PCB字典--实用完整版

P,*,/P139,印刷電路板字彙,*,電路板(,PCB,),字彙整理,教 育 訓 練 教 材,僅 供 內 部 使 用 嚴 禁 翻 印 (200,2,.0,7,.0,1,),PCB,字典,UNiC,2024/11/28,0,流 程 圖,PCB Mfg. FLOW CHART,UPDATED:1999,09,01,多層板內層流程,(,INNER LAYER PRODUCT,),多次埋孔,Multiple Buried Via,徐 振 連,JOHNNY HSU,顧 客 (,CUSTOMER,),工 程 製 前,(,FRONT-END DEP.,),裁 板,(,LAMINATE SHEAR,),內 層 乾 膜 (,INNERLAYER IMAGE,),預 疊 板 及 疊 板 (,LAY- UP,),通 孔 電 鍍,(,P . T . H .,),液 態 防 焊,(,LIQUID S/M,),外 觀 檢 查,(,VISUAL INSPECTION,),成 型,(,FINAL SHAPING,),業 務,(,SALES DEPARTMENT,),生 產 管 理,(,P&M CONTROL,),蝕 銅,(,I/L ETCHING,),鑽 孔,(,PTH DRILLING,),壓 合 (,LAMINATION,),外 層 乾 膜 (,OUTERLAYERIMAGE,),二次銅及錫鉛電鍍,(,PATTERN PLATING,),蝕 銅,(,O/L ETCHING,),檢 查 (,INSPECTION,),噴 錫,(,HOT AIR LEVELING,),電 測 (,ELECTRICAL TEST,),出 貨 前 檢 查,(,O. Q. C.,),包 裝 出 貨 (,PACKING&SHIPPING,),曝 光 (,EXPOSURE,),壓 膜 (,LAMINATION,),前處理 (,PRELIMINARY,TREATMENT,),顯 影 (,DEVELOPIG,),蝕 銅 (,ETCHING,),去 膜 (,STRIPPING,),黑 化 處 理,(,BLACK OXIDE,),烘 烤 (,BAKING,),預 疊 板 及 疊 板 (,LAY- UP,),壓 合 (,LAMINATION,),後 處 理 (,POSTTREATMENT,),曝 光 (,EXPOSURE,),壓 膜(,LAMINATION,),二 次 銅 電 鍍 (,PATTERNPLATING,),錫 鉛 電 鍍,(,T/L PLATING,),去 膜 (,STRIPPING,),蝕 銅 (,ETCHING,),剝 錫 鉛,(,T/L STRIPPING,),塗 佈 印 刷,(,S/M COATING,),預 乾 燥,(,PRE-CURE,),曝 光 (,EXPOSURE,),顯 影 (,DEVELOPING,),後 烘 烤,(,POST CURE,),MLB,全 板 電 鍍,(,PANEL PLATING,),銅 面 防 氧 化 處 理,O.S.P (,Entek,Cu 106A,),外 層 製 作,(,OUTER-LAYER,),TENTING,PROCESS,鍍 金 手指,(,G/F PLATING,),鍍 化 學 鎳 金,(,E-less Ni/Au,),For O. S. P.,選 擇 性 鍍 鎳 鍍 金 (,SELECTIVE GOLD,),印 文 字,(,SCREEN LEGEND,),網 版 製 作 (,STENCIL,),圖 面 (,DRAWING,),工 作 底 片 (,WORKING A/W,),製 作 規 範,(,RUN CARD,),程 式 帶 (,PROGRAM,),鑽 孔 , 成 型 機 (,D. N. C.,),底 片,(,MASTER A/W,),磁 片, 磁 帶,(,DISK , M/T,),藍 圖,(,DRAWING,),資 料 傳 送,(,MODEM , FTP,),A O I,檢 查,(,AOI INSPECTION,),除 膠 渣 (,DESMER,),通 孔 電 鍍,(,E-LESS CU,),DOUBLE,SIDE,前處理 (,PRELIMINARY,TREATMENT,),前處理 (,PRELIMINARY,TREATMENT,),前處理 (,PRELIMINARY,TREATMENT,),全面鍍鎳金,(,S/G PLATING,),雷 射 鑽 孔,(,LASER,ABLATION,),Blinded Via,埋 孔 鑽 孔,(,I.V.H. DRILLING,),埋 孔 電 鍍,(,I.V.H. PLATING,),埋孔(,Buried via),P1/136,2024/11/28,1,*,Process Module,說明,:,A.,下料,(,Cut Lamination),a-1,裁板,(,Sheets Cutting),a-2,原物料發料,(,Panel)(Shear material to Size),B.,鑽孔,(,Drilling),b-1,內鑽,(,Inner Layer Drilling ),b-2,一次孔,(,Outer Layer Drilling ),b-3,二次孔,(2,nd,Drilling),b-4,雷射鑽孔,(,Laser Drilling )(Laser Ablation ),b-5,盲,(,埋,),孔鑽孔,(,Blind & Buried Hole Drilling),C.,乾膜製程,(,Photo Process(D/F),c-1,前處理,(,Pretreatment),c-2,壓,膜,(,Dry Film Lamination),c-3,曝,光,(,Exposure),c-4,顯,影,(,Developing),c-5,蝕銅,(,Etching),c-6,去膜,(,Stripping),c-7,初檢,(,Touch-up),c-8,化學前處理,化學研磨,(,Chemical Milling ),c,-9,選擇性浸金壓膜,(,Selective