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WWEI CONFIDENTIAL,NON DISCLOSURE,WWEI CONFIDENTIAL,NON DISCLOSURE,WWEI CONFIDENTIAL,NON DISCLOSURE,HDI,印 刷 電 路 板 流 程 介 紹,*,HDI Manufacturing Process Flow,Pre-engineering,Pattern imaging,Etching,Laminating,Drilling,Cu plating,Hole plugging,Pattern imaging,Lamination,Laser Ablation,Mechanical drilling,Pattern imaging,Cu plating,Solder Mask,Surface Finished,Routing,Visual inspection,Electric test,Shipping,Pre-engineering,Pattern imaging,Etching,Laminating,Drilling,Desmear,Cu plating,Hole plugging,Cu plating,Belt Sanding,Lamination,Laser Ablation,Mechanical drilling,Cu plating,Pattern imaging,Solder Mask,Gold plating,Routing,Electrical test,Pattern imaging,Hole counter,Shipping,Visual inspection,*,Raw material (,Thin Core,Copper,Prepreg.),Raw Material,: FR-4 (Difuntional,Tetrafuntional),Supplier,: EMC ,Nan-Ya,Sheet size,: 36,”,*48,”, 40,”,*48,”,42,”,*48,Core Thickness,: 0.003,”,0.004,”,0.005,”,0.006,”,0.008,”,0.010,”,0.012,”,0.015,”,0.021,”,0.031,”,0.039,”,0.047,”,Copper Foil,: 1/3 oz,1/2 oz,1.0 oz,2 oz,Prepreg type,: 1080,2113,2116,1506,7628,7630,1.內層基板 (,THIN CORE),Laminate,Copper Foil,裁板,(,Panel Size),COPPER FOIL,Epoxy Glass,Photo Resist,2.內層線路製作(壓膜) (,Dry Film Resist Coat),Etch Photoresist (D/F),Photo Resist,3. 內層線路製作(曝光)(,Expose),A/W,Artwork,(,底片),Artwork,(,底片),After Expose,Before Expose,4. 內層線路製作(顯影)(,Develop),Photo Resist,5. 內層線路製作(蝕刻)(,Etch),Photo Resist,6. 內層線路製作(去膜)(,Strip Resist),7.黑氧化 (,Oxide Coating),8. 疊板 (,Lay-up),LAYER 2,LAYER 3,LAYER 4,LAYER 5,LAYER 1,LAYER 6,Layer 1,Layer 2,Layer 3,Layer 4,Copper Foil,Copper Foil,Inner Layer,Prepreg(膠片),Prepreg(膠片),9. 壓合 (,Lamination),典型之多層板疊板及壓合結構,.,.,.,COPPER FOIL 0.5 OZ,Thin Core ,FR-4,prepreg,COMP,S0LD.,prepreg,Thin Core ,FR-4,prepreg,COPPER FOIL 0.5 OZ,疊合用之鋼板,疊合用之鋼板,10-12層疊合,壓合機之熱板,壓合機之熱板,COPPER FOIL 0.5 OZ,Thin Core ,FR-4,prepreg,COMP,S0LD.,prepreg,Thin Core ,FR-4,prepreg,COPPER FOIL 0.5 OZ,疊合用之鋼板,疊合用之鋼板,墊木板,鋁板,10. 鑽孔,(Drilling),11. 電鍍,Desmear & Copper Deposition,12. 塞孔(,Hole Plugging),13. 去溢膠 (,Belt Sanding),14. 減銅,(,Copper Reduction) Option,15. 去溢膠 (,Belt Sanding) Option,16. 外層壓膜,Dry Film Lamination (Outer layer),Photo Resist,17. 外層曝光,Expose,UV,光源,18.,After Exposed,19. 外層顯影,Develop,20. 蝕刻,Etch,20. 去乾膜,Strip Resist,21.壓合 (,Build-up Layer Lamination),RCC,(,R,esin,C,oated,C,opper foil),21. 護形層製作 (壓膜)(,Conformal Mask),Dry Film,(,乾膜),Dry Film,(,乾膜),Artwork,(,底片),Artwork,(,底片),22. 護形層製作 (曝光)(,Conformal Mask),Before Exposure,After Exposure,23.護形層製作 (顯像)(,Conformal Mask),24. 護形層製作 (蝕銅) (,Conformal Mask),25.護形層製作(去膜) (,Conformal Mask),26. 雷射鑽孔 (,Laser Ablation),及機械鑽孔,Mechanical Drill,(P.T.H.),Laser Microvia,(Blind Via),27. 機械鑽孔 (,Mechanical Drill),28. 電鍍(,Desmear & Copper Deposition),29. 外層線路製作 (,Pattern imaging),壓膜,(,D/F Lamination),曝光,(,Exposure),顯像,(,D/F Developing),蝕銅,(,Etching),去膜,(,D/F Stripping),30. 防焊(綠漆)製作 (,Solder Mask),WWEI,94V-0,R105,31.,S/M,顯像 (S/M Developing),32. 印文字 (,Legend Printing),33. 浸金(噴錫)製作(,Electroless Ni/Au , HAL),WWEI,94V-0,R105,WWEI,94V-0,R105,Dedicate or universal Tester,Flying Probe Tester,34. 成型,(Profile),35. 測試 (,Electrical Testing),WWEI,94V-0,R105,WWEI,94V-0,R105,36. 終檢 (,Final Inspection),37.,O.S.P. (entek plus Cu_106A.),Option,LASER BLIND & BURIED VIA LAY-UP,A = THROUGH VIA HOLE (,導通孔),B = BURIED VIA HOLE (,埋孔),C = One Level Laser Blind Via (,雷射,盲孔 ),LASER BLIND & BURIED VIA LAY-UP,BURIED VIA,AND,LASER,BLIND VIA OPTION (,雷射,盲埋孔之選擇),D,C,C,D = Two Level Laser Via (,雷射,盲孔 ),C,D,C,B-STAGE,FR-4 Core,RCC,FR-4 Core,B-STAGE,RCC,A,B,B,A,BURIED VIA LAY-UP,A = THROUGH VIA HOLE (,導通孔),B = BURIED VIA HOLE (,埋孔),C = BLIND VIA HOLE (,盲孔 ),D = BLIND HOLE MLB VIA (,多層盲孔),BLIND VIA LAY-UP,BLIND VIA SEQUENTIAL LAY-UP,A,B,B,A,RESIN,B-STAGE,BLIND AND BURIED VIA OPTION (,盲 埋 孔 之 選 擇 ),D,A,C,C,E = VIA IN PAD (VIP) (,導通孔在,pad,裡面),E,Conventional PCB,FR-4,Build-up,Layer,Build-up,Layer,Photo-via,Photo-Imageable Dielectric (PID),FR-4,Conventional PTH,Conventional PTH,Conventional PCB,Blind Via PCB,PTH,3,mil line,SVH,IVH,Chip-on-SVH,FR-4,Conventional PTH,Conventional PTH,Q & A,END,
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