集成电路设计---吉林大学chapter1课件

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EE141 Digital Integrated Circuits2ndIntroductionDigital Integrated CircuitsA Design PerspectiveIntroductionJan M.RabaeyAnantha ChandrakasanBorivoje NikolicJuly 30,20021EE141 Digital Integrated Circuits2ndIntroductionWhat is this book all about?qIntroduction to digital integrated circuits.CMOS devices and manufacturing technology.CMOS inverters and gates.Propagation delay,noise margins,and power dissipation.Sequential circuits.Arithmetic,interconnect,and memories.Programmable logic arrays.Design methodologies.qWhat will you learn?Understanding,designing,and optimizing digital circuits with respect to different quality metrics:cost,speed,power dissipation,and reliability2EE141 Digital Integrated Circuits2ndIntroductionDigital Integrated CircuitsqIntroduction:Issues in digital designqThe CMOS inverterqCombinational logic structuresqSequential logic gatesqDesign methodologiesqInterconnect:R,L and CqTimingqArithmetic building blocksqMemories and array structures3EE141 Digital Integrated Circuits2ndIntroductionIntroductionqWhy is designing digital ICs different today than it was before?qWill it change in future?4EE141 Digital Integrated Circuits2ndIntroductionThe First Computer5EE141 Digital Integrated Circuits2ndIntroductionENIAC-The first electronic computer(1946)6EE141 Digital Integrated Circuits2ndIntroductionThe Transistor RevolutionFirst transistorBell Labs,19487EE141 Digital Integrated Circuits2ndIntroductionThe First Integrated Circuits Bipolar logic1960sECL 3-input GateMotorola 19668EE141 Digital Integrated Circuits2ndIntroduction Intel 4004 Micro-Processor19711000 transistors1 MHz operation9EE141 Digital Integrated Circuits2ndIntroductionIntel Pentium(IV)microprocessor10EE141 Digital Integrated Circuits2ndIntroductionMoores LawlIn 1965,Gordon Moore noted that the number of transistors on a chip doubled every 18 to 24 months.lHe made a prediction that semiconductor technology will double its effectiveness every 18 months11EE141 Digital Integrated Circuits2ndIntroductionMoores LawElectronics,April 19,1965.12EE141 Digital Integrated Circuits2ndIntroductionEvolution in Complexity13EE141 Digital Integrated Circuits2ndIntroductionTransistor Counts1,000,000100,00010,0001,000101001197519801985 19901995 20002005 2010808680286i386i486PentiumPentium ProK1 Billion 1 Billion TransistorsTransistorsSource:IntelSource:IntelProjectedProjectedPentium IIPentium IIICourtesy,Intel14EE141 Digital Integrated Circuits2ndIntroductionMoores law in Microprocessors40048008808080858086286386486Pentium procP60.0010.010.1110100100019701980199020002010YearTransistors(MT)2X growth in 1.96 years!Transistors on Lead Microprocessors double every 2 yearsCourtesy,Intel15EE141 Digital Integrated Circuits2ndIntroductionDie Size Growth40048008808080858086286386486Pentium procP611010019701980199020002010YearDie size(mm)7%growth per year2X growth in 10 yearsDie size grows by 14%to satisfy Moores LawCourtesy,Intel16EE141 Digital Integrated Circuits2ndIntroductionFrequencyP6Pentium proc486386286808680858080800840040.111010010001000019701980199020002010YearFrequency(Mhz)Lead Microprocessors frequency doubles every 2 yearsDoubles every2 yearsCourtesy,Intel17EE141 Digital Integrated Circuits2ndIntroductionPower DissipationP6Pentium proc486386286808680858080800840040.1110100197119741978198519922000YearPower(Watts)Lead Microprocessors power continues to