目视检验规范IPC.ppt

目視檢驗規范IPC610 IPQC RUI_LI 2010/1/20,目視檢驗規范標准IPC610,1.允收標准 2.拒收標准,零件本體僅下方有二接觸點的零件 (Chip Components/Bottom Only Terminations cont.) 偏移 (Shift),零件本體有1,3,5面矩形金屬焊接點 (Rectangular End Components-1,3or5 side Termination) 偏移 (Shift),零件本體有1,3,5面矩形接觸點 (Rectangular End Components-1,3or5 side Termination) 偏移 (Shift),圓柱體零件 (Cylindrical End Cap Termination) 偏移 (Shift),無導腳零件 (Leadless Chip Carriers with Castellated Terminations) 偏移 (Shift),平緞腳 (L型) / 鷗翼腳 /圓柱L腳 (Flat Ribbon “L“ / Gull Wing leads / Round leads) 偏移 (Shift),“I“ 腳 (“I” Leads) 偏移 (Shift),範例 (Example) - 平緞腳 (L型) / 鷗翼腳 /圓柱L腳 (Flat Ribbon “L“ / Gull Wing leads / Round leads),允收 (Target Condition),允收極限 (Acceptable),拒收 (Nonconforming Defect),範例 (Example) - 平緞腳 (L型) / 鷗翼腳 /圓柱L腳 (Flat Ribbon “L“ / Gull Wing leads / Round leads),拒收 (Nonconforming Defect),拒收 (Nonconforming Defect),拒收 (Nonconforming Defect),範例 (Example) - “J“ 腳 / “I“ 腳,允收極限 (Acceptable),拒收 (Nonconforming Defect),拒收 (Nonconforming Defect) ,範例 (Example),拒收 (Nonconforming Defect),高翹 / LIFTED,範例 (Example),高翹 / LIFTED,OK,NG,範例 (Example),拒收 (Nonconforming Defect),折腳 / BENT,缺件 / MISSING,偏移 / SHIFT,範例 (Example),拒收 (Nonconforming Defect),破損 / DAMAGE,範例 (Example),拒收 (Nonconforming Defect),撞件 / BROKEN ,撞件 / BROKEN ,範例 (Example),允收極限 (Acceptable),偏移 / SHIFT ,錫洞 / Solder Hole ,範例 (Example),ASR1 : LED2 反向 / REVERSE,拒收 (Nonconforming Defect) ,缺口端為負極 / Nick side is “ ”,5168 : SW4 反向 / REVERSE,Switch數字與PCBA同向 / Number on component same direction with PCBA.,範例 (Example), 折腳 / PIN BENT,包焊 / Poor Solder,拒收 (Nonconforming Defect),範例 (Example),拒收 (Nonconforming Defect),NG,OK, 退PIN,Travis M/B DIP component cosmetic,1,整体高翘，且最大不可以超过0.3mm 2.后邊、前邊緣高翹不可超過0.2mm,整體高翹,單邊高翹,Travis M/B DIP component cosmetic,1.水平高翘，最大允许限度为0.3mm. 2.不允许單边高翘。,Travis base sample,RAM 的卡勾不可出现变形等不良。,Travis M/B DIP component cosmetic,不能出现任何标记,特别是有铅异物。,不能出现任何标记,特别是有铅异物。,Travis M/B DIP component cosmetic,JUSB 不可出现气泡和明显擦痕 .,Travis base sample,Microphone 不能失掉海绵，禁止使用双面胶黏贴脱落海绵。,Travis M/B solder hole,JDOCK 不允許單邊高翹,Travis base sample,1.Function Pin 吃锡量不应少于75%. 2.固定pin锡量不应少于50%.（以固定住零件为标准） 3.折脚 （1）:如果pin 折脚但是有露出，function 測試pass 可以判断为良品。 (2) 如果pin脚完全没有露出，则要判断为不良。,固定pin,Function pin,Travis base sample,pin 脚不可刺穿该处Mylar,Travis base sample,Smart card socket 不可出现大幅度凹陷变形。,Travis base sample,JSIO , JCRT 等零件不可出现沾锡等不良, PBATT late solder can be accept 。,THE END,