一诺银合金丝产品介绍XXXX1203

YesNoYesNo一诺一诺1Welcome to 热烈欢迎热烈欢迎 先生和朋友们先生和朋友们 YesNoYesNo一诺一诺2烟台一诺电子材料有限公司烟台一诺电子材料有限公司Yantai YesNo Electronic Materials Co.,Ltd YesNoYesNo一诺一诺3 键合丝键合丝 Bonding wire 银键合丝银键合丝 Silver bonding wire 铜键合丝铜键合丝 Copper bonding wire 铝键合丝铝键合丝 Aluminum bonding wire 靶材、蒸发材靶材、蒸发材 Evaporating/Target Materials 主要内容主要内容 ContentYesNoYesNo一诺一诺4金金/银银/铜铜/铝等键合丝铝等键合丝 Gold/Silver/Aluminum/Copper etc.Bonding wire 贵金属蒸发材、靶材、焊线，贵金属蒸发材、靶材、焊线，以及用于特殊用途的合金材料以及用于特殊用途的合金材料 Evaporating precious metal,Target Materials,Solder wire and other alloy for multipurpose applications航空发动机航空发动机/辐射保护等材料辐射保护等材料 Aero engine/Radioprotection etc.materials 主要产品和服务主要产品和服务(1/2)Mainly Products&ServicesYesNoYesNo一诺一诺5主要产品和服务主要产品和服务(2/2)Mainly Products&ServicesAl targetAg/Au for evaporation银键合丝银键合丝Ag Bonding Wire 铜键合丝铜键合丝Cu Bonding Wire 金键合丝金键合丝Au Bonding Wire 铝键合丝铝键合丝Al Bonding wire Al Bonding wire YesNoYesNo一诺一诺66N高纯原料高纯原料棒材棒材合金化合金化丝材丝材成品的丝材成品的丝材成品成品（一）键合丝（一）键合丝 Bonding Wire键合丝工艺流程键合丝工艺流程Bonding wire process flowBonding wire process flowYesNoYesNo一诺一诺7良好的焊接化合性能，没有虚焊，良好的焊接化合性能，没有虚焊，最大程度减少对芯片的损害最大程度减少对芯片的损害键合丝和键合过程键合丝和键合过程 Bonding Wire and Bonding Process 线轴表面清洁、尺寸精确，线轴表面清洁、尺寸精确，好的放线性能好的放线性能成弧规则、均匀、稳定，成弧规则、均匀、稳定，足够的强度足够的强度 成球尺寸、硬度合适，表面圆滑，成球尺寸、硬度合适，表面圆滑，尽可能减少氧化和污染尽可能减少氧化和污染EFOEFO表面清洁，间隙正确稳定，表面清洁，间隙正确稳定，电流、时间合适，兼顾合电流、时间合适，兼顾合适的成球和效率适的成球和效率键合丝要求尺寸精确，清洁，无键合丝要求尺寸精确，清洁，无污染，无损伤污染，无损伤Bonding wire must be in right size,clean,and no damage.The spool must be clean,in right,and have good despooling propertyClean surface,stable gap,right current and time to FABThe loop must be equal,uniform,stable and hard enoughGood bonding performance,no virtual welding,do little harm to chips.Right FAB and hardness,smoothing,little oxide and contamination.尺寸合适，表面光滑，没有污染尺寸合适，表面光滑，没有污染损伤，尽可能减少与线材的摩擦损伤，尽可能减少与线材的摩擦Capillary:in right size,clean,smoothing,no damage,low friction with wire.YesNoYesNo一诺一诺8物理性能参数物理性能参数(金银铜铝金银铜铝)Physical properties(Au,Ag,Cu,Al)项目项目 Item单位单位Unit金金Au银银Ag铜铜Cu铝铝Al铝硅铝硅 Al-1%Si钯钯Pd熔点 Melting Point106396210836606301555沸点Boiling Point28602163259527673167密度Density at 20g/19.3210.438.962.72.712.16电阻率Electrical Resistancecm2.31.621.72.72.812.16热传导率(at 20)Thermo-conductivityW/m.K29542039523619675线膨胀率Coefficients of expansion14.218.917.524.624.511.5杨氏模量Young ModulusKN/mm2788312870.565126刚性模量Rigidity modulus KN/mm22731452626.255YesNoYesNo一诺一诺9熔断电流对比熔断电流对比(1/2)Comparisons of fusing currents熔断电流数值的获得根据实验条件的不同会有略微的差异。