increaseCourtesy,Intel18EE141 Digital Integrated Circuits2ndIntroductionPower will be a major problem5KW 18KW 1.5KW 500W 40048008808080858086286386486Pentium proc0.1110100100010000100000197119741978 198519922000 20042008YearPower(Watts)Power delivery and dissipation will be prohibitiveCourtesy,Intel19EE141 Digital Integrated Circuits2ndIntroductionPower density40048008808080858086286386486Pentium procP611010010001000019701980199020002010YearPower Density(W/cm2)Hot PlateNuclearReactorRocketNozzlePower density too high to keep junctions at low tempCourtesy,Intel20EE141 Digital Integrated Circuits2ndIntroductionNot Only MicroprocessorsDigital Cellular Market(Phones Shipped)1996 1997 1998 1999 2000Units 48M 86M 162M 260M 435MAnalog BasebandDigital Baseband(DSP+MCU)PowerManagementSmall Signal RFPowerRF(data from Texas Instruments)(data from Texas Instruments)CellPhone21EE141 Digital Integrated Circuits2ndIntroductionChallenges in Digital Design “Microscopic Problems”Ultra-high speed design Interconnect Noise,Crosstalk Reliability,Manufacturability Power Dissipation Clock distribution.Everything Looks a Little Different “Macroscopic Issues”Time-to-Market Millions of Gates High-Level Abstractions Reuse&IP:Portability Predictability etc.and Theres a Lot of Them!DSM 1/DSM?22EE141 Digital Integrated Circuits2ndIntroductionProductivity Trends1101001,00010,000100,0001,000,00010,000,000200319811983198519871989199119931995199719992001200520072009101001,00010,000100,0001,000,00010,000,000100,000,000Logic Tr./ChipTr./Staff Month.xxxxxxx21%/YpoundProductivity growth ratex58%/YpoundedComplexity growth rate10,0001,0001001010.10.010.001Logic Transistor per Chip(M)0.010.11101001,00010,000100,000Productivity(K)Trans./Staff-Mo.Source:SematechComplexity outpaces design productivityComplexityCourtesy,ITRS Roadmap23EE141 Digital Integrated Circuits2ndIntroductionWhy Scaling?qTechnology shrinks by 0.7/generationqWith every generation can integrate 2x more functions per chip;chip cost does not increase significantlyqCost of a function decreases by 2xqBut How to design chips with more and more functions?Design engineering population does not double every two yearsqHence,a need for more efficient design methodsExploit different levels of abstraction24EE141 Digital Integrated Circuits2ndIntroductionDesign Abstraction Levelsn+n+SGD+DEVICECIRCUITGATEMODULESYSTEM25EE141 Digital Integrated Circuits2ndIntroductionDesign MetricsqHow to evaluate performance of a digital circuit(gate,block,)?CostReliabilityScalabilitySpeed(delay,operating frequency)Power dissipationEnergy to perform a function26EE141 Digital Integrated Circuits2ndIntroductionCost of Integrated Circuitsq NRE(non-recurrent engineering)costsdesign time and effort,mask generationone-time cost factorq Recurrent costssilicon processing,packaging,testproportional to volumeproportional to chip area27EE141 Digital Integrated Circuits2ndIntroductionNRE Cost is Increasing28EE141 Digital Integrated Circuits2ndIntroductionDie CostSingle dieWaferFrom http:/Going up to 12”(30cm)29EE141 Digital Integrated Circuits2ndIntroductionCost per Transistor0.00000010.00000010.0000010.0000010.000010.000010.00010.00010.0010.0010.010.010.10.11 11982198219851985198819881991199119941994199719972000200020032003200620062009200920122012cost:cost:-per-per-transistortransistorFabrication capital cost per transistor(Moores law)30EE141 Digital Integrated Circuits2ndIntroductionYield31EE141 Digital Integrated