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缩写全称中文CALCalibration仪教CLChemical Laboratory化验室FVFinal Visual Inspection最终目视检验CQECustomer Quality Engineer客服工程师IPQCIn Process Quality Control制程品质管控IQCIncoming Quality Control进料品质管控OQCOutgoing Quality Control出货品质管控OQAOutgoing Quality Assurance出货品质保证QAQuality Assurance品质保证部REL LABReliability Laboratory信赖性实验室QMSQuality Management System品质管理系统VQAVendor Quality Assurance供应商品质保证SQESupplier Quality Engineer供应商品质工程师MISManagement Information System管理信息系统DCCDocument Control Center文管中心HRHuman Resources人力资源部FIFinance财务部MKTMarketing市场营销部PURPurchasing采购部MAINMaintenance维护部GMGeneral Manager总经理GMGeneral Motors通用汽车VPVice President副总CEOChief Execution Office执行总裁/首席执行官CFOChief Financial Officer财务总监WTWaste Treatment废水处理部PPEPre-production Engineering试生产部TDTechnology Development技术开发部缩写全称中文R&DResearch&Development研发部PEProcess Engineering工程部PCProduction Control生管部TSTraffic&Shipping海关货运部ETElectrical Test电性测试ENIGElectroless Nickel and Immersion Gold化学镍金AOIAutomated Optical Inspection自动光学检测B/OBlack Oxide黑氧化HASLHot Air Soldering Level热风整平/喷锡PTHPlated Through Hole镀通孔DFDry Film干膜DESDevelop, Etch &Stripping显影,蚀刻,除胶EHSEnvironment Health&Safety环境保护部DPDirect Plating直接电镀B/FBond Film/Brown Oxide棕化I/LInner Layer内层线路O/LOuter Layer外层线路S/MSolder Mask防焊P/PPattern Plating图形电镀LCDLiquid Crystal Display液晶显视器2nd ESecond Exposure二次曝光NCNumerically Controlled数控钻孔二.其它缩略语缩写全称中文QCQuality Control品质管控QMQuality Manual品质手册CIPContinuous Improvement Project持续改善项目CPControl Plan控制计划缩写全称中文ICDInterconnection Defect内连缺陷问题RPNRisk Priority Number风险优先顺序APQPAdvanced Product Quality Plan先期产品品质计划PPAPProduction Part Approval Procedure生产零部件核准程序AQLAcceptable Quality Level品质允收水准AVLApproved Vendor List合格供应商清单CPKProcess Capability Index制程能力指数FMEAFailure Mode And Effect Analysis失效模式与效应分析IPCThe Institute For Interconnection&美国电子电路互连及Packaging Electronic Circuits封装协会ISOInternational Organization for 国际标准化组织Standardization/International Standard OrganizationJITJust In Time及时MPIManufacturing Process Instruction制程作业说明书SOPStandard Operation Procedure标准操作规范SPCStatistical Process Control统计制程管制6 6 Sigma6个标准差CPCAChina Printed Circuit Association中国印刷电路板协会TPCATaiwan Printed Circuit Association台湾印刷电路板协会JPCAJapan Printed Circuit Association日本印刷电路板协会R&RRepeatability & Re-productivity重复性&再现性A/WArtwork底片OPOperation Instruction操作说明IPAIsopropyl Alcohol异丙醇ICIonic Contamination离子污染度ICIntegrated Circuit集成电路BGABall Grid Array球形栅格阵列缩写全称中文AAAtomic Absorption Spectrophotometer原子吸收光谱仪CVSCyclic Voltametric Stripping循环伏安剥离分析仪ICIon Chromatography离子液相色谱OGPOptical Gauging Products光学计量器/三次元OTDOn Time Delivery按时交货QPQuality Procedure品质程序文件R.CResin Content胶含量R.FResin Flow胶流量SEMScanning Electronic Microscope扫描电子显微镜PPPrepreg预浸材料/半固化片ACCAccept接受REJReject拒收CARCorrective Action Request改善措施报告R/WRework重工MRBMaterial Review Board需确认之问题板SPECSpecification规格A/RAction Required待办事项SMDSurface