熔断电流数值的获得根据实验条件的不同会有略微的差异。Slightly differences may exist due to different experiment conditions.YesNoYesNo一诺一诺10熔断电流长度：长度：1mm1mmI=Kd3/2I：Maximum current in Ampsd：Wire diameter in inchesK：Materials constant,熔断电流熔断电流计算公式计算公式直径熔断电流对比熔断电流对比(2/2)Comparisons of fusing currentsYesNoYesNo一诺一诺11金属间化合物增长对比金属间化合物增长对比Comparisons of IMC IMCIMC增长对比增长对比Time of diffusion layer formed to 10nm(200)Test ConditionBaking Temp.:175Baking Time:1000hrYesNoYesNo一诺一诺12键合丝使用成本比较（键合丝使用成本比较（1/2）Cost comparisons of different bonding wires项目项目金丝金丝铜丝铜丝镀钯铜丝镀钯铜丝银丝银丝价格非常高很低较高较高设备成本正常需要改设备需要改设备正常保护气体无混合气混合气建议N2成品率高很底较高比较高储存期限1年3个月6个月1年风险无很高很高无ItemsItemsAuAuCuCuPdCuPdCuAgAgPriceVery highlowRelatively highRelatively highEquipment costRegularNeed changeNeed changeRegularProtective gasNoneGas mixtureGas mixtureSuggest N2YieldHighVery lowRelatively highRelatively highShelf life1 year3 months6 months1 yearRiskNoneVery highVery highNoneYesNoYesNo一诺一诺13键合丝使用成本比较（键合丝使用成本比较（2/2）Cost comparisons of different bonding wires价格比较价格比较 Price comparisons:综合成本比较综合成本比较 Comprehensive cost comparisons:综合上述成本，银丝的价格略低于镀钯铜丝，高于铜丝大约综合上述成本，银丝的价格略低于镀钯铜丝，高于铜丝大约2倍，远低于金倍，远低于金丝。考虑到铜丝的控制风险，银丝为最佳选择。丝。考虑到铜丝的控制风险，银丝为最佳选择。Above all,the price of Ag wire is a little lower than Pd plating of Cu wire,2 times higher than Cu wire,and far lower than Au wire.In consideration of the control risk of Cu,Ag wire is chosen to be the best.YesNoYesNo一诺一诺14 Silver Bonding Wire-the worlds first 键合银丝键合银丝 世界首创世界首创广泛应用于发光管和部分分立器件及广泛应用于发光管和部分分立器件及IC。Widely used in LED and some TR、IC.（1 1）键合银丝）键合银丝 Ag Bonding Wire高纯原材料：高纯原材料：主要原材料（主要原材料（6N6N铜，铜，5N5N银，及合金）由美国一诺自制，现与山银，及合金）由美国一诺自制，现与山东国大捷克萨菲纳、招金精炼合作，运用电解区熔等高纯提纯工艺，保证东国大捷克萨菲纳、招金精炼合作，运用电解区熔等高纯提纯工艺，保证6N6N的高纯的高纯银原料的生产：银原料的生产：性能和质量的稳定性性能和质量的稳定性 较高的抗腐蚀和抗氧化性较高的抗腐蚀和抗氧化性杂质元素杂质元素ImpurityCuBiNiFeCaMgSeZnTe含量Content0.10.050.050.010.050.010.010.050.05High Purity Ag Raw Material：Main Materials(6NCu,5NAg,and Alloy)come from YesNo America.Ag raw material is guaranteed by using electrolytic zone melting purification method,and cooperated with Shandong Guodasafina Group and Zhaojin Group.Stability of performance and quality.Good corrosion resistance and oxidation resistance.YesNoYesNo一诺一诺15优点优点 Advantages较好的导电和导热性能较好的导电和导热性能 Good electric and thermal conductivity较好的抗腐蚀和抗氧化性能（与铜比较）较好的抗腐蚀和抗氧化性能（与铜比较）Good corrosion and oxidative resistance(Compared with Cu)仅需氮气保护，比较安全（与铜比较）仅需氮气保护，比较安全（与铜比较）N2 as protective gas