Gold Dry Film Lamination),c-10,顯 影,(,Developing ),c-11,去膜,(,Stripping ),D.,壓,合,Lamination,d-1,黑,化,(,Black Oxide Treatment),d-2,微,蝕,(,Microetching,),D,eveloping ,E,tching &,S,tripping (,DES,),2024/11/28,2,d-3,鉚釘組合,(,eyelet ),d-4,疊板,(,Lay up),d-5,壓,合,(,Lamination),d-6,後處理,(,Post Treatment),d-7,黑氧化,(,Black Oxide Removal ),d-8,銑靶 (,spot face),d-9,去溢膠,(,resin flush removal),E.,減銅,(,Copper Reduction),e-1,薄化銅,(,Copper Reduction),F.,電鍍,(,Horizontal Electrolytic Plating),f-1,水平電鍍 (,Horizontal Electro-Plating) (Panel Plating),f-2,錫鉛電鍍,(,Tin-Lead Plating ) (Pattern Plating),f-3,低於,1,mil ( Less than 1 mil Thickness ),f-4,高於,1,mil ( More than 1 mil Thickness),f-5,砂帶研磨,(,Belt Sanding),f-6,剝錫鉛,(,Tin-Lead Stripping),f-7,微切片,(,Microsection,),G.,塞孔,(,Plug Hole),g-1,印刷,(,Ink Print ),g-2,預烤,(,Precure,),g-3,表面刷磨,(,Scrub),g-4,後烘烤,(,Postcure,),H.,防焊,(,綠漆,): (,Solder Mask),h-1 C,面印刷,(,Printing Top Side),h-2 S,面印刷,(,Printing Bottom Side),h-3,靜電噴塗,(,Spray Coating),h-4,前處理,(,Pretreatment),h-5,預烤,(,Precure,),h-6,曝光,(,Exposure),h-7,顯影,(,Develop),h-8,後烘烤,(,Postcure,),2024/11/28,3,h-9 UV,烘烤,(,UV Cure),h-10,文字印刷,(,Printing of Legend ),h-11,噴砂,(,Pumice)(Wet Blasting),h-12,印可剝離防焊,(,Peelable,Solder Mask),I .,鍍金,Gold plating,i-1,金手指鍍鎳金,(,Gold Finger ),i-2,電鍍軟金,(,Soft Ni/Au Plating),i-3,浸鎳金,(,Immersion Ni/Au) (,Electroless,Ni/Au),J.,噴錫,(,Hot Air Solder Leveling),j-1,水平噴錫,(,Horizontal Hot Air Solder Leveling),j-2,垂直噴錫,(,Vertical Hot Air Solder Leveling),j-3,超級焊錫,(,Super Solder ),j-4.,印焊錫突點,(,Solder Bump),K.,成型,(,Profile)(Form),k-1,撈型,(,N/C Routing ) (Milling),k-2,模具沖,(,Punch),k-3,板面清洗烘烤,(,Cleaning & Backing),k-4 V,型槽,(,V-Cut)(V-Scoring),k-5,金手指斜邊,(,Beveling of G/F),L.,短斷路測試,(,Electrical Testing) (Continuity & Insulation Testing),l-1 AOI,光學檢查,(,AOI Inspection),l-2 VRS,目檢,(,Verified & Repaired),l-3,汎用型治具測試,(,Universal Tester),l-4,專用治具測試,(,Dedicated Tester),l-5,飛針測試,(,Flying Probe),M.,終檢,(,Final Visual Inspection),m-1,壓板翹,(,Warpage,Remove),m-2 X-OUT,印刷,(,X-Out Marking),m-3,包裝,及出貨,(,Packing & shipping),2024/11/28,4,m-4,目檢,(,Visual Inspection),m-5,清洗,及烘烤,(,Final Clean & Baking),m-6,護銅劑 (,ENTEK Cu-106A)(OSP),m-7,離子殘餘量測試,(,Ionic Contamination Test )(Cleanliness Test),m-8,冷熱衝擊試驗,(,Thermal cycling Testing),m-9,焊錫性試驗,(,Solderability,Testing ),N.,雷射鑽孔,(,Laser Ablation),N-1,雷射鑽,Tooling,孔,(,Laser ablation Tooling Hole),N-2,雷射曝光對位孔,(,Laser Ablation Registration Hole),N-3,雷射,Mask,製作,(,Laser Mask),N-4,雷射鑽孔,(,Laser Ablation),N-5 AOI,檢查及,VRS,( AOI Inspection & Verified & Repaired),N-6,Blaser,AOI (after,Desmear,and,Microetching,),N-7,除膠渣,(,Desmear,),N-8,微蝕,(,Microetching,),2024/11/28,5,A/W (artwork),底片,Ablation,燒溶,(,laser),切除,abrade,粗化,abrasion resistance,耐磨性,absorption,吸收,ACC ( accept ),允收,accelerated corrosion test,加速腐蝕,accelerated test,加速試驗,acceleration,速化反應,accelerator,加速劑,acceptable,允收,activator,活化液,active work in process,實際在製品,adhesion,附著力,adhesive method,黏著法,air inclusion,氣泡,air knife,風刀,amorphous change,不定形的改變,amount,總量,amylnitrite,硝基戊烷,analyzer,分析儀,anneal,回火,annular ring,環狀墊圈,;,孔環,anode slime (sludge),陽極泥,anodizing,陽極處理,AOI ( automatic optical inspection ),自動光學檢測,applicable documents,引用之文件,AQL sampling,允收水準抽樣,aqueous,photoresist,液態光阻,aspect ratio,縱橫比,(,厚寬比,),As received,到貨時,2024/11/28,6,back lighting,背光,back-up,墊板,banked work in process,預留在製品,base material,基材,baseline performance,基準績效,batch,批,beta backscattering,貝他射線照射法,beveling,切斜邊,;,斜邊,biaxial deformation,二方向之變形,black-oxide,黑化,blank controller,空白對照組,2024/11/28,7,blank panel,空板,blanking,挖空,blip,彈開,blister,氣泡,;,起泡,blistering,氣泡,blow hole,吹孔,board-thickness error,板厚錯誤,bonding plies,黏結層,bow ; bowing,板彎,break out,從平環內破出,bridging,搭橋,;,橋接,BTO (Build To Order),接單生產,burning,燒焦,burr,毛邊,(,毛頭,),camcorder,一體型攝錄放機,carbide,碳化物,carlson,pin,定位梢,carrier,載運劑,catalyzing,催化,catholic sputtering,陰極濺射法,caul,plate,隔板,;,鋼板,calibration system requirements,校驗系統之各種要求,center beam method,中心光束法,central projection,集中式投射線,certification,認證,chamfer,倒角,(,金手指,),chamfering,切斜邊,;,倒角,characteristic impedance,特性阻抗,charge transfer,overpotential,電量傳遞過電壓,chase,網框,checkboard,棋盤,chelator,蟹和劑,chemical bond,化學鍵,chemical vapor deposition,化學蒸著鍍,circumferential void,圓周性之孔破,clad metal,包夾金屬,clean room,無塵室,clearance,間隙,coat,鍍外表,coating error,防焊覆蓋錯誤,2024/11/28,8,coefficient of thermal expansion (CTE),熱澎脹系數,cold solder joint,冷焊點,cold-weld,金屬粉末冷焊,color,顏色,color error,顏色錯誤,compensation,補償,competitive performance,競爭力績效,complex salt,錯化物,complexor,錯化物,component hole,零件孔,component side,零件面,concentric,同心,conformance,密貼性,consumer products,消費性產品,contact resistance,接觸電阻,continuous performance,連續發揮效能,contract service,協力廠,controlled split,均裂式,conventional flow,亂流方式,conventional tensile test,傳統張力測試法,conversion coating,轉化層,convex,突出,coordinate list,資料清單,copper,claded,laminates (CCL),銅箔基板,copper exposure,線路露銅,copper mirror,鏡銅,copper pad,銅箔圓配,copper residue (copper splash),銅渣,corrosion rate numbering,腐蝕速率計數系統,corrosion resistance,抗蝕性,coulombs law,庫倫定律,countersink,喇叭孔,coupon,試樣,coupon location,試樣點,covering power,遮蓋力,CPU,中央處理器,crack,破裂,;,裂痕,crazing,裂痕,;,白斑,cross linking,交聯聚合,2024/11/28,9,cross talk,呼應作用,crosslinking,交聯,crystal collection,結晶收集,curing,聚合體,current