Mount Device表面贴装装置WIPWork In Process在制品HDIHigh Density Interconnecting高密度互连UVUltraviolet Spectrophotometer紫外光分光光度计CDACompressed and Dried Air压缩气CTCooling Tower冷却塔CT WaterCity Water市水/自来水DBDistribution Board配电屏DI WaterDe-ionized Water去离子水FWFiltered Water过滤水M/CMachine机台缩写全称中文PCBPrinted Circuit Board/Profit Come Back印刷线路板/利润到来SSBSingle-sided Printed Board单面印制板DSBDouble-sided Printed Board双面印制板MLBMultilayer Printed Circuit Board多层线路印制板RO WaterReverse Osmosis Water反渗透水ROFReverse Osmosis Filter反渗透过滤器SWSoft Water软水TEMPTemperature温度TPMTotal Preventive Maintenance总体预防性维护A/RAccount Receivable应收款项A/PAccount Payable应付款项CARCapital Acquisition Request 资金获得申请DMDirect Material直接物料IDMIndirect Material间接物料FIFinance Module财务模块P&LProfit&Loss盈亏PBTProfit Before Tax税前利润COCosting Module(SAP)成本模块OSOutstanding杰出ERExceed Improvement优秀MRMeet Requirement良好NINeed Improvement待改进UAUnacceptable不可接受ASAPAs Soon As Possible尽可能快地D/CDate Code周期DOEDesign of Experiment实验设计ERPEnterprise Resource Planning企业资源规划KPIKey Performance Index主要绩效指标缩写全称中文MCSManagement Control System管理控制系统MRMaterial Request物料申请PCBAPrinted Circuit Board Assembly电路板组装P/NPart Number板号/料号POPurchase Order采购单P&PPick&Place贴片机PRPurchase Requisition采购申请SMTSurface Mount Technology表面贴装技术S/OSales Order业务单/销售单V/OVariation Order变异单F/OFacility Order工厂号NPTHNon-plated Through Hole非导通孔EDSEngineering Date Sheet工程数据单ECNEngineering Change Notice工程变更单PCB/PWBPrinted Circuit Board/Pinted Wiring Board印刷电路板MCPMetallization Continuous Plating垂直连续电镀D/SDouble Side双面板D/ODelivery Order送货单RCCResin Coated Copper背胶铜箔QFPQuarter Flat Pad四方形焊盘MSAMeasurement System Analysis量测系统分析MLBMultilayer Printed Board多层印制板CCLCopper-clad Laminate覆铜板PTFEPolytetrafluoethylene聚四氟乙稀BCSButyl Cellosolve Solvent防白水KLMKey Line Manager主要负责人BUMBuild-up Multilayer积层法多层板DSCDifferential Scanning Calorimetry微差扫描热卡分析法缩写全称中文DMADynamic Mechanical Analysis动态力分析法IAInformation Appliance信息家电LPSMLiquid Photoimagible Solder Mask液态感光油墨PGAPin Grid Array针栅阵列PBGAPlastic-BGA塑料球栅阵列STHSiler Through Hole银胶贯孔TGAThermo Gravimetric Analysis热重量分析法RHRelative Humidity相对湿度三.PCB一般用语英文中文Marking标记Void空洞Fiducial Pad基准焊垫Package包装Shipping货运Warpage / Bow and Twist板弯板翘Via Hole导通孔(小于20mil)Plug Hole堵孔Annular Ring孔环Slot hole槽孔Traveler流程单Buy Off抽检Develop显影Legend文字Gold Potassium Cyanide金盐Routing铣切Silver银英文中文Gold金OSP(Organic Solderability Preservative)有机保护膜Line Width线宽Line Space线间距Board Thickness板厚Hole Size孔径Trace线路Drilling钻孔Impedance阻抗Bar Code条形码Acid Clean酸洗De-warpage板弯翘反直/矫正Master Drawing蓝图Defect缺陷Hot Air Repaid Drying Oven快速烘箱Carton箱子Blind Via盲孔Copper Foil铜箔Tolerance公差X-Out打叉Customer客户Pin Gauge量规/针规/塞规Soldering Iron电烙铁Solderability Test焊锡性实验Final Finish表面处理Warehouse仓库Wicking渗镀/灯芯效应Laser Hole镭射孔英文中文Shipping Buy-off出货抽检Film Adhesive粘结膜Warehouse仓库Au Seepage金渗镀Laser Hole镭射孔Vertical Desmear垂直除胶渣Shipping Buy-off出货抽检Scrapped Board报废板Audit稽核Stamping冲压C=0 Sampling Plan零缺陷抽样计划Lay