only(Compared with Cu)硬度较低（铜比较）硬度较低（铜比较）Lower hardness(Compared with Cu)成本较低成本较低-金的金的1/5-6 Lower price-1/5-6 to Au缺点缺点 Disadvantages加工性能较差，制造成本较高加工性能较差，制造成本较高 Poor process performance and high manufacturing cost成本是铜的的成本是铜的的2-3倍倍 cost 2-3times higher than Cu银丝的特点银丝的特点Features of Ag Bonding Wire挑战挑战 ChallengesIMC控制（控制（Ag 的电子迁移问题目前已经基本解决）的电子迁移问题目前已经基本解决）The control of IMC(The problem of electron transfer of Ag is basically resolved)YesNoYesNo一诺一诺16银丝机械性能参数银丝机械性能参数Mechanical properties of Ag bonding wire更多参数请登录我公司网站或咨询我公司服务人员。更多参数请登录我公司网站或咨询我公司服务人员。Please log in the website of our company or consult us to get more information.DiameterAg()(mil)YA99YA95YA88YA80YAB/L(gf)E/L(%)150.61.523428180.74567210200.8 5678210230.9 781011215251.0 9101213215301.2 13151617520331.3 17181920520381.5 21222425520502.0 36384042525YesNoYesNo一诺一诺17银丝和真球硬度银丝和真球硬度Ag Wire&FAB Hardness 标题YesNoYesNo一诺一诺18银丝的热影响区银丝的热影响区HAZ of Ag bonding wires弧高Loop height热影响区小于弧高，可以最大程度保证线弧的强度和稳定性。Ball NeckHeat affected zone The strength and stability of loop could be guaranteed when the height of HAZ is less than the loop.YesNoYesNo一诺一诺19银丝焊接性能银丝焊接性能 Welding performance of Ag bonding wire 实验条件实验条件 Experiment conditions0.8mil；高温；高温200储存，储存，0-300小时小时；检测速度：；检测速度：100um/sec；检测数量：；检测数量：50。0.8mil,storaged under 200 for 0-300 hours,detection speed:100um/sec,detection quality:50.Ball Shear TestBall Shear TestBond Pull TestBond Pull TestYesNoYesNo一诺一诺20银丝抗腐蚀性能银丝抗腐蚀性能Corrosion resistance of Ag bonding wire银会与氧缓慢反应生成氧化银（银会与氧缓慢反应生成氧化银（AgO和和Ag2O），是），是对光敏感的对光敏感的灰白色固灰白色固体，导电，体，导电，100 时分解为银和氧气，对键合基本没有影响。时分解为银和氧气，对键合基本没有影响。银在有氧的环境下易硫化（银在有氧的环境下易硫化（Ag+H2S+O2=Ag2S+H2O），硫化银呈灰），硫化银呈灰黑色，导电性较差，会影响焊接性能。黑色，导电性较差，会影响焊接性能。故银丝的键合时建议加氮气保护，隔离氧气，除此以外，银很稳定，一般故银丝的键合时建议加氮气保护，隔离氧气，除此以外，银很稳定，一般不会被其他离子腐蚀。不会被其他离子腐蚀。AgOAg2OSilver Ag2S试验条件：试验条件：0.1mol/L 硫化钠水溶液，硫化钠水溶液，0-200小时。小时。Experiment condition:0.1mol/L Na2S solution dipping for 0-200 hours.Ag oxides to be AgO and Ag2O,which is electrical conduction and will decompose into Ag and O2.This reaction do little harm to bonding.Ag also can react into Ag2S（Ag+H2S+O2=Ag2S+H2O）,which has poor electrical conduction and affect bonding seriously.Above all,the bonding process of Ag should be protected by N2.YesNoYesNo一诺一诺21银丝应用范围银丝应用范围Applications of Ag bonding wiresYA99YA95YA88YA80低端LED低端TRLEDTRIC CARDQFNTSOPFlash Memo中高端封装LEDQFPTSSOPQFNDFNIC CARDMQFPPBGATQFPBGAFlash Memo中高端封装TQFPTSSOPPBGABGA高端封装键合银丝的发展将逐步走向以一种型号适应不同的封装形式。