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Unimicron Technology (SuZhou) Corp.0Do The Right Things. 蘇州群策科技公司蘇州群策科技公司 載板封裝介紹載板封裝介紹 Unimicron Technology (SuZhou) Corp.1Do The Right Things. 電子構裝基礎概念電子構裝基礎概念 內容：內容： 1. 1. 構裝技術簡介構裝技術簡介 2. 2. 最近十年之最近十年之ICIC構裝構裝 資料來源：呂宗興資料來源：呂宗興 Cell phone Cell phone ：0932-936-1060932-936-106 .tw Unimicron Technology (SuZhou) Corp.2Do The Right Things. 電子構裝之定義及範圍電子構裝之定義及範圍 定義定義： 微電子技術之發展日新月異，微電子技術之發展日新月異， 電子零組件之尺寸不斷縮小，電子零組件之尺寸不斷縮小， 零組件之間必須透過高效能、零組件之間必須透過高效能、 高可靠性、高可靠性、 高密度及低成高密度及低成 本之互連本之互連 ( Interconnection )( Interconnection )，才能建構成一個具有廣泛性功，才能建構成一個具有廣泛性功 能及實用價值之電子產品；能及實用價值之電子產品； 而建構此互連技術之相關工程而建構此互連技術之相關工程 技藝，被統合稱為電子構裝技術。技藝，被統合稱為電子構裝技術。 應用產品：應用產品：電腦、通訊、電子消費性產品電腦、通訊、電子消費性產品 所需技術所需技術 電子、機械、物理、化學、材料、光學、可靠性工程、人電子、機械、物理、化學、材料、光學、可靠性工程、人 因工程因工程等多重之工程技術。等多重之工程技術。 Unimicron Technology (SuZhou) Corp.3Do The Right Things. 電子構裝之分級電子構裝之分級 晶圓晶圓(Wafer) 晶片晶片(Chip) 第一階層封裝第一階層封裝 第二階層封裝第二階層封裝 第三階層封裝第三階層封裝 單晶片構裝單晶片構裝 多晶片模組多晶片模組 ( MCM ： Multi-Chips Module ) 模組板模組板 Module board 主機板主機板(母板母板) Mother board Unimicron Technology (SuZhou) Corp.4Do The Right Things. 電子構裝之主要功能電子構裝之主要功能 1. 有效供應電源有效供應電源 2. 提供信號傳輸提供信號傳輸 3. 協助排除耗熱協助排除耗熱 4. 保護電子零件保護電子零件 5. 建構人機介面建構人機介面 Unimicron Technology (SuZhou) Corp.5Do The Right Things. 常見之封裝形式常見之封裝形式 二面出腳二面出腳 四面出腳四面出腳 DIP 挿件式挿件式 ( Dual In-Line Package ) SOP SMD device ( Small Outline Package ) SOJ ( Small Outline J-Lead ) PLCC ( Plastic Leaded Chip Carrier ) QFP ( Quad Flat Pack ) PGA ( Pin Grid Array ) PBGA (Plastic ball Grid Array) Unimicron Technology (SuZhou) Corp.6Do The Right Things. 單晶片構裝之基本結構單晶片構裝之基本結構 膠體膠體 ( Epoxy Molding Compound ) 優點優點：膠體對稱膠體對稱，不易產生翹曲不易產生翹曲 晶片晶片(Chip)金線金線(Gold Wire) 銀膠銀膠(Silver Epoxy)晶片座晶片座(Die Pad) 引腳引腳(Lead) Unimicron Technology (SuZhou) Corp.7Do The Right Things. BGA(Ball Grid Array)構造構造 缺點缺點：膠體不對稱膠體不對稱，易產生翹曲易產生翹曲 First bondingMold compound Chip Gold wire Ag paste Through hole Ball mount 目的目的： 接地接地&散熱散熱 Thermal via hole Ground Solder pattern Solder balls Solder resist Bonding pattern Second bonding Unimicron Technology (SuZhou) Corp.8Do The Right Things. 使用導線架使用導線架(Leadframe)之單晶片構裝之單晶片構裝 1. L型引腳型引腳 (Lead)2. J型引腳型引腳3. I型引腳型引腳 4. 無引腳無引腳 (Non Lead) QFN(Quad Flat Non-lead)5. 晶片座晶片座 (Die Pad) 優點優點：1. 1. 散熱能力佳散熱能力佳 2. 2. 面積小面積小( (無須預留接腳空間無須預留接腳空間) ) 3. 3. 傳輸距離短傳輸距離短 4. 4. 無腳彎翹風險無腳彎翹風險 缺點缺點：Molding Molding 困難度較高困難度較高 ( (不對稱，易發生翹曲不對稱，易發生翹曲 ) ) 優點優點：散熱能力佳：散熱能力佳 Unimicron Technology (SuZhou) Corp.9Do The Right Things. 晶片互連技術晶片互連技術(Chip Interconnection) 1. 焊線接合焊線接合(Wire Bonding)使用金線或鋁線使用金線或鋁線， 以熱壓及超音波接合以熱壓及超音波接合 2. 