up&Press叠合&压合Touch up/Repair修补Smear Residue胶渣残留Immersion Silver沉银10X Eye Lupe10X放大镜Tape Test胶带试验Conditional Accept有条件允收Quarantine隔离Stop Shipping停止出货On Hold暂扣Stamp印章Tooling Hole定位孔Component Hole元件孔Mounting Hole安装孔Production产品Test Board测试板Conductor导线英文中文X-Section/Microsectioning切片Fisrst Article Inspection首件/初片检查Final Cure最后烘烤Rigid Printed Board刚性印制板Build-up Multiplayer Printed Board积层多层印制板Flexible Printed Board挠性印制一路板Mother Board/Mouse Bite母板Daughter Board子板Back Plane Board背板Bare Board裸板Cable电缆Interconnection互连Transmission Line传输线Substrate基底Conductive Pattern导电图形Non-conductive Pattern非导电图形Base Material基板Laminate层压板Composite Laminate复合层压板Thin Laminate薄层压板Bonding Sheet粘结片Stiffener Material增强板材Epoxy Resin环氧树脂Round Pad圆形盘Glass Fiber玻璃布Yarn纱线Filament单丝Weft Yarn纬纱英文中文Warp Yarn经纱Wasp-wise经向Split裂缝Rework Simulation模拟重工Square Pad方形盘Diamond Pad棱形盘Oblong Pad长方形焊盘Supportd Hole支撑孔Buried Via Hole埋孔Buried/Blind Via埋/盲孔Check List点检表Hole Location孔位Hole Density孔密度Hole Pattern孔图Datum Reference参考基准Acceleration速化反应Integrity完整性Accuracy准确度Acrylic亚克力Blow Hole吹孔Bare Chip Assembly裸体芯片组装Bond Strength结合强度Bondability结合性Bonding Wire结合线Breakaway Panel可断拼板Breakdown Voltage崩溃电压/击穿电压Burr毛头/毛刺Chemical Resistance抗化学性英文中文Chip芯片Alcohol酒精Moisture And Insulation Resistance湿气与绝缘电阻Core Board芯片/核心核Deburing去毛刺Dent凹陷Deposition沉积/储蓄Desmear除胶渣Dielectric Breakdown介质崩溃Dielectric Constant介质常数Dimensional Stability尺寸稳定性Drill Facet钻尖切削面Edge-Board Connector板边连接器Edge-Board Contace板边插头Negative Etchback反回蚀Electroless Deposition化学镀/无电镀Etchback回蚀Etch Factor蚀刻因子Etching Resist抗蚀刻Gel Time凝胶时间Gelation Particle凝胶点Holding Time停留时间Hole Wall Breakout孔偏破Hole Density孔密度Hole Void孔壁空洞Hull Cell哈氏槽Imaging成像Logo标识英文中文Leakage Current漏电流Lifted Land焊垫浮起Measling白点/白斑Minimum Annular Ring最小环宽Laser Ablation镭射烧孔General Requirement概述性要求Nodule节瘤Non-wetting不沾银Nylon尼龙Outgassing出气Outgrowth侧出Over Potential过电位Panel Plating全板电镀Peel Strength剥离强度Permittivity介电常数Porosity Test孔隙度试验Pattern Plating图形电镀Quality Conformance Test品质符合试验Registration对准度Resist阻剂Resolution解像Reverse Image片影像Ring套环Scratch刮伤Shadowing阴影Solder Connection焊点Solder Paste锡膏Resin Recession树脂内缩英文中文Solid Content固体含量Spray Coating喷射涂装Stripper玻璃液Thermal Conductivity导热率Thermal Shock Test热冲击试验Tin Indicated浸锡V-CutV型切槽Vacuum Evaration(or Deposition)真空镀膜法Varnish树脂漆Voltage Breakdown击穿电压Weave Exposure织纹显露Weave Texture织纹隐现Wedge Void楔形空洞Wetting/Non-wetting沾锡/不沾锡Wicking灯芯效应/渗镀四.常见PCB不良用语Layer to Layer Shift层间移位Line Width Over Size线条过宽Line Width Under Size线条过窄Open/Short断/短路Core to Core Shift片与片移位Nick缺口Pin Hole针孔Over Etch蚀刻过度Under Etch蚀刻不足Pad Under Size焊盘尺寸小于标准Ionic Contamination Fail离子污染度不合格Acid Test Fail酸洗测试不合格英文中文B-Stage Over SpecB-Stage 过厚Delamination分层/爆板Rough Edge板边粗糙Wrinkle折皱Wrong Lay Up内层放反Finger Print手指印Shift Hole孔偏移Blocked Hole孔堵Hole Under/Over Size孔尺寸过大/过小Missing Hole漏钻孔Tape Residue残胶Rough Hole孔粗糙Not Through Hole孔未钻透Hole Breakout孔破Laser Shift镭射孔偏移Extra