键合银丝的发展将逐步走向以一种型号适应不同的封装形式。Ag bonding wire with single type will gradually adapt to different packaging forms.YesNoYesNo一诺一诺22银丝的应用趋势银丝的应用趋势Ag Bonding Wire Application Trend 2011 2014 2016 2018 封封 装装 形形 式式随着键合银丝研究的深入，键合银丝将越来越适应小型化、薄型化封装形式发展，随着键合银丝研究的深入，键合银丝将越来越适应小型化、薄型化封装形式发展，是未来取代昂贵金丝的最佳产品。是未来取代昂贵金丝的最佳产品。With the deepening research on Ag bonding wire,it will more and more adapt to the miniaturization and thin packaging forms.It will replace Au which is expensive in the future.Packaging formsYesNoYesNo一诺一诺23银丝专利及银丝专利及RoHS证书证书Our patent and RoHS certificate of Ag bonding wireYesNoYesNo一诺一诺24为什么选择铜丝为什么选择铜丝(1/3)Why Cu wire 由上可见，铜原料的价格相对金来说基本上可以忽略不记，但由于加工的成本较由上可见，铜原料的价格相对金来说基本上可以忽略不记，但由于加工的成本较大，实际从线材价格来对比的话铜丝仅为金丝的大，实际从线材价格来对比的话铜丝仅为金丝的10%左右。左右。Its clear that the price of Cu can be ignored compared with Au.But due to its high processing cost,the actual price of Cu wire is only about 10%of the Au wire.Price of Cu in 5 yearsPrice of Au in 5 years（2 2）键合铜丝）键合铜丝 Cu Bonding WireYesNoYesNo一诺一诺25为什么选择铜丝为什么选择铜丝(2/3)Why Cu wireYesNoYesNo一诺一诺26为什么选择铜丝为什么选择铜丝(3/3)Why Cu wire熔断电流(Fusing current)1mmYesNoYesNo一诺一诺27铜丝的特性铜丝的特性 优点优点（1/2)Features of Cu bonding wire-advantage更高的机械性能保证了线弧的稳定，不易形成塌丝或者歪丝。更高的机械性能保证了线弧的稳定，不易形成塌丝或者歪丝。Higher mechanical guarantees the stability of the loop.Sagging and sweeping are not easily formed.YesNoYesNo一诺一诺28金属间化合物（金属间化合物（IMC）生长缓慢，提高可靠性。）生长缓慢，提高可靠性。The reliability are enhanced because of the slow growth of IMC.铜丝的特性铜丝的特性 优点优点（2/2)Features of Cu bonding wire-advantageYesNoYesNo一诺一诺291.易氧化，储存及键合期间需采用专门设备及气体进行保护。易氧化，储存及键合期间需采用专门设备及气体进行保护。The oxidation of Cu,special equipments and gases are needed to protect it during bonding and storage.2.硬度比较大，容易对芯片造成伤害。硬度比较大，容易对芯片造成伤害。The pad is likely to be damaged because of the high hardness of Cu.3.焊接球下面的铝层厚度的不规则减少焊接球下面的铝层厚度的不规则减少,可能会导致铜铝金属间渗透的可可能会导致铜铝金属间渗透的可靠性失效。靠性失效。Al extrusion happens when Cu is bonding to softer Al by supersonic,which lead to short circuit and irregular reduce of Al thickness.4.硅弹坑和焊接垫下开裂。硅弹坑和焊接垫下开裂。Two failure modes:Si cratering and Pad cracking.铜丝的特性铜丝的特性 缺点缺点 Features of Cu bonding wire-disadvantageYesNoYesNo一诺一诺30柔性铜丝专利及柔性铜丝专利及RoHS证书证书 Our patents and RoHS certificate of soft Cu bonding wire针对上述铜丝的缺陷，我公司专门研发一款柔性铜丝来解决上述问题，并且取针对上述铜丝的缺陷，我公司专门研发一款柔性铜丝来解决上述问题，并且取得了国家发明专利。得了国家发明专利。