Circuits2ndIntroductionDefectsa is approximately 3 32EE141 Digital Integrated Circuits2ndIntroductionSome Examples(1994)ChipMetal layersLine widthWafer costDef./cm2Area mm2Dies/waferYieldDie cost386DX20.90$9001.04336071%$4486 DX230.80$12001.08118154%$12Power PC 60140.80$17001.312111528%$53HP PA 710030.80$13001.01966627%$73DEC Alpha30.70$15001.22345319%$149Super Sparc30.70$17001.62564813%$272Pentium30.80$15001.5296409%$41733EE141 Digital Integrated Circuits2ndIntroductionReliabilityNoise in Digital Integrated Circuitsi(t)Inductive coupling Capacitive couplingPower and ground noisev(t)VDD34EE141 Digital Integrated Circuits2ndIntroductionDC OperationVoltage Transfer CharacteristicV(x)V(y)VOHVOLVM VOHVOLfV(y)=V(x)Switching ThresholdNominal Voltage LevelsVOH=f(VOL)VOL=f(VOH)VM=f(VM)35EE141 Digital Integrated Circuits2ndIntroductionMapping between analog and digital signalsVILVIHVinSlope=-1Slope=-1VOLVOHVout“0”VOLVILVIHVOHUndefinedRegion“1”36EE141 Digital Integrated Circuits2ndIntroductionDefinition of Noise MarginsNoise margin highNoise margin lowVIH VILUndefinedRegion10VOH VOLNMHNMLGate OutputGate Input37EE141 Digital Integrated Circuits2ndIntroductionNoise BudgetqAllocates gross noise margin to expected sources of noiseqSources:supply noise,cross talk,interference,offsetqDifferentiate between fixed and proportional noise sources38EE141 Digital Integrated Circuits2ndIntroductionKey Reliability PropertiesqAbsolute noise margin values are deceptivea floating node is more easily disturbed than a node driven by a low impedance(in terms of voltage)qNoise immunity is the more important metric the capability to suppress noise sourcesq Key metrics:Noise transfer functions,Output impedance of the driver and input impedance of the receiver;39EE141 Digital Integrated Circuits2ndIntroductionRegenerative PropertyRegenerativeNon-Regenerative40EE141 Digital Integrated Circuits2ndIntroductionRegenerative Property A chain of invertersv0v1v2v3v4v5v6 Simulated response41EE141 Digital Integrated Circuits2ndIntroductionFan-in and Fan-outNFan-out NFan-in MM42EE141 Digital Integrated Circuits2ndIntroductionThe Ideal GateRi=Ro=0Fanout=NMH=NML=VDD/2 g=VinVout43EE141 Digital Integrated Circuits2ndIntroductionAn Old-time InverterNMHVin(V)Vout(V)NMLVM0.01.02.03.04.05.01.02.03.04.05.044EE141 Digital Integrated Circuits2ndIntroductionDelay Definitions45EE141 Digital Integrated Circuits2ndIntroductionRing OscillatorT=2 tp N46EE141 Digital Integrated Circuits2ndIntroductionA First-Order RC NetworkvoutvinCRtp=ln(2)t=0.69 RCImportant model matches delay of inverter 47EE141 Digital Integrated Circuits2ndIntroductionPower DissipationInstantaneous power:p(t)=v(t)i(t)=Vsupplyi(t)Peak power:Ppeak=VsupplyipeakAverage power:48EE141 Digital Integrated Circuits2ndIntroductionEnergy and Energy-DelayPower-Delay Product(PDP)=E=Energy per operation=Pav tp Energy-Delay Product(EDP)=quality metric of gate =E tp 49EE141 Digital Integrated Circuits2ndIntroductionA First-Order RC NetworkvoutvinCLR50EE141 Digital Integrated Circuits2ndIntroductionSummaryqDigital integrated circuits have come a long way and still have quite some potential left for the coming decadesqSome interesting challenges aheadGetting a clear perspective on the challenges and potential solutions is the purpose of this bookqUnderstanding the design metrics that govern digital design is crucialCost,reliability,speed,power and energy dissipation51
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