覆晶接合覆晶接合(Flip Chip Bonding)使用錫鉛迴銲或使用錫鉛迴銲或(非非)導電膠固化接合導電膠固化接合 3. 卷帶式接合卷帶式接合(TABTape Automatic Bonding)使用金對金熱壓接合使用金對金熱壓接合 Solder ball bond 不用打線不用打線 Gold bond 註註： TCP ( Tape Carrier Package ) 應用在應用在LCD driver上上。 Unimicron Technology (SuZhou) Corp.10Do The Right Things. 單晶片構裝之演變單晶片構裝之演變 PTH SMT Area Array Fine Pitch Area Array 1970 1980 1990 2000 2010 TO DIP QFP PGA BGA TCP Chip Scale Package Direct Chip Attach on Board * 一定要使用較小的一定要使用較小的 IC (CTE過大易裂過大易裂 ) Wire Bond Flip Chip 的應用的應用 1.電訊上的考慮電訊上的考慮(速度速度、 傳輸路徑短傳輸路徑短 ) 2. IO數的考量數的考量(IO數數 較較Ball Pad受限受限) Unimicron Technology (SuZhou) Corp.11Do The Right Things. BGA構裝之分類構裝之分類 類別PBGATBGACBGACCGAMicro BGA 基板 BT樹脂Polyimide多層陶瓷多層陶瓷Optional 膠體結構 Over mold Glob Top Cap Optional CapOptional CapOptional CapOver mold Glob Top Optional Cap 膠體尺寸 750 mm2140 mm1832 mm3242.5mmChip Scale 晶片方向 Up / DownUpUp / DownUp / DownUp / Down 錫球 Solder Ball 63Sn / 37pb Solder Ball 10Sn / 90pb Solder Ball 10Sn / 90pb Solder Column 10Sn / 90pb Metal Ball Solder / Gold 間距 1.0/1.27/1.51.0/1.27/1.51.0/1.27/1.51.0/1.27/1.50.8/0.5 面積效率 (Chip=1) 7.25.34.54.511.4 Plastic Tape Ceramic Unimicron Technology (SuZhou) Corp.12Do The Right Things. CSP(Chip Scale Package) Definition： Chip scale package (CSP) is a package whose package-to-silicon area ratio less than 120 percent. CSP is derived from existing packages, that is, it can be any type of packages. Silicon Chip Scale 構裝構裝 覆晶覆晶(Flip Chip) 技術技術 小尺寸小尺寸 低電感低電感 高高I / OI / O 表面黏著技術表面黏著技術 (Surface Mount) 標準化標準化 易於生產易於生產 可測性可測性 可重工可重工 可靠性可靠性 定義定義： Package areaPackage area Silicon areaSilicon area 1.2 說明說明：封裝體愈小愈好，：封裝體愈小愈好， CSPCSP並非是封裝的名稱，並非是封裝的名稱， 只是封裝中的一類；只是封裝中的一類； 不同於不同於PBGAPBGA Unimicron Technology (SuZhou) Corp.13Do The Right Things. CSP之分類之分類 1.硬板中介層硬板中介層(Rigid Substrate Interposer) 2.導線架形式導線架形式(Leadframe Type) 3.軟板中介層軟板中介層(Flex circuit Interposer) 4.無中介層無中介層， 壓模成型壓模成型(Transfer Molding) 5.晶圓層級晶圓層級(Wafer-Level) 說明說明：先電鍍再上球先電鍍再上球， Sawing完後再封裝完後再封裝 PI 聚亞矽氨聚亞矽氨 說明說明：所有封裝在所有封裝在Wafer完成後完成後， 再再Sawing Unimicron Technology (SuZhou) Corp.14Do The Right Things. 3D Packages Wire Bonding Wireless Bonding ( FCB , others ) COC (Chip on Chip) CIB (Chip in Board) Through Hole 疊疊Die後再鑽孔後再鑽孔； 目前市場上目前市場上 尚無此類產品尚無此類產品。 