Aimed at the disadvantages of Cu,a soft Cu wire was developed to resolve the problems and got invention patent by our company.YesNoYesNo一诺一诺31YesNo铜丝的机械性能铜丝的机械性能(1/2)Mechanical properties of Cu bonding wireDiameterCu()(mil)YC1,YC3YC2,YC4YCB/L(gf)E/L(%)180.734510200.8 56510230.9 89816251.0 1012816301.2 15181020331.3 18201020351.4 20221020381.5 23251020502.0 38421525l YC1 5N高纯铜丝，硬度低，较好的成球性能高纯铜丝，硬度低，较好的成球性能 High purity(5N)，low hardness，good FAB l YC2 3N通用铜丝，有一定的抗疲劳性通用铜丝，有一定的抗疲劳性 Good fatigue resistance l YC3 4N柔性铜丝，硬度较低柔性铜丝，硬度较低 Flexible Cu wire,low hardnessl YC4 2N抗氧化铜丝，同时楔形焊接性能较好抗氧化铜丝，同时楔形焊接性能较好 Anti-oxidation Cu wire,good wedge welding performance YesNoYesNo一诺一诺32上图：中心线上有明显压痕的焊球照片；上图：中心线上有明显压痕的焊球照片；下图：铜和金球焊随位置函数变化的硬度与下图：铜和金球焊随位置函数变化的硬度与FAB硬硬度的对比图。度的对比图。上图：上图：FEM模拟显示了一个焊球内部的应力；模拟显示了一个焊球内部的应力；下图：下图：Cu球焊的横截面（球焊的横截面（4hrs at 250）说明了）说明了Al衬垫衬垫的变形和薄的的变形和薄的Cu-Al相。相。YesNo铜丝的机械性能铜丝的机械性能(2/2)Mechanical properties of Cu bonding wireYesNoYesNo一诺一诺33Test ConditionWire dia.:1.0 MilM/C:Mitutoyo MVK-H3Test Load:3 grLoading Time:10 sec键合铜丝的硬度键合铜丝的硬度 Hardness of Cu bonding wire YesNoYesNo一诺一诺34Etching Condition-.Etchant:10 HNO3+10 D.I.Water)-.Etching Method:Fuming Method-Etching Time:1 10 sec.键合铜丝的热影响区键合铜丝的热影响区 HAZ of Cu bonding wire YesNoYesNo一诺一诺35键合铜丝的电气性能键合铜丝的电气性能 Electrical property of Cu bonding wire YesNoYesNo一诺一诺36注：所有键合丝的挑断力和剪切力测试注：所有键合丝的挑断力和剪切力测试数据见规格书。数据见规格书。Remark:All of wire pull&ball shear data is meet Spec.键合铜丝的焊接性能键合铜丝的焊接性能 Welding property of Cu bonding wire YesNoYesNo一诺一诺37铜丝目前最大的问题是氧化，尤其是储存及键合期间的保护非常重要。铜丝目前最大的问题是氧化，尤其是储存及键合期间的保护非常重要。The largest problem is the oxidation of Cu,so the protect during storage and bonding are especially important.Copper Cu2OCuOCu4O(SO4)(OH)6 Cu5O(SO4)(OH)3 CuCl2 CuNO3铜丝与金丝和银丝最大的不同在于铜丝易氧化，焊线过程中因放电即基铜丝与金丝和银丝最大的不同在于铜丝易氧化，焊线过程中因放电即基板加热，会形成氧化铜，造成板加热，会形成氧化铜，造成FABFAB球型不圆，易形成虚焊，且氧化铜很容易球型不圆，易形成虚焊，且氧化铜很容易与其他酸根离子反应。与其他酸根离子反应。Cu will oxide into CuO during bonding,which can made bad FAB and lead to NSOP or NSOL.CuO also can react with other acid radical ions easily.1000:4CuO2Cu2O+O2键合铜丝的抗腐蚀性能键合铜丝的抗腐蚀性能 Corrosion resistance of Cu bonding wire YesNoYesNo一诺一诺38 2009 2011 2014 2018 封封 装装 形形 式式键合铜丝的应用键合铜丝的应用 Applications of Cu bonding wirePackage TypeYearYesNoYesNo一诺一诺39为什么选择铝丝为什么选择铝丝 Why Al wire适用于楔形焊接封装，主要应用于汽车电子，大功率传感器，大功率器件等。适用于楔形焊接封装，主要应用于汽车电子，大功率传感器，大功率器件等。Al wire is suitable to wedge welding,which including automotive electronics,Al wire is suitable to wedge welding,which including automotive electronics,high-power sensor and some high-power-device.high-power sensor and some high-power-device.