JEDEC工业标准.doc

JEDEC工业标准环境应力试验JDa1JESD22-A100-BCycled Temperature-Humidity-Bias Life Test上电温湿度循环寿命试验, (Revision of JESD22-A100-A) April 2000 Text-jd001JDa2JESD22-A101-BSteady State Temperature Humidity Bias Life Test上电温湿度稳态寿命试验, (Revision of JESD22-A101-A) April 1997 Text-jd002JDa3JESD22-A102-CAccelerated Moisture Resistance -Unbiased Autoclave高加速蒸煮试验, (Revision of JESD22-A102-B) December 2000 Text-jd003JDa4JESD22-A103-ATest Method A103-A High Temperature Storage Life高温储存寿命试验, (Revision of Test Method A103 Previously Published in JESD22-B) July 1989 Text-jd004JDa5JESD22-A103-BHigh Temperature Storage Life高温储存寿命试验, (Revision of JESD22-A103-A) August 2001 Text-jd005JDa6JESD22-A104-BTemperature Cycling温度循环, (Revision of JESD22-A104-A) July 2000 (参见更新版本A104C) Text-jd006JDa7EIA/JESD22-A105-BTest Method A105-B Power and Temperature Cycling上电和温度循环, (Revision of Test Method A105-A) February 1996 Text-jd007JDa8JESD22-A106-ATest Method A106-A Thermal Shock热冲击, (Revision of Test Method A106-Previously Published in JESD22-B) April 1995 Text-jd008JDa9JESD22-A107-ASalt Atmosphere盐雾试验, (Revision of Test Method A107-Previously Published in JESD22-B) December 1989 Text-jd009JDa10JESD22-A108-BTemperature, Bias, and Operating Life高温环境条件下的工作寿命试验, (Revision of JESD22-A108-A) December 2000JDa11JESD22-A110-BTest Method A110-B Highly-Accelerated Temperature and Humidity Stress Test (HAST)高加速寿命试验, (Revision of Test Method A110-A)February 1999 Text-jd010JDa12JESD22-A113-BPreconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing非密封表贴器件在可靠性试验以前的预处理, (Revision of Test Method A113-A) March 1999 Text-jd011JDa13JESD22-A118Accelerated Moisture Resistance - Unbiased HAST不上电的高加速湿气渗透试验, December 2000 Text-jd012JDa14JESD22-B106-BTest Method B106-B Resistance to Soldering Temperature for Through-Hole Mounted Devices插接器件的抗焊接温度试验, (Revision of Test Method B106-A) February 1999 Text-jd013JDa15EIA/JESD47Stress-Test-Driven Qualification of Integrated Circuits集成电路施加应力的产品验收试验, July 1995 Text-jd031JDa1JESD22-A104CTemperature Cycling, (Revision of JESD22-A104-B) May 2005 Text-jd040电应力和电测试试验JDb1JESD22-A114-BElectrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM)人体模型条件下的静电放电敏感度试验, (Revision of JESD22-A114-A) June 2000 Text-jd014JDb2EIA/JESD22-A115-AElectrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM)机器模型条件下的静电放电敏感度试验, (Revision of EIA/JESD22-A115) October 1997 Text-jd015JDb3JESD22-A117Electrically Erasable Programmable ROM (EEPROM) Program/Erase Endurance and Data Retention Test EEPROM的擦涂和数据保存试验, January 2000 Text-jd016JDb4EIA/JESD78IC Latch-Up Test集成电路器件闩锁试验, March 1997 Text-jd017JDb5JESD22-C101-AField-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components微电子器件在电荷感应模型条件下的抗静电放电试验, (Revision of JESD22-C101) June 2000 Text-jd018机械应力试验JDc1JESD-22-B103-ATest Method B103-A Vibration, Variable Frequency振动和扫频试验(Revision of Test Method B103 Previously Published in JESD22-B) July 1989Text-jd019JDc2JESD22-B104-ATest Method B104-A Mechanical Shock机械冲击(Revision of Test Method B104, Previously Published in JEDEC Standard No.22-B) September 1990 Text-jd020JDc3EIA/JESD22-B116Wire Bond Shear Test Method焊线邦定的剪切试验方法, July 1998 Text-jd021JDc4JESD22-B117BGA Ball Shear BGA焊球的剪切试验, July 2000 Text-jd022JDc5JESD22B113Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products, March 2006 Text-jd038JDc6JESD22-B111Board Level Drop Test Method of Components for Handheld Electronic Products, July 2003 Text-jd039综合试验与测试JDd1JEDEC Standard No.22-A109Test Method A109 Hermeticity密封性试验, July 1988 Text-jd023JDd2JESD22-A120Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Integrated Circuits集成电路器件中使用的有机材料水分扩散和水溶性测定试验方法, June 2001 Text-jd024JDd3JESD22-B100-APhysical Dimensions物理尺寸的测量, (Revision of Test Method B100-Previously Published in JESD22-B) April 1990 Text-jd025JDd4JESD22-B101Test Method B101 External Visual外观检查, (Previously published in JESD22-B) September 1987 Text-jd026JDd5EIA/JESD22-B102-CSolderability Test Method可焊性试验方法,September 1998 Text-jd027JDd6EIA/JESD22-B105-BTest Method B105-B Lead Integrity器件管脚的完整性试验, (Revision of Test Method B105-A) January 1999 Text-jd028JDd7EIA/JESD22-B107-ATest Method B107-A Marking Permanency图标的耐久性试验, (Revision of Test Method B107-Previously Published in JESD22-B) September 1995 Text-jd029JDd8JESD22-B108Coplanarity Test for Surface-Mount Semiconductor Devices表贴半导体器件的共面性试验, November 1991 Text-jd030其它JDe1JEP113-BSymbol and Labels for Moisture-Sensitive Devices湿度敏感器件的符号和标识, (Revision of JEP113-A) May 1999 Text-jd032JDe2EIA/JEP122Failure Mechanisms and Models for Silicon Semiconductors Devices硅半导体器件的失效机理和模型, February 1996 Text-jd033JDe3IPC/JEDEC J-STD-020AMoisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices针对非密封表贴半导体器件的湿度/回流焊敏感度分类和级别, April 1999 Text-jd034JDe4IPC/JEDEC J-STD-033Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices湿度/回流焊敏感标贴器件的处理、包装、运输和使用的标准, May 1999Text-jd035JDe5EIA/JEP103-ASuggested Product-Documentation Classifications and Disclaimers, (Revision of JEP103) July 1996 Text-jd036JDe6IPC/JEDEC J-STD-020D.1Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices针对非密封表贴半导体器件的湿度/回流焊敏感度分类和级别, Supersedes IPC/JEDEC J-STD-020D August 2007, March 2008 Text-jd037