Unimicron Technology (SuZhou) Corp.15Do The Right Things. Multi Chip Module (MCM) Definition： Multi chip module is module or package which usually contains a high density interconnect substrate, several active and passive components, and a package which can be connected to the next level of interconnection. Chip Single Chip Module Chip Chip Chip Chip Multi Chip Module Unimicron Technology (SuZhou) Corp.16Do The Right Things. What is KGD? Known Good Die (KGD) is a which has been manufactured and delivered in a bare, or minimally packaged die format, which has quality and reliability comparable to its functionally equivalent packaged component, can be interconnected to its next level of packaging by wire bond, tape automated bonding, or flip-chip. 說明說明： 已知是好的已知是好的Die封裝進度封裝進度， Wafer sawing 無法無法100% 檢出檢出IC是好是壞是好是壞? 原因原因： 1.檢驗困難度高檢驗困難度高 2.成本貴成本貴 大部份的是大部份的是IC封完後測出封完後測出IC是好是壞是好是壞? Unimicron Technology (SuZhou) Corp.17Do The Right Things. 封裝製程介紹封裝製程介紹 IC Assembly Process Introduction Unimicron Technology (SuZhou) Corp.18Do The Right Things. PBGA Assembly Process Wafer Incoming Wafer Grinding Wafer Sawing Die Bonding Plasma Clean Wire Bonding Interconnecting 完成完成 Molding Ball Mount Reflow Flux Clean Singulation (Punch or Routing) Ball Scan Final Inspection Taping De-Taping Substrate pre-bake Curing O/S Test or 3rd Vision Insp. Plasma Clean Top Marking & Curing Unimicron Technology (SuZhou) Corp.19Do The Right Things. Assembly Process Wafer Incoming Wafer Incoming Inspection 1.Wafer in wafer carrier 2.Wafer in wafer box 3.Dice in waffle pack 1.檢驗方法檢驗方法： 一般都是以抽驗方式執行一般都是以抽驗方式執行。 (例如一個例如一個 Wafer lot 抽抽 12 wafers, 每個每個wafer 固定檢驗固定檢驗 pcs 10 pcs10 pcs ) 2.檢驗工具檢驗工具： 一般檢驗：光學顯微鏡一般檢驗：光學顯微鏡 30X100X30X100X 辨認用：金相高倍顯微鏡辨認用：金相高倍顯微鏡 100X1000X100X1000X Unimicron Technology (SuZhou) Corp.20Do The Right Things. Assembly Process Wafer Grinding 1.Wafer in Taping ( Top Side ) - To protect die surface 2. Wafer Grinding ( Bottom Side ) - To get needed die thickness 3.Wafer Cleaning / Drying 4.De-Taping - To remove taping tape Unimicron Technology (SuZhou) Corp.21Do The Right Things. Assembly Process Wafer Mount Wafer Mounting ( Bottom Side ) - To put wafer onto tape & wafer frame - Blue tape or UV tape 說明說明： Blue tape 黏性一致黏性一致 UV tape 黏性較黏性較 Blue tapeBlue tape強，強， 照照 UVUV光後黏性會降低，光後黏性會降低， 較易取較易取 DieDie；缺點是成本較貴；缺點是成本較貴 Control Item： No bubble & particle on the backside No Wafer crack, chipout or scratch Unimicron Technology (SuZhou) Corp.22Do The Right Things. Assembly Process Wafer Sawing - To singulate die to single unit - 2 steps cutting 說明說明：一刀切：一刀切 Wafer Wafer 所受應力較大所受應力較大 二刀切割方式缺點是耗時二刀切割方式缺點是耗時 Water Cleaning / Drying 說明說明： 純水有規格，因純水不易導電，所以需添加二氧化碳純水有規格，因純水不易導電，所以需添加二氧化碳；自來水有一些況物；自來水有一些況物 質或雜質會腐蝕質或雜質會腐蝕 ICIC UV Irradiating ( option process ) -To reduce UV tape adhesion strength Unimicron Technology (SuZhou) Corp.23Do The Right Things. Assembly Process 2nd Optical inspection Die damaged?Die damaged? Sawing quality?Sawing quality? Die surface contamination?Die surface contamination? Unimicron Technology (SuZhou) Corp.24Do The Right Things. Assembly Process Die Bonding - To pick die onto substrate or lead-frame Curing -To cure die attach adhesive Unimicron Technology (SuZhou) Corp.25Do The Right Things. Assembly Process 常見之常見之Die Bonding 缺陷缺陷 1.Die crack ：頂針：頂針 issue ，通常在，通常在 Die 的背面，不易發現的背面，不易發現 - force - size 2.Die mis-placement 放歪，不正放歪，不正 3.Epoxy contamination - reject for any epoxy on die surface - reject for any epoxy on lead 4.Epoxy overflow 注意事項：膠不可高於注意事項：膠不可高於 Die 面，面，die bond 有污染與有污染與Short風險風險 5. Epoxy cover 75% Unimicron Technology (SuZhou) Corp.26Do The Right Things. Assembly Process Wire Bonding Plasma Cleaning ( optional ) - To clean bonding pad surface to increase bonding quality Wire Bonding - To bond gold wire to connect die and substrate Production 檢測項目檢測項目 Wire pull Ball shear Unimicron Technology (SuZhou) Corp.27Do The Right Things. Assembly Process Loop High Control 打線高度須受限打線高度須受限，Base on compound Base on compound 高度，一般而言，需保留高度，一般而言，需保留 SurfaceSurface距離距離 25um 10um 以上 Unimicron Technology (SuZhou) Corp.28Do The Right Things. 常見之常見之Wire Bonding 缺陷缺陷 1.Bond on epoxy / foreign material 2.Missing wire 3.Bond lift 金線脫落金線脫落 non stick on pad - NSOP non stick on lead - NSOL 4.Pad metal lift 鋁墊拉起可能原因鋁墊拉起可能原因 (1) 污染污染 (2) 打線參數不佳打線參數不佳 Assembly Process 5. Sagging wire 線塌線塌：人為導致的比率較高：人為導致的比率較高 6.Shorting wire 7.Shorting bond 8.Miss-placed bond 9.其他其他( Over bond、 Stray wire) Unimicron Technology (SuZhou) Corp.29Do The Right Things. Molding Plasma Cleaning ( optional ) - To modify substrate surface condition to increase adhesion strength between molding compound & substrate. Molding - To protect die & gold wire from damage, easy to handle. Post Mold Curing - To cure molding compound 175 / 8 hrs Assembly Process 功能 1. 清除表面污染 2. 活化綠漆表面，增加Compound 的附著力 Unimicron Technology (SuZhou) Corp.30Do The Right Things. 固體固體EMC移送成型移送成型-Transfer Molding Transfer molding方法方法 1.半導體半導體Chip / Leadframe 半成品置入成型模具半成品置入成型模具 2.預熱後固狀封裝材料投入成型機預熱後固狀封裝材料投入成型機 Pot中中 3.模具溫度約模具溫度約175 條件下條件下，封裝材料溶融，以，封裝材料溶融，以 Plunger Plunger 加加 壓材料流入模具中壓材料流入模具中 4. 4.