efficiency,電流效率,cut-outs,挖空,cutting,裁板,cyanide,氰化物,cycles of learning,學習循環,cycle-time reduction,交期縮短,date code,週期,deburring,去毛頭,dedicated,專用型,degradation,退變,delamination,分層,dent / pin hole,凹陷,/,針孔,department of defense,國防部,designation,字碼簡示法,de-smear,除膠渣,developing,顯影,dewetting,縮錫,dewetting,time,縮錫時間,dimension error,外形尺寸錯誤,dielectric constant,介質常數,difficulty,困難度,difunctional,雙功能,dimension,尺寸,dimension stability,尺寸安定性,dimensional stability,尺度安定性,dimension and tolerance,尺寸與公差,dirty hole,孔內異物,discolor hole,孔黑,;,孔灰,;,氧化,discoloration,變色,disposable eyelet method,消耗性鉚釘法,distortion factor,尺寸變形函數,double side,雙面板,2024/11/28,10,downtime,停機時間,drill,鑽孔,drill bit,鑽頭,drill facet,鑽尖切萷面,drill pointer,鑽尖重,(,研,),磨機,drilled blank board,已鑽孔之裸板,drilling,鑽孔,dry film,乾膜,ductility,延展性,economy of scale,經濟規模,edge spacing,板邊空地,edge-board contact ( gold finger ),金手指,efficiency,能量效率,electric test,電測,electrical testing,電測,;,測試,electrochemical machine ECM,電化學加工法,electrochemical reactor,電化學反應器,electroforming,電鑄,electroless,plate,化學銅,electroless,-deposition,無電鍍,electropolishing,電解拋光,electrorefining,電解精鍊,electrowinning,電解萃取,elliptical set,橢圓形,embrittlement,脆性,entitlement performance,可達成績效,entrapment,電鍍夾雜物,epoxy,環氧樹酯,equipotential,電位線,error data file,異常情形,etch rate,蝕銅速率,etchants,蝕刻液,etchback,回蝕,evaluation program,評估用程式,exposure,曝光,external pin method,外部插梢法,eyelet hole,鉚釘孔,Eyeletting,鉚眼,fabric,網布,failure,故障,2024/11/28,11,fast response,快速回應,fault,瑕庛,;,缺陷,fiber exposure,纖維顯露,fiber protrusion,纖維突出,fiducial,mark,光學點,基準記號,filler,填充料,film,底片,filtration,過濾,finished board,成品,fixing,固著,fixture,電測夾具,(,治具,),flaking off,粹離,flammability rating,燃性等級,flare,喇叭形孔,flat cable,併排電纜,feedback loop,回饋循環,first-in-first-out (FIFO),先進先出,flexible manufacturing system (FMS),彈性製造系統,flux,助焊劑,foil distortion,銅層變形,fold,空泡,foreign include,異物,foreign material,基材內異物,free radical chain polymerization,自由基連鎖聚合,fully additive,加成法,fully annealed type,徹底回火軔化之類形,function,函數,fundamental and basic,基本,fungus resistance,抗黴性,funnel flange,喇叭形摺翼,galvanized,加法尼化製程,gap,鑽尖分開,gauge length,有效長度,gel time,膠化時間,general resist ink,一般阻劑油墨,general,通論,general industrial,一般性,(,電子,),工業級,geometrical,levelling,幾何平整,glass transition temperature (,Tg,),玻璃態轉換溫度,2024/11/28,12,Gold,金,gold finger,金手指,gold plating,鍍金,golden board,標準板,gouges,刷磨凹溝,gouging,挖破,grain boundary,金屬晶體之四邊,green,綠色,grip,夾頭,ground plane,接地層,ground plane clearance,接地空環,hackers,駭客,HAL ( hot air leveling ),噴錫,haloing,白邊,;,白圈,hardener,硬化劑,hardness,硬度,hepa,filter,空氣濾清器,high performance industrial,高性能,(,電子,),工業級,high reliability,高可靠度,high resolution,高解析度,high temperature