnoloyRSInernanal ehnologVHtersilva holeIVPitegrated vacuprossngDPint DevomenogaJEDECoinEctro Dvice ngieering CunilJSSIointEroan Sumicronlico IitiveICJoit IndtralCounlIjust-intimeTJsephs unction ransistorJVDjet vaor depoitionptassum；thousandeVkilo elctn voltKPAey proess areaKrytonkVklovoltLaathnuLAMMser miomass analiLAMMSlas icro-mass secroscopyLCnducanc-caitnce； lqudhrmatgrahyLClfecycl anlysiLCCleaechirrirLower coniee imitLDDlightly doe drainLDlowerdetectio limiLDPlowdensity paLPElow-density olyethyleneECliqid encaslate ChralskicystlLELlowerexplosive liitLERline eg roughnessLFaminarflowLlower lmmae limitLGQlinea