Hole多孔Oxidation氧化Pitting针点Void In Hole孔内空洞Void On PadPAD空洞Film Breakdown膜破Under Develop显影未尽Expose Copper/Nickel露铜/镍Poor Vacuum抽真空不良Epoxy Smear去毛刺未净Nail Heading钉头Crack龟裂Post Separation内层断开英文中文Damaged Hole孔损坏Smear Residue胶渣残留Burnt Plating电镀烧焦Pink Ring粉红圈S/M On Pad油墨上PADS/M Shift油墨偏移S/M Vacuum抽真空不良S/M Skip油墨未印下S/M Lump积墨S/M In Hole孔内油墨S/M Bubble油墨气泡Stain肮脏Poor Rework重工不良Over Baking烘烤过度Foreign Material/Inclusions外来杂物Peelable Ink On Pad可剥胶上PADLegend Shift文字偏移Illegible Legend文字不清Legend On Surface板面沾白漆Excess Legend多余的文字Carbon Expose Cu碳油墨露铜Carbon Short/Open/Smear/Skip碳油墨短/断路/散开/遗漏Under Plug Hole堵孔不足Plughole Crack堵孔裂开Missing Solder漏镀锡Solder Lump焊锡短路Rough Solder焊锡隆起T/L On Trace锡面粗糙英文中文T/L In Trace焊锡上线条T/L In Via Hole孔内沾锡Block Hole堵孔Poor Solderability焊锡性不良Discolor变色Au Seepage金渗镀Au Peeling金脱落Tarnish金面发黄Scratch刮伤Rough Edge板边粗糙Burr毛刺Pit/Dent凹点/凹陷Oxidation氧化Material Damage材料损坏Lifted Feature导体翘起Foreign Material杂质Pad UndersizedPAD尺寸不够Pad MissingPAD丢失Pad DamagedPAD破损PTH Void镀通孔空洞No Punch Outs Allowed冲型不良Dewetting拒锡Solder Dull锡面发白Skip Plate跳镀Gold on Feature板面沾金Gold Blush金面发红Nickel Exposed 露镍Nickel Adhesion 镍脱落英文中文Gold Scratch金面刮伤Feathering导体桥接Incomplete Solder Strip 剥锡不净Plating Double重镀Plating Crack龟裂Plating Nodule 电镀颗粒Tent Broken二次孔膜破Incomplete Resist Strip剥膜不净ET Stamp WrongET章错误ET Stamp Missing漏ET章ET Stamp IllegibleET章模糊IL Registration内层偏位IL copper Exposed内层露铜Copper Exposed露铜Delamination分层Legend Missing文字漏印Reduced Aperture防焊圈缩小Hole Breakout孔破Hole Extra多孔S/M on PAD油墨上PADDate Code Wrong周期错误Date Code Missing缺少周期Slot Missing漏开槽Resin Starvation缺胶Laminate Void压合空洞Resin Flow胶流量Foil Wrinkle铜箔皱折Core Wrong叠构错误英文中文Pink Ring粉红圈Solt Shape槽孔变形Hole Plugged孔塞Hole Partial孔未钻透Wrong Surface Finish表面处理错误Arrow Left标签残留Solderability Test焊锡性测试Laminate Discolored压合异色Measling白点Peelable Not Removed可剥胶残留Flex Copper Wrinkle软铜箔收缩Flex Cores Stuck Together软基材粘结Interconnection Defect内连缺陷OSP Incomplete Coverage有机保护膜不完整五其它英文中文Tensile Strength抗拉强度Ultra Violet Curing紫外线硬度Surface Mounting Technology表面贴装技术Glass Fiber玻璃纤维Glass Fabric玻璃布Split裂缝Electrodeposited Copper Foil电解铜箔Rolled Copper Foil压延铜箔Computer-Aided Design.计算机辅助设计Computer-Aided Manufacturing计算机辅助制造Computer Controlled Display计算机控制设计Design Origin设计原点英文中文Logic Circuit逻辑电路Engineering Drawing工程图Separated Layer分层Solder Connection焊接点Rigid - Flex Printed Board软硬结合板Wave Soldering波峰焊Solder Paste锡膏Hole Location孔位Bond Strength粘合强度Fiducial Mark基准点Glass Transition Temperature玻璃态转换温度Peeling Strength Test 剥离强度实验Tensile Strength Test 抗张强度实验Elongation Test延展性实验Salt Spray Test 盐雾实验Whisker Test锡须测试ROHS 限制有害物质使用WEEE废旧电子电气设备回收利用Humidity storage Test湿度储藏测试Ionizable Detection Of Surface Contaminants表面离子测试Water Absorption.吸水性E-Corrosion Testing 电腐蚀测试Dielectric Withstanding Voltage耐电压测试Hot Storage Test高温储藏测试Thermal shock test热冲击测试Moisture&Insulation Test湿度缘测式Rework Simulation模拟重工测式
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