elongation (HTE),高溫延展性銅箔,high temperature epoxy (HTE),高溫樹酯,hit,擊,hole counter,數孔機,hole diameter,孔徑,hole diameter error,孔徑錯誤,hole location,孔位,hole number,孔數,hole wall quality,孔壁品質,hook,外弧,hot dip,熱浸法,hull cell,哈氏槽,hybrid,混成積體電路,hydrogen bonding,氫鍵,hydrolysis,水解,hydrometallurgy,濕法冶金法,image analysis system,影像分析系統,image transfer,影像轉移,immersion gold,浸金,(,化鎳金,),2024/11/28,13,immersion plating,浸鍍法,impedance,阻抗,infrared,reflow,紅外線重熔,inhibitor,熱聚合抑制劑,injection mold,射模,ink,油墨,innerlayer,&,outlayer,內外層,insulation resistance,絕緣電阻,intended position,應該在的位置,intensifier,增強器,intensity,強度,inter molecular exchange,交互改變,interconnection,互相連通,ionic contaminants,離子性污染物,ionic contamination testing,離子污染試驗,IPA,異丙醇,5,I : inspiration,(,啟蒙),identification,確認計劃目標,implementation,改善方案,information,數據,internalization,制度化,invisible inventory,無形的庫存,knife edges,刀緣,Knoop,努普,(,硬度單位,),kraft,paper,牛皮紙,laminar flow,層流,laminate,基層板,laminating,壓合,lamination,壓合,laminator,壓膜機,land,焊墊,lay back,刃角磨損,lay up,組合疊板,layout,佈線,;,佈局,lead screw,牽引螺絲,leakage,漏電,learning curve,學習曲線,legend,文字標記,leveling,平整,2024/11/28,14,levelling,additive,平整劑,levelling,power,平整力,life support,維繫生命,limiting current,極限電流,line space,線距,line width,線寬,linear variable differential transformer(LVDL),線性可變差動轉換器,liquid,液狀,(,態,),liquid crystal resins,液晶樹脂,liquid,photoimageable,solder resist ink,液態感光防焊油墨,liquid,photoresist,ink,液態光阻劑油墨,lot size,批量,lower carrier,底部承載板,mechanical plating,機祴鍍法,machine scrub,刷磨清潔法,macrothrowing,power,巨分佈力,margin,鑽頭刃帶,market share,市場佔有率,marking error,文字錯誤,masked leveling,儰裝平整,mass lamination,大型壓板,mass transfer,質量傳送效應,mass transfer,overpotential,質量傳遞過電壓,mass transportation,質傳,master drawing,主圖,;,藍圖,material use factor,材料使用率,mealing,泡點,;,白點,memory,記憶裝置,meniscograph,solderability,measurement,新月型焊錫效果,microetch,微蝕,microetching,微蝕,microfocus,微焦距,microfocus,system,微焦距系統,microprofile,微表面,microsectioning,微切片法,microthrowing,power,微分佈力,migration,遷移,mini-tensile tester,迷你拉力測試儀,mis,hole location,孔位錯誤,2024/11/28,15,misregistration,焊錫面與零件面對位偏差,misregsitration,對不準,moisture and insulation resistance test,濕氣與絕緣電阻試驗,molded circuit board (MCB),模製電路板,monoethanal,amine,單乙醇氨,monohydrate state,水化物,monomer,單分子膜,;,單體,mouse bite,鋸齒,;,蝕刻缺口,msec,毫秒,muffle furnace,高溫焚火爐,multichip,超大,IC,型,(多晶片模組),mylar,保護膜,nail head,釘頭,NC drill,數位鑽孔機,negative,etchback,反回蝕,negative film,負片,negative rake angle,負摳耙角,network,迴路,;,網路,neutralization,中和,nick,缺口,nickel,鎳,nodule,銅瘤,;,瘤粒,no flow resin,不流,樹脂,noise,雜訊,nominal,標示,nominal dimension,標定長度,nominal gel time,標示膠性時間,nominal resin content,標示膠含量,nominal resin