smt 常用术语

SMTSMT術術語語培培訓訓教教材材1空焊零件腳或引線腳錫錫墊間沒有錫或其他因素造成沒有接合float soldering Spare parts feet or lead has tin or othere factors with tin mat to result into has coalescence.2假焊假焊之現象與空焊類似,但其錫墊之錫量太少,低與接合面標準.false soldering The phenomenon of the false solder with empty solder similar,but the tin deal of its tin mat istoo little,bottom and coalescence standard.3冷焊錫或錫膏在回風爐氣化後,在錫墊上仍有目模湖的粒狀附著物cold soldering Solder or solder paste still have the misty a form attachment on the thin mat after returningreflow oven vaporization.4橋接有腳零件在腳與腳之間被多與之焊錫所連接短路,另一種現象則因檢驗人員使用鑷子等操作不當而導致腳輿腳碰觸短路,亦或刮CHIPS腳造成殘餘錫渣使腳輿腳短路bridging There is feet spare parts in the feet and the feet wars touched the sport circuit by the feet thatsoldering connect short circuit,another phenomenon then because of examining persounel usagethe forceps,operation not appropriate but cause feet with of the surplus,or pare off the feet chipsresult in remaining tin splash makes lead and lead short circuit.5錯件 零件放置之規格或種類與作業規定或BOM,ECN不符者,即為錯件.error material The spare parts places its specification or categories out of accordance with homework provisionorBOM,ECN,namely for the piece of mistake6缺件應放置之零件位址,因不正常之緣故而產生空缺lack componentShould place the address of the spare parts,because of falsely often it cause but the creationgets empty to lack7極性反向極性方位與加工工程樣品裝配不一樣,即為極性錯誤.polarity inversion The pole direction accuracy is different from process the engineering sample assemble,namely for pole mistake.8零件倒置smt至零件不得倒置,另cr因底部全白無規格表示,雖無極性也不可倒置.the spare parts setsupside downThe spare part of the cannot set upside down,another the Cr chas no specification to mean becauseof the bottm whole white,although the limitless also cant dump to place.9零件偏移 smt所有零件表面接著焊點與pad位偏移不可超過面積the spare parts ispartial toSMT all spare parts surface immediately after the soldered joint is partial to with ofPAD to move cant over 1/2 area10錫墊損傷 pad在正常制程中,經過回焊爐熔接時,不能損傷錫墊,一般錫墊損傷之原因,為修補時使用烙鐵不當導致錫墊被破壞輕者可修復判定出貨,嚴重者列入次級品,或移植報廢不當導致錫墊被破壞,輕者可修復正常出貨,嚴重者列入次級品判定,亦或移植報廢the solder dish hurtsThe PAD passes by back in normal manufacturing process when the reflow solder,cant hurt the PAD,general the reason of the PAD harn,for repair the usage hotirons the not appropriate causing tin bolster broken,light can repair the normalshipment,serious be includede in the time class article judge,or the transplantationdiscards.11污染不潔smt加工作業不良,造成機板面不潔或chips腳與腳之間附有異物,或chips修補不良,有點膠,防焊點沾漆均視為不良品,但修補品可視情節列入次級品判定.沾漆均視為不合格品.