封裝材料加壓成型熱硬化封裝材料加壓成型熱硬化90 120 90 120 秒後，模具打開取出成品，秒後，模具打開取出成品， 完成半導體成型封裝完成半導體成型封裝 Unimicron Technology (SuZhou) Corp.31Do The Right Things. StandardRangeStandardRange 成型溫度 Molding Temp ()175170200175170180 預熱時間 Preheat Time (sec)0010 預熱溫度 Preheat Temp ()8580110 轉進時間 Transfer Time (sec)1510257515 轉進壓力 Transfer Pressure (kgf/cm2)45301008050120 硬化時間 Cure Time (sec)90201806050120 項目 Item Conventional MoldAuto Mold 建議後硬化條件建議後硬化條件 Post Mold Cure Condition Molding condition template 項目 ItemStandardRange 後硬化溫度 PMC Temp ()175170180 後硬化時間 PMC Time (sec)8412 轉進時間轉進時間：取決壓桿速度影響模流：取決壓桿速度影響模流 Unimicron Technology (SuZhou) Corp.32Do The Right Things. 材料成型材料成型 成型前準備成型前準備 Preparation 冷凍保存冷凍保存(10 ) Cold Storage (10 ) 回溫回溫Stabilizing ( 25 , 5070%RH ) 成型成型 Molding 再保存再保存(必要時必要時 ) Re-Storage 在成型車間在成型車間, 原封不動原封不動. 需回溫需回溫1624小小 時時. (溫度平衡溫度平衡) 1. 不要用手直接碰觸黑膠不要用手直接碰觸黑膠 2. 24小時內使用完畢小時內使用完畢 1. 需重新包裝好需重新包裝好 2. 回溫後回溫後24小時內用完小時內用完 說明說明：用剩下的：用剩下的,大部份會丟掉大部份會丟掉(因因Compound粒碇在常溫下仍會吸濕與反應粒碇在常溫下仍會吸濕與反應 再使用可能會有品質問題再使用可能會有品質問題) Unimicron Technology (SuZhou) Corp.33Do The Right Things. 常見之常見之Molding 缺陷缺陷 1.充填不良充填不良 ( Incomplete Fill ) 2.黏膜黏膜 ( Sticking ) 3.氣孔氣孔 ( Void/Blister ) 4.金線歪斜金線歪斜 ( Wire Sweep ) 5.晶片座偏移晶片座偏移 ( Pad Shift ) 6.表面針孔表面針孔 ( Rough Surface in Pin Hole) 7.流痕流痕 ( Flow Mark ) 8.溢膠溢膠 ( Resin Bleed ) Unimicron Technology (SuZhou) Corp.34Do The Right Things. 金線歪斜金線歪斜 ( Wire Sweep ) 可能原因對策 1. 黑膠流動，粘度太高降低模溫 採用流動性較長的黑膠 (低黏度) 採用硬化時間較長的黑膠 2. 金線硬度, 直徑, 長度&迴路形式轉進速度&轉進時間 金線轉換成半硬 / 全硬種類, 低高度及較短之 金線 3. 進膠口急速噴射( 高壓力 )轉進壓力及速度 Unimicron Technology (SuZhou) Corp.35Do The Right Things. PBGA Assembly Process Ball Mounting Flux - To print flux onto ball pad area Ball Mounting - To place solder ball onto substrate Reflow - To connect solder ball & substrate Flux Cleaning - To clean residual flux Unimicron Technology (SuZhou) Corp.36Do The Right Things. Assembly Process Ink Marking 方式方式 1.蓋印蓋印 2.雷射雷射 製程材料及製具設備 * 前處理* 氫氧焰罩* 氫氧焰產生器 - 氫氧焰 * 整枚 / 單體印字* 油墨*印字機 - 油墨 Thermal / UV Ink Type Stamp / Off-set / Soft-Touch Rubber / Al Template * 預烤* 紅外線預熱器 * 長烤* 烤箱 Unimicron Technology (SuZhou) Corp.37Do The Right Things. PBGA Assembly Process Singulation Singulation - To singulate package from strip to single unit Ball Scan - To check coplanarity ( PKG warp & ball standoff quality) Final Inspection - To check PKG appearance quality Unimicron Technology (SuZhou) Corp.38Do The Right Things. 製程材料及製具設備 * FVI * 腳平面度檢查*Lead Scaner Camera Laser * 包裝* 紙箱* Dry Pack * 抗靜電袋 * 乾燥劑 * 溼度卡 FVI & Packing Assembly Process Defect of ball Mounting - Missing ball Unimicron Technology (SuZhou) Corp.39Do The Right Things. DoFu BGA vs. PBGA 差異差異：切割方式不同：切割方式不同； DoFu BGA (Sawing) ； PBGA (Punch) DoFu BGAPBGA DoFu Ball Grid ArrayPlastic Ball Grid Array Unimicron Technology (SuZhou) Corp.40Do The Right Things. Die