高可靠性高可靠性 High reliability 单一金属间键合，无单一金属间键合，无IMC问题问题 Without problems of IMC 很好的热稳定性很好的热稳定性 Good thermal stability 良好的抗腐蚀性能良好的抗腐蚀性能 Good corrosion resistance propertyAl wire Al wire Al pad Al pad （3 3）键合铝丝）键合铝丝 Al Bonding WireYesNoYesNo一诺一诺40铝丝的特点铝丝的特点(1/2)Features of Al bonding wire l YL1 高纯型铝丝高纯型铝丝(5N)YL1 high purity Al(5N)良好的成弧性能和稳定性，并有一定的抗腐蚀性能。良好的成弧性能和稳定性，并有一定的抗腐蚀性能。Good loop shape,stability and corrosion resistance property.适用于大部分要求较高的功率器件，适用范围广，价格相对适中。适用于大部分要求较高的功率器件，适用范围广，价格相对适中。It is suitable to most of the high-power-device with a moderate cost.l YL2 抗腐蚀型铝丝抗腐蚀型铝丝(4N)YL2 corrosion resistance Al(4N)在在YL1的基础上添加一定的合金，比较好的抗腐蚀性能的基础上添加一定的合金，比较好的抗腐蚀性能。Adding some alloys on the basis of YL1,which results in good corrosion resistance property.适用于有要求抗腐蚀的大部分功率器件，适用范围较广，价格相对略高。适用于有要求抗腐蚀的大部分功率器件，适用范围较广，价格相对略高。It is suitable to some devices that need to resistant to corrosion,and the price is comparatively a little higher.l YL3 普通型铝丝普通型铝丝(4N)YL3 ordinary Al适用于大部分无特殊要求的功率器件，适用范围较广，价格相对较低。适用于大部分无特殊要求的功率器件，适用范围较广，价格相对较低。Its suitable to most devices without special requirements at the same time low price.烟台一诺电子材料有限公司YesNoYesNo一诺一诺41Diameterummil12555150561756720068250610300612375715500820Elongation%YL1520520103010301030103010301030Breaking Loadg5090701101051601502202003003004204606608501100Fusing currentAmp5.26.78.110.315.119.627.742.4Elongation%YL2520520103010301030103010301030Breaking Loadg601108016012021018028025038038055055090011001600Fusing currentAmp5.06.57.910.114.919.427.542.2Elongation%YL35-205-2010-3010-3010-3010-3010-3010-30Breaking Loadg601108016012021018028025038038055055090011001600Fusing currentAmp4.86.37.69.914.819.227.241.8铝丝的特点铝丝的特点(2/2)Features of Al bonding wire YesNoYesNo一诺一诺42（二）靶材、蒸发材（二）靶材、蒸发材 Target and Evaporation靶材、蒸发材工艺流程靶材、蒸发材工艺流程Target and evaporation materials process flowRefiningPolishingCast modelingCastingCleaningDryingPackingProductsRod castingDrawingAnnealingOr notAnnealingSpoolingYesNoYesNo一诺一诺43l Kinds of evaporation materials:5N high purity or alloys of Au/Ag/Cu/Al grain/section/wire/block.蒸发材产品种类：金、银、铜、铝蒸发材产品种类：金、银、铜、铝5N高纯高纯/合金蒸发粒、蒸发段、蒸发线、合金蒸发粒、蒸发段、蒸发线、蒸发块。蒸发块。Section Section 蒸发段蒸发段Wire Wire 蒸发线蒸发线Au target Au target 金靶金靶Al target Al target 铝靶铝靶Grain Grain 蒸发粒蒸发粒Block Block 蒸发块蒸发块l Target:5N high purity or alloys of Au/Ag/Cu/Al target 靶材：金、银、铜、铝靶材：金、银、铜、铝5N5N高纯高纯/合金靶材合金靶材