但修補品可視情形列入次級品判定.apprearance defectThe SMT processes the operation bad,result in the plank do not sweep or the feet ofchips and feet a fish eye foreign body,or the chips repairs bad,have a little the gum anddefend the solder order to be stained with the paint to all see as unqualified,butmaintain the article can see the feeling row or column to judge into the time class.12smt爆板pc板在經過回焊爐高溫時,引板子本身材質不良或回焊爐溫度異常,造成板子銅箔起泡或白斑現象屬不良品explode the boardThe PCBat passes by to return to the head of reflow because of plank son oneself themeterial is bad or return to the temperture of the reflow abnormality,result in the plankson rises bubble or white spot phenomenons belong to inferior goods13包焊焊點焊錫過多,看不到零件腳或其輪廓者excessive solder The soldering orders the soldering excessive,cant see spare parts lead or its outlines.14錫球,錫渣PCB板表面附著多余的焊錫球,錫渣,一律拒收.solder balls,solder splashThe machine plank surface attaches the surplus solder balls,solder spash refusingto accept all15異 物殘腳.鐵屑.訂書針等粘附板面上或卡在零件腳間,一律拒收foreign body16 污染 pollution 嚴重之不潔,如零件焊錫污染氧化,板面殘余松香未清除,清洗不注意使CHIPS污染氧化及清洗不潔.(例如SLOT槽不潔,SIMM 不潔,板面CHIP或SLOT旁不潔,SLOT內側上附有許多微小錫粒,PC板表面水紋等)現象,則不予允收17蹺皮輿零件腳相關之接墊不得有超過10%以上之裂隙,無關之接墊輿銅箔線路不得有超過25%以上key press partoxidation之裂隙 Have nothing to do with related PAD infect in spare parts cannot overabove cracking10%,with PAD and copper circuit cannot over 25%above crack18板彎變形板子彎曲變形超過板子對角長度0.5%以上者,則判定拒收the machineplanktransforms The plank sub flection transforms to exceed the plank sub opposite anglelength 0.5%is above,then judge to refuse to accept19撞角,板傷不正常緣故產生之板子損傷,若修復良好可以以合格品允收,否則列入次級品判定20dip爆板PC板在經過DIP高溫時,因PC板本身材質不良或錫爐焊點溫度過高,造成PC板離层起泡或白斑現象則屬不良品21跪腳CACHE RAM,K/B B10S等零件PIN打折形成跪腳bent the lead 22浮件 float 零件依規定須插到底(平貼)或定位孔,浮件判定標准為SLOT,SIMM浮高不得超過0.5mm,傳統零件以不超過1.59mm為宜The component must be even to stick according to the provision the PCB floats the hightjudging the standard SLOT,SIMM cannot over 0.5mm.other component cannot over 1.59mm23刮傷 scoring注意PC板堆積防護不當或重工防護不當產生刮傷問題24PCB 異色因回流焊造成板子顏色變暗或因烘烤不當變黃,變黑均不予以允收.但視情形可列入次級品判定pcb changecountenance允收25修補不良修补線路未平貼基板或修补線路未作防焊處理,依或有焊點殘餘松香未清理者repair failure26實體 object 看到的或可以想到的事物Anything perceivable or con ceivable27過程 process將輸入转化為輸出的一組彼此相關的資料和活動.system of activities,whitch use resources to transform inputs into outputs28 程序 procedure 為進行某項活動所規定的途徑.在許多情況下,程序可行成文件,或者可為文件書.(如:質量體系程序).程序形成文件時,通常成之為書面程序或文件化程序.書面或文件化程序中通常包括活動的目的和範圍.即:5W2HSpecified way to perform an activity;In many cases,procedures are documented E.G qualitymanagement system procedures;When a procedure is documented,the termwritten procedureordocumented procedure is frequentiy used;A written or document procedure typically contains thepurposes and scope of an activity.29 檢驗 inspection 通過觀察和判斷必要時結合測量試驗或估計所進行的符合性評价conformity evalution by observation and judgement accompanied as appropriate bymeasurement,testing or gauging.30合格 conformity 滿足規定的要求fulfilment of a requirement 31不合格沒有滿足規定的要求nonconformity nonfulfilment of a requirement 32缺陷 defect沒有滿足某個預期的使用要求或合理的期望nonfulfilment of a requirement related to an intended usage33質量要求對需要表述或需要轉化為一組針對實體特性的定量或定性的規定要求,以使其實現並進行考核quality requirementa.質量要求應全面反映顧客明確和隱含的需要b.要求包括市場,合同和組織內部的要求34自檢 self test 由工作的完成者依據規定的規則對該工作進行的檢驗35服務 service 為滿足顧客的需要,供方和顧客之間接觸的活動以及供方內部活動產生的結果