Attach Material Unimicron Technology (SuZhou) Corp.41Do The Right Things. Function and Composition of Die Attach Material Functions Mechanical attachment of die to lead frame pad / substrate Heat transfer from die to lead frame / substrate Electrical contact from the die to the lead frame / substrate IngredientPurpose Resins 主體Adhesion Diluents 硬化劑Viscosity Control Curing Agents 加速劑Polymerization of Resin AcceleratorsPolymerization of Resin Fillers 1. 銀粉：導熱好, 但成本貴 1. SiO2 ( Silica )：導熱差, 但便宜 Control of Viscosity, CTE and Electical / Thermal Conductivity Unimicron Technology (SuZhou) Corp.42Do The Right Things. How to Choose a Suitable Die Attach Material Material selection consideration 1. Good dispensability 黏度黏度 2. Void free 空洞多空洞多, 表示含水氣表示含水氣 3. Good thermal conductivity for heat dissipation 散熱散熱 4. High adhesion strength 黏附力黏附力 5. Low stress ( stress 太高太高, 會產生會產生Warpage 膠材膠材 ) 6. Low moisture uptake 不吸水不吸水 7. Low ionic content 低鹵素低鹵素, 鹼性分子鹼性分子 8. Cure profile ( fast cure / snap cure ) Cure 愈快愈快, 應力愈大應力愈大 9. Work life 回溫時間約一天時間回溫時間約一天時間, 沒用完沒用完 , 即丟棄即丟棄 10. Low outgassing ( 跑出來的氣體跑出來的氣體 ,反沾回表面反沾回表面 ) 11. Low resin bleed out 暈開效果暈開效果 Unimicron Technology (SuZhou) Corp.43Do The Right Things. Good thermal conductivity 銀粉結晶結構銀粉結晶結構 - 片狀不規則結晶體片狀不規則結晶體 Silver flakes for electrical conductive die attach material Silica ( SiO2 )結晶結構結晶結構 - 球狀結晶體球狀結晶體 Spherical Silica for electrical non-conductive die attach material Unimicron Technology (SuZhou) Corp.44Do The Right Things. Factors of Die Attach Material to Reliability Controlled stress ：warpage and modulus Improved adhesion Reduced moisture absorption Moisture absorption Stress Adhesion Stress 低 , Tg低 Tg高 , 吸水性低 與 Tg有連帶關係 Unimicron Technology (SuZhou) Corp.45Do The Right Things. Stress Modulus Stress comes from CTE mis-match Lower adhesive modulus, lower stress Low Ionic Content Presence of Chloride, Potassium, and Sodium ions in conjunction with moisture may affect package reliability. Corrosion of circuitry and wirebond pads may be caused by ionically impure material. Modern semiconductor grade materials typically have less than 10 ppm chloride. Unimicron Technology (SuZhou) Corp.46Do The Right Things. Defect Mode Incomplete Fill 1. 與銀膠與銀膠 quality有關有關 2. 點膠量不夠點膠量不夠 SM Crack 通常發生在通常發生在PCT之後之後 ( 121 , 2個大氣壓力下個大氣壓力下) Unimicron Technology (SuZhou) Corp.47Do The Right Things. Wire Bonding Technology Unimicron Technology (SuZhou) Corp.48Do The Right Things. Bonding Sequence 1. 結金球結金球 2. First Bond 3. 凹弧形凹弧形4. Second Bond 5. 