flow,標示膠流量,nominal scaled flow thickness,標示比例流量厚度,OA equip,辦公室自動化設備,obsolescence factor,報廢因素,OEM,原設備製造商,offset-list,補償數據清單,ohmmeter,歐姆計,open,斷路,open circuits,斷路,open short testing,斷短路測試,2024/11/28,16,opening,開口,original art work (A/W),原稿底片,Others,其它,outgrowth,增出,over design,牛刀殺雞,overlap,鑽尖重疊,overlay entry,蓋板,overpotential,過電壓,oxidation,氧化,oxide treatment,黑化處理,oxided,cytochrome,氧化性之細包色素,oxygen evolution,氧氣發生反應,packed bed,充填床式,pad,錫墊,;,圓配,pad copper exposurepad,露銅,panel,小型板面,;,母板,panel plating,一次銅電鍍,parasitic,寄生的,part no.,料號,pattern plating,二次銅電鍍,PCB ( print circuit board ),印刷電路板,pcs,片,peel strength,抗撕強度,peeling off,剝離,(,剝落,),performance specification,性能規範,permittivity,透電率,perspectives on experience,經驗透視,PET,聚酯,photodiode detector,發光二極體偵測器,photo initiator,感光啟始劑,photoresist,光阻,phototool,光具,(,指工作底片,),piece,子板面,pinceton,applied research,腐蝕測定儀,pink ring,粉紅圈,pit,凹點,2024/11/28,17,pitch,腳距,planar,平面,plating,電鍍,plating exposure,下鍍層露出,plug gauge,插規,plug hole,孔塞,PNL (panel),排板,polar-polar interaction,極性之間的吸力,polyester,聚酯類,polyglycols,聚乙二醇,polyimide,聚亞醯氨,poor,bevelling,磨邊加工引起突起,剝離,poor drill,孔形不良,poor HAL,噴錫不良,poor marking,字體不良,poor pad,錫墊不良,poor printed,印刷偏差,poor,solderability,焊錫性不良,poor touch-up,補線不良,position control system,位置控制系統,positive rake angle,正摳耙角,power curve model,幕次曲線模式,practice,工藝慣例,preferred,良好,premature tearing,提前撕裂,prepolymer,預聚合物,prepreg,膠片,pre-process ( front-end),製前,press,壓床,press cycle,壓合週期,primary current distribution,一次電流分佈,primary,主要,product lifetimes,生命週期,product process,製程,promoter,促進劑,protocal,初步資料,prussic acid,普魯士酸,PTF-based process,厚膜糊法,2024/11/28,18,PTH (plating though hole),導通孔,pull away,拉開,pumice,浮石粉,pumice scrub,噴砂清潔法,pyrometallurgy,火燒法冶鍊,QC ( quality control),品管,QFP (quad flat pack ),扁方型封裝體,qualification inspection,資格審查檢驗,qualification testing,資格檢定,quality classification,品質等級,quantitative,計量式測試,rack,掛架,radiometer,能量劑,rake angle,摳耙角,RAM Random Access Memory,隨機存取記憶體,real time,關鍵時刻,recessed trace process,凹槽線路法,recovery tank,回收槽,reduction,還原,re-,eninforcement,強化,refraction,折光率,reinforcement style,補強材料的型式,register mark,對位用標記,registration hole,對位孔,registration pattern,長方形銅地,REJ ( reject ),退貨,;,拒收,rejectable,拒收,release agent,脫模劑,relief angle,浮離角,remark,備註,repair,修理,resin content,樹脂含量,(,膠含量,),resin flow,膠流量,resin flow percentage,樹脂流量之百分率,resin recession,樹脂下陷,resin smear,膠渣,resist strippers,剝乾膜劑,2024/11/28,19,resistor network,排列電阻,resolution,解像度,return on assets,資產報酬率,reversibility,可逆性,rework,重工,rosin,天然松香,rotating cylinder,旋轉圓柱形,roughtness,孔壁粗糙,;,粗慥,routing,切外形,成型,routing bit,銑刀,runout,偏轉,S/L on hole,孔內沾文字,S/M ( solder mask ), S/L,防焊文字,S/M (solder mask),防焊,S/M error,防焊種類錯誤,S/M on hole,孔內綠漆,salt spray test,鹽水噴霧試驗,sampling size,抽樣數,scope,範圍,scored,刻痕,scoring,樞槽,;,刮線,scrap,廢框,scratches,刮傷,screen printing,網版印刷,scum,透明殘膜,sealing,封孔處理,secondary,次要,semi-additive,半加成法,sensitize,敏化,sensitizer,敏化液,separator,鋼隔板,sequential lamination,漸成式壓法,serrated edges,毛邊,shatter,破碎,2024/11/28,20,short,短路,shunt,分路,silane,treatment,矽烷處理,silicone coupling agent,矽烷偶合劑,silk screen,文字印刷,simulator,模擬器,single axis,單軸,sizing,底片之伸縮補償,skip,漏印,skip printing,跳印,;,漏印,sliver,絲條,slot,開槽,slotting,開槽,SMD ( surface mount device ),表面黏著元件,smear,膠渣,SMT ( surface mount technology ),表面黏著技術,sodium carbonate,monohydrate,結晶水,碳酸鈉,soft tooling,軟性工具,solder,焊錫,;,錫鉛,solder bridge,錫橋,solder bump,錫突,solder float,漂錫,solder mask adhesion,綠漆附著力,solder on G/F,金手指沾錫,solder on trace,線路沾錫,solder plug,錫塞,solder side,焊錫面,solderability,焊錫性,solid carbide,實質碳化物,spacing,間距,spacing,nonenough,間距不足,SPC ( Statistical Process Control ),統計生管,specification,規範,special considerations,特別考慮,spin coating,旋轉塗佈,spindle,鑽軸,spiral,contractometer,螺旋收縮儀,spot face,銑靶,spray coating,噴塗,2024/11/28,21,Squeegee,刮刀,stacking structure,疊板結構,stamping,沖壓,standard hydraulic lamination,標準液壓法,standardizing,標準化,starvation,缺膠,step tablet,格片數,stock option,認股選擇權,strain,應度,strength,強度,stressmeter,應力計,subtractive,減除法,surface convex,表面突起,surface examination,表面檢查,surface insulation resistance (SIR),表面絕緣電阻,surface mount,表面黏著方式,surface roughness,表面粗慥度,surges,突波,switch circuit,開關線路,tab,金手指,tack free,不黏,taped hole gauge,錐形孔規,target hole,靶孔,task force,任務編組,tensile strength,抗拉強度,tensile stress,張性應力,tent,浮蓋,terms and definitions,術語與定義,termination load,抗匹配負載,test circuit,測試線路,test method,試驗方法,test point,測試點,thermal shock,熱震盪試驗,thermal stress,熱應力試驗,thermistor,熱電感應式,thermo cycling,熱循環試驗,theoretical cycle time,理論性週期時間,2024/11/28,22,thickness,厚度,time to market,上市時機,thickness distribution,厚度分佈,thief,補助陰極,thin core,薄基板,;,內層板,throwing power,分佈力,tolerance,公差,;,容差,tooling hole,工具孔,torque load,扭力拒之負載,total quality program,全面的品質計劃,toughness,堅度,trace error,線路錯誤,trace nick & pin hole,線路缺口及針孔,trace peeling,線路剝離,trace pin-hole,線路針孔,trace surface roughness,線路表面粗糙,tarnish and oxide resist,抗污抗氧化劑,transmittance,透光度,trim line,裁切線,true,levelling,真平整,true position,真正位置的孔,;,真位,twist,板翹,type,種類,umbra,本影,undercut,側蝕,uneven coating,噴錫厚鍍不平整,universal,萬用型,universal tensile tester,萬用拉力試驗機,universal tester,汎用型測試機,upper carrier,頂部承載鋼,uptime,稼動時間,vacuum deposition,真空蒸鍍法,vacuum hydraulic lamination,真空液壓法,vaporizer,氣化室,V-cut V,形槽,vertical,microsection,垂直微切片,20