截斷金線截斷金線 Unimicron Technology (SuZhou) Corp.49Do The Right Things. Thermosonic Bonding Heat PBGA加熱溫度加熱溫度 130 150 Lead frame加熱溫度加熱溫度 210 Force Ultrasonic Energy 超音波能量超音波能量 Time Unimicron Technology (SuZhou) Corp.50Do The Right Things. Bond Wire Unimicron Technology (SuZhou) Corp.51Do The Right Things. Bond Wire Categories Gold wire Most popular Aluminum wire For wedge bond Copper wire Emerging for Cu pad IC 說明說明：COB ( Chip on Board ) Unimicron Technology (SuZhou) Corp.52Do The Right Things. Au Wire Categories Standard Package Thickness Standard Low loop High tensile / long loop strength Thin Packages Low Loop Unimicron Technology (SuZhou) Corp.53Do The Right Things. Au Wire Chemical Composition Dopants 1. Standard wire Beryllium dopant is used 2. Low loop Beryllium and Ca used by all PPM levels differ for thin PKG 3. High tensile strength Main Palladium 10% strength higher than others. 4. Long Loop wire All supplier uses different dopant. Dopants are proprietary of suppliers 5. Max content level ：usually Ag 30 ppm, Ca 30 ppm, and Be 10 ppm Unimicron Technology (SuZhou) Corp.54Do The Right Things. Epoxy Molding Compound Unimicron Technology (SuZhou) Corp.55Do The Right Things. Compounds of EMCs Used in Packages COMPONENTCONC.FUNCTIONTYPICAL AGENTS Epoxy resinMatrix ( 5% ) BinderCresol novolacs Curing agent 硬化劑 5%Linear / cross polymPhenols, amines, anhydrides, Accelerators 催化劑 Very low ( 0.2 0.3%)Initiate crosslinking Imidazoles, Amines ( N-, or P- compound ) Inert fillers 填充物 8090% Lower CTE, increase T.C.*, reduce M.A.*Ground fused silica Flame retardants 耐燃劑1%Retard flammabilityBrominated epoxies, Sb2O3 Mold release agents 脫模劑0.2 0.3%Aid in mold releaseSilicones, waxes, fluorocarbons Coloring agents0.2 0.4%Reduce photonic activityCarbon black Stress-relief additives 2 4% Inhibit crack propagation, reduce crack initiationSilicones, rubbers 說明說明: T.C: Thermal Conductivity M.A: Moisture Absorption Unimicron Technology (SuZhou) Corp.56Do The Right Things. Measurement of Compound Properties Flowability * Spiral Flow * Kokashiki Viscosity * Laboplasttmill Torque * Cone-Plate Viscometer Filling ability ( Gelled Particle ) * Acetone Insoluble Content Cureability * Gel Time * Curelastmeter Torque * Laboplastmill Stable time * Hot Hardness Unimicron Technology (SuZhou) Corp.57Do The Right Things. Spiral Flow / Flowability Mold Condition * Sample Powder * Mold Temp. 175 2 * Transfer Pressure 70 2 kg / cm2 * Cure Time 120 s * Cull Thickness 3.0 0.3 mm Measurement * Obtain the spiral flow value by measuring the length (cm) of the molded spiral tip. Unimicron Technology (SuZhou) Corp.58Do The Right Things. Gel Time / Cureability 1.熱盤溫度設定熱盤溫度設定 175 1 2.將將 2g 樣品放置熱盤中樣品放置熱盤中 3.樣品溶融開始計時樣品溶融開始計時， 並以刮杓成約並以刮杓成約 25度角磨動樣品度角磨動樣品 4.當硬化時刮杓與樣品剥離當硬化時刮杓與樣品剥離， 判定時間即為膠化時間判定時間即為膠化時間 UL-94 耐燃標準耐燃標準 V-0V-1V-2 焰滅時間 平均秒數( 10回 ) 5 sec以下25 sec以下25 sec以下 焰滅時間 最大秒數 10 sec以下30 sec以下30 sec以下 合計秒數( 10回 )50 sec以下250 sec以下250 sec以下 餘燼時間30 sec以下60 sec以下30 sec以下 滴下物不可著火不可著火不可著火 Unimicron Technology (SuZhou) Corp.59Do The Right Things. Vertical Burning Test for UL 94 Classification 20 1 mm Burner 6mm max 300 10 mm Specimen 10 1 mm Cotton 放棉花目的 : 看滴垂物是否會引起燃燒 Unimicron Technology (SuZhou) Corp.60Do The Right Things. Coefficient of Thermal Expansion 熱膨脹係數熱膨脹係數 Position Temp. Slope : 1 Slope : 2 Tg SamplePosition 1, 2 : Coefficient of thermal expansion (10-5 1 / ) Tg : Glass transition temp. ( ) Unimicron Technology (SuZhou) Corp.61Do The Right Things. Filler Fillers are used to control viscosity, improve strength, reducing shrinkage, coefficient of thermal expansion and water absorption. Advantages Reduced Shrinkage Improved Toughness Improved Abrasion Resistance Reduces Water Absorption Increased Thermal Conductivity Reduced Thermal Expansion Coefficient Disadvantages Increased Viscosity Machining Difficulties Increased Dielectric Constant Increased Weight Unimicron Technology (SuZhou) Corp.62Do The Right Things. Si O Crystalline silica 石英石英 ( 晶體晶體: 片狀片狀 ) Fused silica 玻璃結構玻璃結構 ( 晶體晶體: 圓球圓球 ) Unimicron Technology (SuZhou) Corp.63Do The Right Things. Flip Chip Key Technologies Flip Chip & Bumping Technology Flip Chip Assembly Bumping Technology HDI / Build-up Substrate Flip Chip 是一個技術是一個技術， 不是一個不是一個 Package Unimicron Technology (SuZhou) Corp.64Do The Right Things. Technology vs. Package Flip Chip is an interconnect technology, not a specific package type FC CSP FC MLF FC PBGA FC LBGA Super FC Stacked fcCSP Unimicron Technology (SuZhou) Corp.65Do The Right Things. 主要覆晶封裝生產地區優劣比較主要覆晶封裝生產地區優劣比較 0203年年 0405年年 日本日本75%52%高 1. IDM的 in House 需求、提供廣大的內 需市場 2. 週邊原物料、設備、製程技術領先 3. 新應用市場開發速度快 台灣台灣16%38%中高 1. 半導體產業結構完整 2. 價格低 3. 交期快 韓國韓國7%8%中高 1. TFT-LCD、Communication、DREM等 電子產業強大 2. 來自Amkor及ChiPAC的內需封裝優勢 3. Cost Down 能力強 市占率市占率 地區地區技術等級技術等級優勢優勢 Source : 2006.02.13電子時報 Unimicron Technology (SuZhou) Corp.66Do The Right Things. Source : 2006.02.13電子時報 全球覆晶基板供需預估全球覆晶基板供需預估 單位: 百萬顆 供給預估供給預估2005年年2006年年2007年年2008年年 南亞電路南亞電路139201215215 全懋全懋4872811
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